工作中常用中英文.doc

斯比泰电子（深圳）有限公司*英语篇*工作中常用中英文（含缩略语）一、一般英语：1. 采购- purchase2. 材料- material3. 评估- evaluation4. 供应商- supplier / vendor5. 总经理- general manager ( GM )6. 进料incoming7. 质量quality8. 控制- control9. 装箱单- packing list10. 数量- quantity11. 型号- model12. 描述- description13. 制表/发布- issue14. 表格- form15. 文件- document16. 制造商- manufacturer17. 接收- accept (Acc.)18. 拒收- reject (Rej.)19. 项目- item20. 个- piece（Pc.）21. 放宽- waive22. 缺陷- defect23. 合格- pass24. 不合格- not good ( NG )25. 日期- date26. 生产线- production line / line27. 备注- remark28. 仓库- store29. 产品- product30. 静电敏感元件- static sensitive device (SSD)31. 静电释放- electricity static discharge (ESD)32. 进- in33. 出- out34. 结余- balance35. 备注- remark36. 参数- reference37. 单位- UM38. 标签- label39. 打印- print40. 计划- plan41. 图表- chart42. 质量- quality43. 传真- fax44. 新加坡- Singapore45. 检查- check46. 箱子- case / carton47. 盒子- box48. 系列号- serial number ( S/N ）49. 部门- department (Dept.)50. 客户- customer51. 通知- notice52. 清单- bill53. 平均- average54. 文控中心- document control center ( DCC )55. 计划员- planner56. 流程图- flow chart57. 工艺- instruction58. 校准- calibration59. 校验- verify60. 设备- equipment61. 培训- training62. 不良品- failed product63. 预计- forecast64. 安全- safety65. 程序- program / procedure66. 图纸- drawing67. 过程- process68. 隔离- separate / insulate69. 返工- rework70. 合同- contract71. 准时- just in time ( JIT )72. 准时交付- delivery on time73. 运输- shipment / transportation74. 方式- method75. 费用- cost76. 报废- scrap二、专业英语：物资部常用中英文缩略语：1. CO: Customer Order 客户订单2. MO: Manufacture Order 生产订单3. PO: Purchase Order 采购订单4. DO: Delivery Order 发货单5. FCST: Forecast Order 预测订单6. MRPII: Manufacturing Resource Planning MRPII系统7. FS: Fourth Shift 四班系统8. PMC: Planner Material control 计划员9. MRB： Material Review Board 物料评审会议 10.RTV: Return To Vendor 退还供应商11.ECN： Engineering Change Notice 工程更改通知 12.GRN: Goods Received Note 材料入库单13.PWO： Production Work Order 配发单14.MRF ： Materials Requisition Form 材料申请单15.AMRF： Non-Prod/Aux Materials Requisition Form辅助物料申请单16.RTS ： Return To Store 回库单17.SCRAP： Scrap Form 报废单18.RCN: Result Changed Note 进检结果更改单19.ITN: Inventory Transfer Note 移库单20.INV： Invoice 发票21.DN： Debit Note 借方凭单22.CN： Credit Note 贷方凭单23.PCBA: Printed Circle Board Assembly 印刷线路板组装，24.IQC： Incoming Quality Control 进料品质控制25.IPQC: In Process Quality Control 在线品质检查26.SMT： Surface Mounting Technology 表面贴装技术27.AI： Automatic Insertion 自动插装28.WIP: Work In Process 在制品29.PCB: Printed Circle Board 印刷电路板30.PCBA: Printed Circle Board Assembly 印刷电路板组装31.P/A: PCB Assembly 电子产品装配32.ICT： Internal Circle Test 内部线路测试33.FCT： Function Test 功能测试34.BOM: Bill of Material 材料清单35.AVL: Approved Vendor List 合格供应商清单36.DOC: Declaration of Conformity 符合性声明，由供方向客户或相关方提供。37.SOC： Statement of Conformity 符合性公告，由供方向公众提供。38.VCAR： Vendor Corrective Action Report 供应商改善措施报告39.QA: Quality Assurance 品质保证40.ESD: Electrostatic Discharge 静电放电41.4M1E： Man/ Machine/Material/Method/ Environment 人/机器/原材料/作业方法/环境42.FMEA: Failure Mode Effect Analysis 失效模式与后果分析43.CP: Control Plan 控制计划44.ISO: International Standardization Organization 国际标准化组织45.EDX-720: Energy Dispersive X- Ray Spectrometer， 能量色散型X荧光光谱仪。品质部常用中英文缩略语1.4M1E：Man/ Machine/Material/Method/ Environment 人/机器/原材料/作业方法/环境2.AI: Automatic Insertion 自动插装3.AQL: Accepted Quality Level 品质充收水准4.AOI: Auto Optics Inspection 自动光学检测5.AOQ：Average Outgoing Quality 平均出货水平6.APQP：Advanced Product Quality Planning产品先期策划7.AVL: Approved Vendor List 合格供应商清单8.BOM: Bill of Material 材料清单9.BS: Bottom Side 下表面（通常指PCBA的焊点面）10.CP: Control Plan 控制计划11.COC: Certificate of Conformance 一致性声明12.CAR: Corrective Action Report 改善措施报告13.CPK: Capability Process Index 制程能力指数14.CTQ: Critical to Quality 关键质量特性15.DMAIC：Define-Measure-Analyse-Improve-Control 定义-测量-分析-改善-控制（6Sigma分析的5个步骤）16.DOC: Declaration of Conformity 符合性声明17.DPMO: Defect Per Million Opportunity 百万缺陷机会数18.DOE: Design of Experiment 实验设计19.ECN: Engineering Change Notice 工程更攺通知20.EMC: Electro Magnetic Compatibility 电磁兼容21.ESD: Electrostatic Discharge 静电放电22.FMEA: Failure Mode Effect Analysis 失效模式与后果分析23.F/A: Final （Product） Assembly 最终装配（总装）24.FQC: Final Quality Check 最终品质检查25.FCT: Function Test 功能测试26.FAAR: First Article Approved Report 首件检验报告27.FIFO：First In First Out 先入先出28.ISO: International Standardization Organization 国际标准化组织29.IQC: Incoming Quality Check 进料品质检查30.IPQC: In Process Quality Control 在线品质检查31.ICT: Internal Circle Test 内部线路测试32.LSL: Lower Specification Limit 规格下限33.LCL: Lower Control Limit 控制下限34.MRB: Material Review Board 物料评审会议35.MSA: Measure System Analysis 测量系统分析36.MSDS：Material Safety Data Sheet原材料安全资料37.MTBF: Mean Time Between Failures 平均无故障时间38.ODM: Original Design & Manufacture 委托设计与制造39.OEM: Original Equipment Manufacture 委托代工40.OQA: Outgoing Quality Assurance 出货品质保证41.ORT: Outgoing Reliability Test 出货产品可靠性测试42.P/A: PCB Assembly 电子产品装配43.PDCA: Plan-Do-Check-Action 计划-做-检查-规范（一种管理模式）44.PCB: Printed Circle Board 印刷电路板45.PCBA: Printed Circle Board Assembly 印刷电路板组装46.PPAP：Production Part Approval Process 生产件批准程序47.QA: Quality Assurance 品质保证48.QCC: Quality Control Circle 品管圈49.QE: Quality Engineering 品质工程50.QFD: Quality Function Deployment 质量功能展开51.QMS：Quality Management System 品质管理体系52.R&R: Repeatability & Reproducibility （测量系统中）重复性和再现性53.SCAR: Supplier Corrective Action Report 供应商改善措施报告54.SMT: Surface Mounting Technology 表面贴装技术55.SQE: Supplier Quality Engineering 供应商品质工程56.SOC: Statement of Conformity 符合性公告57.SPC: Statistical Process Control 统计过程控制58.TQM: Total Quality Management 全面质量管理59.TPM: Total Production Management 全面生产管理60.TS: Top Side 上表面（通常指PCBA的元件面）61.USL: Upper Specification Limit 规格上限62.UCL: Upper Control Limit 控制上限63.VCAR: Vendor Corrective Action Report 供应商改善措施报告64.WIP: Work In Process 在制品65.WI: Working Instruction 操作指引SMT常用中英文缩略语1.表面贴装技术- surface mounting technology ( SMT )2.品质计划- quality plan ( QP )3.制造工程师- manufacturing engineer ( ME )4.文控中心- document control center ( DCC )5.组织结构图- organization chart6.流程图- flow chart 7.产品品质先期策划- advanced product quality planning ( APQP )8.潜在失效模式及影响分析- potential failure model and effect analysis ( PFMEA)9.控制计划- control plan ( CP )10.工艺- instruction11.出货检查标准- outgoing quality inspection instruction12.工程更改通知- engineering change notice (ECN)13.锡膏- solder paste14.红胶- glue15.印锡- paste printing16.在线测试- in circle test ( ICT )17.设备- equipment18.培训- training19.不良品- failed product20.预计- forecast21.生产订单- manufacturing order ( MO )22.印锡机- printing machine23.贴片机- mounter24.烘炉- oven25.自动插机- automatic insert ( AI )26.制程中- work in process ( WIP )27.百万分之- PPM28.钢网：stencil29.表面贴装设备：surface mount device (SMD)30.飞达：feeder31.印刷线路板: print circuit board （PCB）32.BS面：bottom side (BS)33.TS面: top side (TS)34.自动插件：automatic insertion (AI)35.单列直插：single line package (SIP)36.双列直插：dual line package (DIP)37.小型封装晶体管：small outlet transistor (SOT)38.电阻：resistor (R)39.电容：capacitor （C）40.二极管: diode (D)41.三极管: transistor (T)42.电感: inductor (L)43.晶振: crystal44.连接器: connector45.开关: switch46. 球形触点阵列: ball grid array (BGA)47.四侧引脚扁平封装: quad flat package (QFP)48.板上芯片封装: chip on board (COB)生产部常用中英文缩略语PCB组装1. 插机- insert / insertion2.外观检查- visual inspection3. 波峰焊接- wave soldering4. 过波峰模板- panel5. 分板- depanning6. 补焊- touch up7. 清洗- clearing8. 点胶- gluing9.功能测试- function test10.自动测试仪- automatic test machine ( ATM )11.高压测试- hi-pot test12.绝缘测试- insulation test13.老化- burn-in14.包装- packing15.客户样品- golden sample / customer sample16.试生产- trial run17.临时样品- temporary sample18.功能测试- function test19.终检- final inspection20.试产报告- trial run report21.首件报告- first article approval report ( FAAR )22.在线品质控制- in process quality control ( IPQC ）23.可疑材料- suspect material24.纠正措施- corrective action25.预防措施- preventive action26.改善措施报告- corrective action report ( CAR )总装27.总装- final assembly28.超音波焊接机- supersonic welding machine29.基准- benchmark30.测量系统分析- measurement system analysis ( MSA )31.量具重复性和再现性- gauge repeatability & reproducibility ( GR&R32.灌胶：fill glue其它33.待检区： check-waiting zone34.周转箱：box turnover35.电阻：resistor (R)36.电容：capacitor （C）37.二极管: diode (D)38.三极管: transistor (T)39.电感: inductor (L)40.晶振: crystal41.连接器: connector42.开关: switch43.成品区：finished product zone44.项目组：item brigade45.工具：Tool facility46.工艺- instruction47.设备- equipment48.不良品- failed product49.生产订单- manufacturing order ( MO )50.不良品- failed product51.锡炉：stannum furnace52.报表：report forms53.宣传栏：announce coteME部常用中英文缩略语1.品质计划- quality plan ( QP )2.制造工程师- manufacturing engineer ( ME )3.项目工程师- project engineer (PE)4.文控中心- document control center ( DCC )5.组织结构图- organization chart6.流程图- flow chart 7.产品品质先期策划- advanced product quality planning ( APQP )8.潜在失效模式及影响分析- potential failure model and effect analysis ( PFMEA)9.控制计划- control plan ( CP )10.线路板总装-print circuit board assembly (PCBA)11.工艺- work instruction12.出货检查标准- outgoing quality inspection instruction12.工程更改通知- engineering change notice (ECN)13.临时工程更改通知- temporarily engineering change notice(TECN)14.设计更改通知- design engineering change notice(DECN)15.温度曲线-profile16.x-ray17.BGA 返修台18.锡膏- solder paste16.红胶- glue17.印锡- paste printing18.在线测试- in circle test ( ICT )17.设备- equipment18.培训- training19.不良品- failed product20.预计- forecast21.生产订单- manufacturing order ( MO )22.印锡机- printing machine23.贴片机- mounter24.烘炉- oven25.自动插机- automatic insert ( AI )26.制程中- work in process ( WIP )27.百万分之- PPM产品技术部常用中英文缩略语1.charge 充电器2.transformer 变压器3.inductance 电感4.leakageinductance 漏感5.automatictestequipment 自动测试设备6.wrong component 错件7.resistor value deviation 阻值偏差8.component short with heat sink 元件与散热器短路9.leads no insert 管脚没插入10.component damaged 元件破损11.gold finger dirty 金手指脏12.gold finger with solder 金手指上锡13.short circuit 短路14.open circuit 开路15.copper pad peel off 跳铜皮16.component inverse 元件反17.test fixture 测试工装19.miss component 漏件20. void solder 虚焊21.solder ball& solder residue 锡珠和锡渣22.manufacture inverse 加工反23.open circuit in primary 初级断线24.secondary circuit short 次级短路25.wire of transformer break 变压器线断26.PWM Pulse Width Modulation 脉冲编码调制27.SPI Serial periphery interface 串行外围接口28.DAC Digital-to-Analog Converter 数模转换29.BGA(ball grid array) 球形触点陈列30.PCB Printed Circuit Board 印刷电路板31.ICT:in circuit test 在线电路测试32.AOI:automatism optics inspect 自动光学检测33.FCT;function test 功能测试34.MSA:measure system analyse 测量系统分析35.ATE:automatism test equipment 自动测试设备36.WM:Pulse Width Multiplier 脉冲宽度倍增器37.LCR测试仪:inductance capacitance resistance 电感、电容、电阻测试仪38.PED:product engineeringdepartment 产品技术部39.ADC:Analog-to-Digital Converter 模数转换器40.PEC:Precision Electronic Components 光电管、光电元件41.MOS管：Metal-Oxide Semiconductor 金属氧化物半导体42.IC:interchange 集成电路、指令计数器43.UDS:=Universal Data System 通用数据系统44.LED:light-emitting diode 发光二极管45.IMEI:IMEI(INTERNATIONAL MOBILE EQUIPMENT IDENTIFIER).国际移动设备识别码46.Mobile Phone 移动电话47.GSM： Global System for Mobile Communication 全球移动通信系统48.AFC(Automatic Frequency Control) 自动频率控制49.AGC(Automatic Gain Control) 自动增益控制50.AFT(Automatic Frequency Tune) 自动频率调谐51.CNR(C/N )(Carrier to Noise Ration) 载噪比52.ACI(Adjacent-Channel Interference) 邻频干扰53.DPX(Diplexer) 双工器54.FDMA(Frequency Division Multiple Access) 频分多址55.CDMA Code Division Multiple Access56.TDMA： Time Division Multiple Access 时分多址57.TCH： Traffic Channel 业务信道58.CCCH： Common Control Channel 公共控制信道59.BCCH： Broadcast Control Channel 广播控制信道60.SIM： Subscriber Identity Module 用户识别卡61.SMS： Short Message Service 短消息业务62.MMS: Multimedia Messaging Service中文译为多媒体信息服务，也称“彩信”63.PIN： Personal Identification Number 个人识别号码64.PHS Personal Handy-phone System 小灵通65.BT Board test 板测66.DL Download 下载67.PCM： Pulse Code Modulation 脉码调制68.ANT(Antenna) 天线69.GMSK：Gaussian Filtered Minimum Shift Frequency Keying 高斯滤波最小移频键控70.BER： Bit Error Rate 比特误码率71.打火： spark72.单片机： MCU73.模式： mode74.C总线： C-BUSHRD常用中英文缩略语人力资源管理:(Human Resource Management ,HRM)人力资源经理:( human resource manager)高级管理人员:(executive)职业:(profession)道德标准:(ethics)操作工:(operative employees)专家:(specialist)人力资源认证协会:(the Human Resource Certification Institute,HRCI)外部环境:(external environment)内部环境:(internal environment)政策:(policy)企业文化:(corporate culture)目标:(mission)股东:(shareholders)非正式组织:(informal organization)跨国公司:(multinational corporation, MNC)管理多样性:(managing diversity)工作:(job) 职位:(posting)工作分析:(job analysis)工作说明:(job description)工作规范:(job specification)工作分析计划表:(job analysis schedule, JAS)职位分析问卷调查法:(Management Position Description Questionnaire, MPDQ)行政秘书:(executive secretary)地区服务经理助理:(assistant district service manager)人力资源计划:(Human Resource Planning, HRP)战略规划:(strategic planning)长期趋势:(long term trend)要求预测:(requirement forecast)供给预测:(availability forecast)管理人力储备:(management inventory)裁减:(downsizing)人力资源信息系统:(Human Resource Information System, HRIS)招聘:(recruitment)员工申请表:(employee requisition)招聘方法:(recruitment methods)内部提升:(Promotion From Within ,PFW)工作公告:(job posting)广告:(advertising)职业介绍所:(employment agency)特殊事件:(special events)实习:(internship)选择:(selection)选择率:(selection rate)简历:(resume)标准化:(standardization)有效性:(validity)客观性:(objectivity)规范:(norm)录用分数线:(cutoff score)准确度:(aiming)业务知识测试:(job knowledge tests)求职面试:(employment interview)非结构化面试:(unstructured interview)结构化面试:(structured interview)小组面试:(group interview)职业兴趣测试:(vocational interest tests)会议型面试:(board interview)组织变化与人力资源开发人力资源开发:(Human Resource Development ,HRD)培训:(training)开发:(development)定位:(orientation)训练:(coaching)辅导:(mentoring)经营管理策略:(business games)案例研究:(case study)会议方法:(conference method)角色扮演:(role playing)工作轮换:(job rotating)在职培训:(on-the-job training ,OJT)媒介:(media)企业文化与组织发展企业文化:(corporate culture)组织发展:(organization development, OD)调查反馈:(survey feedback)质量圈:(quality circles)目标管理:(management by objective, MBO)全面质量管理:(Total Quality Management, TQM)团队建设:(team building)职业计划与发展职业:(career)职业计划:(career planning)职业道路:(career path)职业发展:(career development)自我评价:(self-assessment)职业动机:(career anchors)绩效评价绩效评价:(Performance Appraisal ,PA)小组评价:(group appraisal)业绩评定表:(rating scales method)关键事件法:(critical incident method)排列法:(ranking method)平行比较法:(paired comparison)硬性分布法:(forced distribution method)晕圈错误:(halo error)宽松:(leniency)严格:(strictness)反馈:(-degree feedback)叙述法:(essay method)集中趋势:(central tendency)报酬与福利报酬:(compensation)直接经济报酬:(direct financial compensation)间接经济报酬:(indirect financial compensation)非经济报酬:(no financial compensation)公平:(equity)外部公平:(external equity)内部公平:(internal equity)员工公平:(employee equity)小组公平:(team equity)工资水平领先者:(pay leaders)现行工资率:(going rate)工资水平居后者:(pay followers)劳动力市场:(labor market)工作评价:(job evaluation)排列法:(rankin