PCB板材FR-4和铝基技术参数.doc

铝基板技术参数 产品简介PRODUCTS INTRODUCTION 产品类型Class型号Type特性简要描述Features铝基覆铜板GM-AL系列Aluminum SubstrateCopper Clad LaminateGM-AL SeriiesAL-M-01铝基、铜箔、FR4玻纤布，Tg 130 -170Aluminum substrdteand copper foil,FR4 fiber glassTg130-170AL-H-02铝基、铜箔、无玻纤 （Laird）,热传导率3.0w/n.k.。Aluminum substrateand copper foil ,no-fiberglass,thermal conductivity(Laird)3.0w/m.kAL-H-03铝基、铜箔、无玻纤 （NRK）,热传导率2.0w/n.k.。Aluminum substrateand copper foil ,no-fiberglass,thermal conductivity(NRK)2.0w/m.kAL-H-04铝基、铜箔、无玻纤 ,耐热350 10min 、介绍常数4.2Aluminum substrate and copper foil ,no-fiberglass,enduring10min at 350, dielectric constant4.2AL-H-05铝基、铜箔、无玻纤 (Bergquist) 热传导率2.0w/n.k.。Aluminum ,coperfoil,no-fiberglass (Bergquist)thermalconductivity 2.0w/m.k特种覆铜版GM-CU系列Special Series CopperClad Laminate GM-CUCU-M-01覆厚铜箔 （4 oz10oz） 板，大电流。大功率电路。Thick copper cladlaminate(40z100z),super-current,Super-power circuit.特點：用途:良好得散熱性 LED照明電路優良的尺寸穩定性 厚膜混合集成電路良好的機械加工性 電源電路電磁波的屏蔽性 固态繼電器優良的性價比Features: Applications:Excellentthermalconductivity LEDlighting.Excellentdimensionalstability Thickfilmhybridintegratedcircuits.Excllentmachinability PowersuppiyExcellentelectromagneticshielding.SolidrelayHighcostperformance 性能指标性能指标PERFORMANCE項目Iten實驗條件Testcondition單位Units典型值AL-M-01AL-H-02AH-H-3AL-H-4AL-H-5熱傳導率ThermalConductivityAW/m.k1.0322.52剝離強度PeelStrengthA熱應力後AfterthermalstressN/mm1.51.00.91.31.51.51.00.91.31.5熱應力ThermalStress288不分層、不起泡No-delimitation,No-blisteringS150S150S120S10min150S表面電阻SurfaceResistanceC-96/35/90E-24/125M體積電阻率VolumeResistanceC-96/35/90E-24/125M.cm電氣強度ElectricalStrengthAKV/mm3030303030燃燒性FlameabilityUL94v-0v-0v-0v-0v-0TgA130-170105130130130吸水率MoisturAbsorptionD-24/23$0.10.030.030.030.03CT1IEC6012V200250600600600FR-4技术参数1层数1-12 层2最大加工面积449*599mm 18*243最小板厚4 层 0.40mm 16mil6 层 1.00mm 40mil8 层 1.20mm 48mil10 层 1.60mm 60mil4最小板厚0.10mm 4mil5最小间距0.10mm 4mil6最小孔径0.30mm 12mil7孔壁铜厚0.025mm 1mil8金属化孔径公差0.10mm 4mil9非金属化也径公差0.05mm 2mil10孔位公差0.05mm 2mil11外型尺寸公差0.15mm 6mil12最小阻焊桥0.1mm 4mil13扭曲和弯曲1.5%14绝缘电阻