经管营销IC代工生产管理培训PPT课件.ppt

MPC教育资料 1 什么是PC2 什么是MPC3 MPC需要关注和解决那些问题4 MPC专业词汇解释 2020 1 8 1 什么是PC PC就是productioncontrolPC是着眼在公司层面 根据销售订单以及生产线产能进行制定生产投入产出计划职责 产品的投入计划确保产品交货期 以及产出计划 确认制品MOVE情况以及提醒交货期会有延迟的产品执行客户需求的产品释放以及停滞等等 2020 1 8 2 什么是MPC MPC的客户是MPP MPP客户是PC 也就是说详细的完成PC所下达的任务 按生产计划检查 跟踪并准确及时报告生产流程中的问题 依据WIP 制品交期 设备负荷 制程时间限制以及在制品及设备的运行状况等因素调整实时调度系统的运行提高人员及设备利用率制品流通率的管理及有关数据的提供依据生产数据计算生产能力 2020 1 8 3 MPC需要解决哪些问题 Themissionofamanufacturingfab TosatisfycustomerandmaximizethecapacityandwaferoutputWhatcustomerwants OntimedeliveryGoodwaferqualityLowunitpriceMFGindicesindicatestheperformanceofaFab 2020 1 8 4 KEY 2020 1 8 5 C T 英文全名 Cycle Time中文全名 运转周期定义 theaverageleadtimewhichonewafermustpayforrunning waiting holding andtimeonbankfromwaferstarttoQC Inspection计算方式 Cycle Time Waferi Wafer Output计算频率 单位 天指标意义 1 考量FAB的硅片的运转速度2 衡量FAB的run货效率 2020 1 8 6 TR 英文全名 TurnRatioT R中文全名 在制品周转率定义 Averagenumberofstageswhichonewafercanpenetrateinoneday每片硅片平均每天跑过的Stage数计算方式 StageMove WIPWIP BOH EOH 2计算频率 单位 每日指标意义 1 由TurnRatio可知硅片处理速度是否正常2 此指标为StageMove与WIP的比值 因此由此可以得知目前的WIP量是否合理 在制品积压成本是否过高 以及生产流程是否顺畅 2020 1 8 7 Move 英文全名 WaferMoves中文全名 硅片移动量定义 一片硅片完成一个Stage称为一个StageMove 一片硅片完成一个Step称为StepMove计算方式 由Fab中实际操作的硅片数加总得到计算频率 单位 每日或每月指标意义 1 由各个移动量可以了解目前硅片之处理速度是否正常2 由移动量预估硅片是否赶上速度3 籍此衡量各区域之生产绩效 2020 1 8 8 WIP 英文全名 广义上Workinprocess在半导体行业 WaferInProcess中文全名 在制品定义 从硅片投入到硅片产出 Fab内各站积压了相当数量的硅片 统称为Fab内的WIP计算方式 堆积硅片求和计算频率 单位 每日或每月 片指标意义 衡量一个FAB的生产能力的标志 PWIP ProductionWIPEngWIP EngineeringWIP 2020 1 8 9 Yield 英文全名 Yield中文全名 良率定义 产出硅片良品数量与投入生产之硅片数量的比率计算方式 硅片产出量 硅片产出量 硅片报废量 计算频率 单位 每月 指标意义 由良率可以显示所生产硅片之制造环境 制程 规格方面之综合表现 故其为最重要的品质指标 2020 1 8 10 英文全名 Hold中文全名 硅片搁置定义 在生产过程中因为控制或者工程原因暂时无法进行生产的硅片数量计算方式 所有holdWIP数量相加计算频率 单位 每日或每月片指标意义 1 衡量工厂生产稳定度2 衡量因工程原因对生产周期的影响 Hold 2020 1 8 11 Terminate Scrap 英文全名 Scrap中文全名 报废硅片定义 totalwaferscrapquantityinFAB计算方式 所有Scrap求和计算频率 单位 每日或每月片指标意义 1 衡量制程稳定度2 衡量一个FAB的生产良率3 EngWIPterminate用以衡量工厂研发或者保持制程稳定而用掉的cost 2020 1 8 12 Rework 英文全名 Rework中文全名 返工定义 TotalreworkcountinFablithoarea计算方式 所有rework数目累加计算频率 单位 每日或每月片指标意义 1 衡量Litho制程稳定度2 衡量litho无效movement数量 2020 1 8 13 WS 英文全名 Waferstart中文全名 硅片下线定义 Totalwaferstartcount计算方式 所有下线数目累加计算频率 单位 每日或每月片指标意义 衡量工厂生产规模 2020 1 8 14 WO 英文全名 Waferout中文全名 硅片出货定义 Totalwaferoutcount计算方式 所有出货数目累加计算频率 单位 每日或每月片指标意义 衡量工厂生产规模 2020 1 8 15 MFGindicesintroduction Whatisa Golden Fab 2020 1 8 16 MPC需要关注哪些问题 WaferMovesWaferStepMoveLocationMoveWaferInProcess WIP EndOnHand BeginOnHandTurnRatio T R DailyEquipmentUPTimeWaferPerHour WPH EquipmentEfficiencyUtilization ManufacturingEfficiencyCycleTimePerMaskLayer C T WaferOutLineYieldWaferAcceptanceTest WAT FabYield 2020 1 8 17 WaferMoves DefinitionWaferstepMove 1wafermovingfromoneSteptoanother WaferstageMove 1wafermovingfromonestagetoanother MethodofCalculationSumofactualfaborsectionwaferstagemovestogivefabwafersmove andsectionwafersmoverespectively PurposeofWaferMoveIndexFrompresentamountofwafermoves wecandetermineifthepresentproductionrateofthesectionorfabisnormal Useasameasurementindextocompareshifttoshiftorfabtofab 2020 1 8 18 SampleCalculations Scenario1 Particularlotof25waferscompleted4stagesonthe1stofFebruary2000 Scenario2 Particularlotof25waferscompleted70stagesinthemonthofJanuary2000 Scenario1Moves Onthe1stofFebruary2000 WaferMove 25X4 100Scenario2Moves InthemonthofJanuary2000 WaferMove 25x70 1750 2020 1 8 19 WaferStepMove DefinitionWaferSTEPMove 1wafermovingfromonesteptoanother Note 1Stepisequivalentto1equipmentmoveor1metrologystep MethodofCalculationSumofactualfab sectionorequipmentwaferSTEPmovestogivefabwafersmove sectionwafersmoveandequipmentwafermovesrespectively PurposeofWaferStepMoveIndexFrompresentamountofwafermoves wecandetermineifthepresentproductionrateoftheequipmentorsectionisnormal Useasameasurementindextocompareequipmenttoequipmentorperformanceofoperatortooperator 2020 1 8 20 SampleCalculations Scenario1 Particularlotof25waferscompleted6stepsonthe1stofFebruary2000 Scenario1StepMoves Onthe1stofFebruary2000 WaferMove 25X6 150StepMoves Assumingtheaveragenumberofstepsperstages 3steps stage StageMoveson1stofFebruary2000 150 3 50StageMoves 2020 1 8 21 LocationMove DefinitionTotalnumberofWaferStageMove 1wafermovingfromonestagetoanother MethodofCalculationSumofstagemoveswithinprocessarea CVD PVD PHOTO etc PurposeofLocationMoveIndexFrompresentamountofwafermoves wecandetermineifthepresentproductionrateoftheprocessareaisnormal Useasameasurementindextocomparedaytodayormonthtomonthperformanceofaprocessarea 2020 1 8 22 SampleCalculations Scenario1 WaferMoveintheCVDareaforIMD 1200 PETEOS 800 SACVD 500 HDP 400andBPTEOS 400 Scenario1LocatonMoves CVDLocationMoves 1 200 800 500 400 400 3 000Moves 2020 1 8 23 WaferInProcess WIP DefinitionNumberofwafersperstep stage section shiftorfab ierunning wait hold etc MethodofCalculationSumofallwafersinthatstep stage section shiftorfabrespectively PurposeofWorkInProcessIndexFrompresentamountofwafermoves wecandetermineifthepresentcapacityoftheequipment sectionorfabissufficient Useasanindicatortopossiblebottleneckinthefab MovementoftheWIPindexwillreflectthestabilityoftheequipment processandatthesametimethecapability constraints oftheequipment 2020 1 8 24 EndOnHand BeginOnHand 1 DefinitionEOH WIPperstage sectionorshiftorfabattheENDofashift BOH WIPperstage sectionorshiftorfabattheSTARTofashift MethodofCalculationSumofallwafersinthatstage section shiftorfabrespectivelyattheendorstartofashift 2020 1 8 25 EndOnHand BeginOnHand 2 PurposeofEOHandBOHIndexBycomparingtheEOHandtheBOHofashift wecanhaveafeeloftheperformanceoftheequipmentandtheshift AnincreaseinWIPfromtheBOHtoEOHmayindicatepoorequipmentstatusinthedifferentfabsorsectionsorshifts orpoordispatchingskilloftheshiftiftheequipmentstatusisnormal 2020 1 8 26 TurnRatio T R Daily 1 DefinitionNumberofstagescompletedbyeachwaferperday MethodofCalculationT R TotalStageMovesPerDay AverageWIP Note AverageWIPperday BOH EOH 2 2020 1 8 27 TurnRatio T R Daily 2 PurposeofTurnRatioIndexFromtheT Rwecandetermineifthecurrentwaferproductionrateisnormalortooslow AsthisindicatortakestheratioofStagemovestoAverageWIP thereforewecoulddetermineif CurrentWIPisreasonablerelativetobenchmarkedquantity IsthecostofWIP inventory relativetothecostofequipmentlosttimeproportional CurrentproductionflowissmoothwithnobottleneckIsthestagetargetrealistic 2020 1 8 28 SampleCalculations Scenario1 Onthe1stofFebruary2000 TotalStageMove CVD is10 000 theBOHWIPonthatdayis5 500andEOHWIPonthatdayis6 000 Scenario1T R Onthe1stofFebruary2000 T R 10 000 5 500 6 000 2 1 74 Note AnaverageT Rof2 1to2 2isreasonableforafab 2020 1 8 29 2020 1 8 30 EquipmentUPTime 1 DefinitionTimewhenequipmentisfit for production MethodofCalculationUPTime RunTime LostTime TestTime BackupTimePurposeofUPTimeIndexFromtheUPTimewecandeterminethetotalamountoftimeavailableforproduction TheratioofLostTimetoAvailableTimeisusedtodeterminetheroomforimprovementintermsofutilizationforaparticularequipment 2020 1 8 31 EquipmentUPTime 2 2020 1 8 32 SampleCalculations Scenario1 InFebruary2000 RunTime 700hours LostTime 100hours TestTime 100hours andBackupTime 50hoursforWCVDequipment Scenario1WCVDAvailableTime InFebruary2000 AvailTime 950hoursLostRate 100 950 10 5 2020 1 8 33 WaferPerHour WPH 1 DefinitionNumberofwafersprocessedperhour MethodofCalculationWPH WaferMove RunTimePurposeofWaferPerHour WPH Index 1 FromthepresentequipmentWPHwecandeterminewhetherthecurrentequipmentrateofproductiontotalisnormal TheequipmentWPHcanbeusedtoderivetheequipmentcapacity whichcanbeinturnusedtodetermineifthetotalcapacityforaparticularcapabilityissufficient 2020 1 8 34 WaferPerHour WPH 2 PurposeofWaferPerHour WPH Index 2 TheratioofthecurrentequipmentWPHtotheTheoretical WPH T WPH canbeusedtodetermineiftheequipmentispresentlyoperatingintheoptimumconditions WPHindexcanalsobeusedtomeasureindividualMAorshiftperformance especiallysoinmanualoperations RelativeWPHbetweenequipmentrunningthesamerecipecanbeusedtodeterminetheindividualequipment 2020 1 8 35 SampleCalculations 1 Scenario1 On1stofFebruary2000 RunTime 20hoursandWaferMoves 1700wafersforWCVDequipment Scenario2 ThesameequipmentforthemonthofFebruary2000 RunTime 600hoursandthetotalWaferMoves 54 000wafers Scenario3 RunTime 12hours WaferMovesbyOperatorA 500andOperatorB 400onthesameequipment 2020 1 8 36 SampleCalculations 2 Scenario1WCVDWPH On1stofFebruary2000 WPH 1 700 20 85wafers hourScenario2WCVDWPH InthemonthofFebruary2000 WPH 54 000 600 90wafers hourTherefore wecansaythatthecurrentequipmentrateofproductionislowerthantheaverageforthewholemonth Scenario3 OperatorAhasaWPH 500 12 41 67wafers hourOperatorBhasaWPH 400 12 33 33wafers hour 2020 1 8 37 EquipmentEfficiency 1 DefinitionPercentageoftheactualwafermovesperhourtotheidealwafermovesperhour MethodofCalculationEquipmentEfficiency TotalActualWaferMoves TotalRunTime AverageIdealWPH X100 Note Asthe IdealWPH isdependentontherecipeofthelotprocessed the AverageIdealWPH isthesumofthe IdealWPH multiplebytheproportionofthenumberoflots duringtheperiodoftime withthatrecipedividedbytheTotalRunTime 2020 1 8 38 EquipmentEfficiency 2 PurposeofEquipmentEfficiencyIndexTheequipmentefficiencyindexshowhowmuchdeviationfromtheoptimumperformanceistheequipmentbeingoperatedin Determineifthereisanyweakness abnormalitywithanequipmentcapabilities fabWIPprofile processcapability Baseontheefficiencyoftheequipment weareabletolookintomethodstooptimizetheequipmentandincreasethethroughputoftheequipment 2020 1 8 39 Examples ExampleofsomesituationsthatLOWERStheequipmentefficiency Only1SMIFArmisinworkingcondition Takesalongertimethanusualtoachieverequiredvacuumfortheloadlock equipmentproblem SMIFArmunabletounloadautomaticallythereforestatusremains Run RunTimeincreaseswithoutincreaseinoutput evenwhenwafersalreadycompleteditsprocess Thebottleneckchamberoftheequipmentisdownandthereforetheimpactdeductedislessthantheactualimpact Timerequireforachievingvacuumisthesameforalotwith25wafersandonewithonly1wafer Thereforethetimeperwaferisincreasesignificantlywhenlotwithonly1waferisprocessed 2020 1 8 40 SampleCalculations Scenario1 On1stofFebruary2000 shiftA WCVDequipment WaferMoves 375wafers RunTime 12hours Thelotsconsistof5lotsofrecipeAand10lotsofrecipeB RecipeA IdealWPH 30 RecipeB IdealWPH 45 Scenario1Efficiency AverageIdeaWPH 5 15X30 10 15X45 40waferperhourEquipmentEfficiency 375 12 40 X100 78 13 2020 1 8 41 Utilization 1 DefinitionTheamountoftimedemandedofanequipmentforproduction versusthetotalamountoftimeavailable Demand CapacityMethodofCalculationUtilization RunTime TestTime BackUpTime TotalTimeX100 2020 1 8 42 Utilization 2 PurposeofUtilizationIndexForaUtilizationIndexgreaterthan100 forcertainequipment wecansafelysaythatthepresentequipmentcapacityisnotsufficientforthepresentdemand Iftheutilizationislowforcertainequipment buttheWIPishigh itcouldbeduetotheequipmentnothavingthecapabilitytoruntherecipesrequiredbytheWIP 2020 1 8 43 SampleCalculations Scenario1 Inaday 24hours WCVDequipmenthasRunTime 12hoursandBackUpTime 6hours Scenario1Utilization Utilization 12 6 24X100 75 2020 1 8 44 ManufacturingEfficiency 1 DefinitionPercentageoftheequipmentavailabletimeusedforproduction RunTime TestTimeandBackUpTime overthetotalequipmentavailabletime RunTime TestTime LostTimeandBackUpTime MethodofCalculationManufacturingEfficiency Utilization Availability X100 2020 1 8 45 ManufacturingEfficiency 2 PurposeofManufacturingEfficiencyIndexThemanufacturingefficiencyindexcomparestheperformanceoftheoperatorunderahighWIPsituation Thehighertheefficiencyindexthebettertheperformance OneoftheindicatorsforlowWIPforspecificequipment sectionorfab AhighWIPandlowmanufacturingefficiencyindexcouldbeduetoequipmentconstraintanditscapabilities 2020 1 8 46 SampleCalculations Scenario1 OperatorA sequipmenthasRunTime 8hours TestTime 1hour BackUpTime 0andLostTime 3hours Scenario1OperatorA ManufacturingEfficiency 8 1 0 8 1 0 3 X100 75 2020 1 8 47 CycleTimePerMaskLayer C T 1 DefinitionAveragenumberofdaysrequiredforprocessingbetweentwophotostages 1layers onephotostagetoanother Aseachindividuallayerisdefinedbyaphotostage thereforethenumberoflayersofaproductisequivalenttothenumberofphotostages Note For0 25microntechnology thereisanaverageof25layers MethodofCalculationC T TimewhichwaferpassestheQCtest Timeatwaferstart Numberofphotostages 2020 1 8 48 CycleTimePerMaskLayer C T 2 PurposeofWaferMoveIndexBaseonthenumberoflayersoftheproduct andtheuseoftheaveragecycletimeofthefab weareabletodeterminetheaveragetimerequiredfortheproductfromstarttocompletion Thereby enablingustodecideonthedatefortheproductwaferstartinordertomeetthedeliveryschedule 2020 1 8 49 SampleCalculations Scenario1 Aparticularproducthas16layers andthetimerequiredfromwaferstarttillQCtestingis40days Scenario1C Tperlayer C Tperlayer 40 16 2 5daysperlayer 2020 1 8 50 WaferOut DefinitionTotalquantityofwafersthatpassestheQCtest MethodofCalculationProductionController PC willannouncedtheofficialWaferOutquantity PurposeofWaferOutIndexTheWaferOutIndexwillindicatethefaboutputstatus 2020 1 8 51 SampleCalculations Scenario1 InthemonthofFebruary2000 quantityofwafersthatpassesQCtest 15 000wafers Scenario1WaferOut InthemonthofFebruary2000WaferOut 15 000wafers 2020 1 8 52 LineYield DefinitionPercentageofwafersproducedbythefabpriortoWAT MethodofCalculationLineYield QuantityofWaferProduced QuantityofWaferProduced QuantityofWaferScrappedintheProductionProcess QuantityofWaferProduced QuantityofRawWaferUsedforProduction PurposeofLineYieldIndexTheLineYieldreflectsthequalityofthemanu