Intel主板设立波峰炉温度曲线操作指示.doc

WORK INSTRUCTION作 业 指 导 书DOC. NO. / 文件编号: FIPEI-ITL-020REVISION / 版本号:03PRODUCT / 产品: Intel MB PAGE/页数: 13 Of 13TITLE / 标题: Establishing wave soldering profile operation instruction Intel主板设立波峰炉温度曲线操作指示 WORK INSTRUCTION作 业 指 导 书DOC. No. / 文件编号:FIPEI-ITL-020REV./ 版本号:03PRODUCT/ 产品:Intel MBTITLE / 标题: Establishing wave soldering profile operation instruction Intel主板设立波峰炉温度曲线操作指示 PAGE/页数 1 OF 13REVISION HISTORY / 版本记录REVISION 版本CHANGE DESCRIPTION 修改内容ISSUER发布者RELEASE DATE发行日期010203First releaseUpdate test profile processUpdate some record formMing.LiSiming.LiaoSiming.LiaoMay.29.2004July.27.2004Aug.25.2004REMARK备注Distribute hardcopy to QA & MBU&EEAPPROVALDEPARTMENTNAMETITLE部门名字职位PESiming.LiaoEngineerQADili CaoEngineerMBUXiangchun. LiangSupervisorEEYonggan YanEngineerDMP-001-F2 . 011.0 Objective/目的Define a general guideline to establish a wave soldering profile for Intel mother board, and need to long-term monitor the wave soldering parameters and regularly measurement /为Intel主板设立波峰炉温度曲线规定一般的指 引. 并对波峰炉的参数进行长期监控, 定期测量.2.0 Scope: This indication is only for Intel project. 适用范围：本程序仅适合于Intel项目使用。3.0 Responsibility/职责 Process engineer will be responsible for the establishment of the wave soldering profile base on design of experiment or solder, flux and electric material manufacture recommendation. PE&EE need to long-term monitor the wave soldering parameters and regularly measurement /工艺工程师负责建立根据所设计的实验或锡条, 松香以及有关电子零件制造商的规格说明而设立波峰波峰温度曲线.PE&EE并且对波峰炉的参数进行长期监控, 定期测量.4.0 Equipment/仪器具1) Datapag temperature meter / Datapag测量仪: Use datapag to measure wave solder preheat, peak temperature, exiting oven temperature/用datapag 温度测量仪来测量波峰炉的预热, 峰值温度以及出炉温度.2) Quartz Glass Plate/ 石英玻璃盘 Use Quartz Glass Plate to check contact area/length, immersion depth, parallelism, dwell time these points per day. 用石英玻璃盘每天来测量波峰的接触面积/长度, 浸锡深度, 接触面平行度, 浸锡时间.3) Wave solder optimizer/波峰优化仪: Use wave solder optimizer to check contact area/length, immersion depth, parallelism, dwell time these points per month用波峰优化仪每月来测量波峰的接触面积/长度, 浸锡深度, 接触面平行度, 浸锡时间. 4) Populated PCBA panel/组装好零件的PCBA板 5) High temperature solder wire (QQ-S-571) / 高温锡线(QQ-S-571) Its function is mainly used for thermal conductibility. /它的作用主要是热传导作用. 6) SMT-adhesive(PD945) /SMT热固化胶水. Its function is mainly used for fixing TC. /它的作用主要是固定热电偶线.5.0 Thermocouples Configurations/热电偶的配置5.1 10 set thermocouples will be configured on populated PCBA. Eight sets of thermal couple should be affixed on the top side of the populated PCBA surface with High temperature solder wire and two at the bottom surface. /用10条热电偶布置在Intel 主板上测量温度. 将其中8条热电偶用高温锡线焊接在组装好的PCBA板面上,而另外的两条就粘在底面上.5.2 Thermocouple location affixed on PCBA bottom side/粘贴在PCBA底部的热电偶的位置For the two thermocouples affixed on the bottom side, one thermocouple affixed with epoxy protruding out about 2.5mm from PCBA bottom side crossing the hole in PCB. Another thermocouple aligned with the PCB bottom surface crossing hole in PCB, and affixed with adhesive at the bottom side of PCB/ 对于两条贴在板底的热电偶, 其中一条穿过PCB上的孔, 从板底面伸出大约2.5 mm, 然后用热固化胶水固定. 另一条热电偶, 同样穿过PCB上的另一孔, 顶端与PCB的底面平齐, 在板的底部用热固化胶水固定.5.3 Thermocouple location affixed on PCBA top side/粘贴在PCBA 上部的热电偶的位置In order to effectively monitor the over all thermal distribution across the PCBA panel inside the wave soldering oven, try your best to distribute thermal couples on different location(direction), under this condition, now define the thermocouple configuration priority sequence as following/为了确保有效地监控所有在波峰炉里的PCBA板的受热情况, 将热电偶尽可能均匀分布在板的各个不同方位, 在此前提下现将热电偶的分配位置优先次序规定如下1) Solder ball joint of BGA/BGA/锡球处2) Solder ball joint of CSP/CSP锡球处3) Solder joint of component size greater than 0.5” x 0.5”. QFP, IC, Integrated circuit module./元件的尺寸大于0.5” x 0.5”的QFP, IC和完整的电路模板的焊脚处.4) Solder joint of odd shape component which will absorb great amount of heat, such as shield, connector or bigger capacitor/吸收了大量热量如防护罩, 连接器或大的电容等大而不固定形状的元件的焊脚处.5) Solder joint on high density area./高密度区的焊脚处6) Solder joint of chip component such as 1608,0608,0805, 0402 etc芯片元件例如1608,0608,0805,0402等的焊脚处.7) PCB pad or solder mask surface /PCB的焊盘上或绿油表面6.0 Base on clause 5 and the heat capacity on different points of PCBA and customer requirement, We define the testing points of this product. 根据第5点及从PCBA板面各部分热容量分布的角度考虑和客户的要求，定义本产品的测试点。 元件位置图表Model 产品型号Necessary Testpoint 必须测试点Reference Testpoint 参考测试点LacrosseU5E1-C, U5E1(SURFACE), U5E1(BALL), J2F1,J2E1-E, U8A1, EU7H1-E,HS(PIN),L7H2,U5C1NAYorktownSKU D4T socket 1,T socket 2,U5D1-E, U5D1-C,U7A1,U8G1,C8B4,U1H1, C2B1(PTH),C6G2(PTH)NA Note/注意: 1.The necessary testpoint is required to tested at any situation. 必须测试点是每次任何原因作温度测试时都必须要测到的. 2.Reference testpoint is required when run new product and we want to know the temp. at some location. 参考测试点是指刚做新产品时PE或客户需要了解某元件或某点的受热情况而定的点.7.0 Verify Machine Set-up by wave solder optimiser,and set the machine(Vectra 450/F) parameters. / 用波峰优化仪确认机器的设立,并对机器(Vectra 450/F)一些参数的设定。7.1 Before sample board is put in wave soldering machine. Engineer must sure the below item had been set-up correctly. 在用样品板在波峰焊接机里进行前,工程师必须确保以下几项已经正确的设立好:1) flux coverage/松香的复盖2) wave shape/波峰的形状3) wave turbulence/波峰的波动4) levelling of the conveyor/传送带的水平5) preheater effectiveness/预热的效果6) conveyor speed/传送带的速度 7.2 The following is the machine some setting parameters and setting specification. /下面是机器的一些设置参数和设置 规范。 7.2.1 The general coming air pressure is 8.0 bar/总的进气压力为8.0 bar. 7.2.2 The contact length checked with wave soldering optimizer should be about 4.28.75 cm.(Note: the wave height is more higher, the contact area/length is biger/longer. /用波峰优化仪测得的接触长度应为: 4.28.75 cm.(注意：波峰高度越高，则接触面积/长度就越大/越长。)7.2.3 The shape parallelism of the contact area should be within: 0.2 seconds/接触面积的形状的平行度应保持在0.2 秒之内. 7.2.4 The immersion depth should be within 1.8-2.1 mm/浸锡深度应保持在1.8-2.1 mm之间.7.2.5 Lead clearance: 8.01mm /链条和锡池间的距离: 8.01mm 7.2.6 The flux spray pressure setting : 100+/-5 PSI/松香喷射压力设置为100+/-5 PSI. 7.2.7 The flux flow rate: 4810%/松香流量: 4810% 7.2.8 Photocell to spray head distance: 17.5inch/感应器到松香喷嘴的距离: 17.5 英寸. 7.2.9 Traverse speed: 91 inch/min/松香喷嘴移动速度: 91英寸/分钟.8.0 Testing and Engineering Sample board preparation/测试和工程样品板的准备8.1 Selection location and component base on clause 6. Solder thermal couples head onto a populated PCBA panel with high temperature solder wire and fixed TC on the surface of PCBA with adhesive. /根据第6条所选择位置和元件, 用高温锡线把热电偶头焊接在组装好的PCBA板上并用热固化胶水将热点偶线粘好在PCBA板面上.8.2 Check if TC locations in BGA are OK with X-Ray./用X射线检查其位置是否OK。8.3 Process engineer should record the affixed thermal couple location onto the “Component location diagram sheet”. So a replacement PCBA panel can be re-produce if the existing one is damaged./工艺工程师应该把热电偶所在位置记录在 “元件位置图表”.所以如果现有的板被损坏,另外一块替换的PCBA板就能再使用.8.4 For Intel MB, we must prepare one board for profile testing, and one board for engineering sample./ 对于Intel主板， 我们必须准备一块测试炉温profile板，一块工程样品板。8.5 Engineering Sample Board. /工程样板8.5.1 To engineering sample making ,Please refer above description. / 工程样品板的制作可参考以上所述.8.5.2 工程样品板定义如下: Engineering sample/工程样板: The board used to establish the initial thermal profile is kept as engineering sample. And after the initial thermal profile was set up, it will not to be used to measure traditional profile except changing to a new setting. /用于设定初始加热曲线图的板子作为工程样板保留。这块工程样板在初始温度曲线设立好之后将不再测量常规温度曲线, 除非改变参数设置.Control PCBA/受控PCBA: This PCBA will used for daily temperature and after oven repair verification/受控 PCBA 是用作日产温度测量和修理后确认之用.8.5.3 工程样板的控制 A new golden unit should be re-created when there is much changes occurred as following. /当发生重大变化时, 应该制 作新的标准样本.1) PCB revision change/PCB版本改变 2) Major components change which include shielding, BGA, CSP, QFP, large connector /主要元件包括面 盖,BGA,CSP,QFP和大的连接器等改变3) Components change of over 20 SMT components per unit. /每块板超过20个SMT元件改变8.5.4 Engineering sample PCBA Storage /工程样板的保存 Engineer should keep the engineering sample PCBA and control sample PCBA, and stick a label which record “model and date” on board for future temperature verification. At the same time, Engineer should keep parallelism profile for it until the project is end of production. /工程师应该把标准PCBA样板和实际PCBA样 板分别保存,并在PCBA板上贴上标有机种和日期的标签,以便以后的温度确认.同时工程师应该保留它们对 应的样板温度曲线直到该项目结束. The initial thermal profile for Engineering sample will be kept as standard profile for reference in the future. 工程样板初始温度曲线将是以后温度曲线测试的标准曲线作为参考依据。9.0 Preparation before wave soldering/ 波峰焊前的准备9.1 Process engineer should check the glass transition temperature (Tg) of PCB material can or can not withstand the wave soldering process./工艺工程师应该检查PCB板的Tg温度能否抵受得的波峰焊接工艺.9.2 Process engineer should review BOM to check all components on the PCBA panel whether it can withstand the peak temperature or not. The peak temperature above melting point should refer to solder manufacture data sheet.工艺工程师应该在BOM检查PCBA板上的元件是否抵受得住高温.超过了熔点的最高温度应该参照焊接生产数据表. 9.3 Process engineer should check the recommended wave soldering temperature for the flux. .Please refer to clause 11 /工艺工程师应该检查松香波峰焊接温度. 请参考第11条.9.4 As per customer requirements, because there is already some SMT before wave soldering, in order to affect them, all areas where neednt solder with wave soldering must covered with fixture. /由于在波峰之前已经有了一些SMT 零件, 为了避免在过波峰时对它们的影响, 按照客户要求, 需要一个波峰焊接托盘去覆盖不需波峰焊接的部分.10.0 Establishing a profile/设立温度曲线 10.1 Place a populated PCBA panel together with the Datapag thermal recorder into the wave soldering machine. Once the Datapag profiler exist the wave soldering machine, engineer should then disconnect the cable and up load the recorded data onto the computer. A graphical plot of temperature against time can then be generated.把一块组装好的PCBA板与Datapag温度记录器放进波峰炉里,一旦Datapag测量仪出了波峰炉时, 工程师就应该断开电线,然后把记录好的数据上传到电脑上去.然后一张有温度和时间相对绘图就会生成.10.2 Profile Excursion/温度曲线的偏移 Any excursions outside of the process window from clause 11, an engineering report must be provided to support the excursion./任何温度曲线偏移超出条款11中所规定的范围，一定要提供一份工程报告来支持温度曲线偏移.10.2.1 PE Check if the thermocouple of test board is good and the wave solder ovens setting is correct. PE检查测试板的热电偶线是否良好及波峰炉温设定是否正确。10.2.2 PE use engineering sample board to test wave solder oven profile and see if it is OK. PE用工程样板去测试波峰炉温Profile看它是否OK。10.2.3 If the profile tested by engineering sample board is not OK, PE must use Demo board to calibrate wave solder oven to determine if a variation in the ovens thermal characteristics has occurred. 如果工程样板测试炉温的Profile不行,PE必须用Demo板去校验炉子以决定波峰炉是否发生温度特性变化。10.2.4 If the calibration result can not pass, PE inform EE to check if air flow controller is OK, and make maintenance for wave solder oven system. 如果校验结果不能通过，PE会知EE去检查抽风系统是否OK，并且对波峰炉子进行维修保养。10.2.5 After maintenance, PE calibrate wave solder oven again to verify if it problem is solved. 维修保养之后，PE再次去校验波峰炉子确认所在的问题是否解决了。10.2.6 If machine has been repaired, repair report was a must written by EE engineer also. 如果修理了机器, 则EE工程师必须写出机器修理报告.10.2.7 Process engineer check &approve the product profile that meet the specification per stated in the template. 每次测试完成后，PE工程师检查并确认产品温度曲线符合套板要求11.0 Specification for flux and its profile. / 助焊剂特性规格及其Profile 要求。 Flux model / 型号: LONCO ROSIN FLUX 800 (RF800)11.1 Preheat zone / 预热区 Supplier recommend the machine setting: Top side preheat temperature between 85C - 110C, Bottom side preheat temperature between 120C -145C. Top side Ramp rate low 2/second, Conveyor Angle is 5-8, Conveyor Speed is 1.2 1.8 meters/minute. This product top side Preheat Temperature between is 85100, Bottom side Preheat Temperature between is 120135, top side ramp rate low 1.8/second. Conveyor angle is 7.Conveyor speed is between 1.2-1.5 meters/minute(2-2.5cm/second) 供应商建议机器的设置参数为: 顶部预热温度要求在85110，底部预热温度要求在120C -145C,顶部升温斜率在小于2/秒，链条角度5-8,链条速度为1.2 - 1.8米/分.。本产品顶部预热温度为85100,底部预热温度要求是在120135,顶部升温斜率小于1.8/秒。链条角度为7,链条速度为1.2 - 1.5米/分(即2-2.5cm/秒)11.2 contact solder zone/浸锡区 Supplier recommend the machine setting: Dwell Time in the Solder is between 1.5 - 3.5 seconds, Solder Pot Temperature is between 235-260C. This product Dwell Time in the Solder is between 2.1 - 3.5 seconds, Solder Pot Temperature is between 235-250C. Dwell time=contact length/conveyor speed (contact length is between 4.28.75 cm)供应商建议机器的设置参数为: 浸锡时间为1.53.5秒,锡炉内锡温为235-260C。本产品浸锡时间为2.13.5秒,锡炉内锡温为235250C. 浸锡时间=浸锡长度/链条速度 (浸锡长度为4.28.75 cm)11.3 For Intel MB,TG temperature for exiting wave soldering oven 130. 对于Intel主板,出炉时TG 温度控制为130。11.4 The top side temperature must be low 160 degrees to prevent secondary reflow. 顶层的温度必须低于160度，以防止第二次回焊。 12.0 Conduct frequency / 测试频率12.1 Conduct various wave soldering ovens temperature Profile per shift according to the specified settings and ensure temperature profile to meet the profile template. 按照特定的参数设置，每班测试生产中每条波峰炉的温度曲线Profile，确保温度曲线符合套板的要求。12.2 MBU operator will check wave solder parameters hourly and fill checking record (FIPEI-ITL-020-F5.01). This record will be kept by MBU for six months /生产部操作员每小时检查波峰炉参数, 并填写检查报表 (FTPEI-ITL-020-F5.01)检查记录由MBU保存, 保存期为六个月.12.3 EE measures actual conveyor speed once and record every day(FIPEI-ITL-020-F2.01)/链条实际线速度, EE每天测量 一次并作记录 (FIPEI-ITL-020-F2.01).12.4 PE measures top peak temp., bottom preheat temp and solder pot peak temp, maximum ramp rate of topside, exit w/s temperature once per shift and fill record (FIPEI-ITL-020-F3.02) / 在PCBA板的板面最高温度,底部预热温度,零件脚在波峰中的波峰温度, 板面预热温度的斜率, 板面预热温度,出炉温度,PE每班测量一次并作记录 (FIPEI-ITL-020-F3.02).12.5 PE should measure dwell time, solder waves length, contact shape, parallelism and flux coverage with Quartz Glass Plate once per day and fill the record (FIPEI-007-F1 and FIPEI-ITL-020-F4.01)/PE用石英玻璃盘测量经过波峰的接 触长度, 形状, 平行度, 松香覆盖率及浸锡深度, 每天测量一次并作记录并观察 (FIPEI-007-F1 和 FIPEI-ITL-020-F4.01).12.6 PE should measure dwell time, solder waves length, contact shape, parallelism and flux coverage with wave solder optimizer once per month and fill the record (FIPEI-007-F1 and FIPEI-ITL-020-F4.01)/PE用波峰优化仪测量经过波峰的接触长度, 形状, 平行度, 松香覆盖率及浸锡深度, 每月测量一次并作记录并观察 (FIPEI-007-F1 和 FIPEI-ITL-020-F4.01).12.7 EE will measured Contact Area/Length and shape with Quartz Glass Plate after Solder Pot removal and replacement, and maintenance and fill the record (FIPEI-ITL-020-F6.01). 当锡槽被维修保养或更换后，EE将用石英玻璃盘对接触面积/长度和形状进行量测确认并作记录(FIPEI-ITL- 020-F6.01).12.8 EE will measured Contact Area/Length and shape with Quartz Glass Plate after the addition of solder or the adjustment of lead clearance and fill the record (FIPEI-ITL-020-F6.01). 当加锡或Lead被调整后，EE将用石英玻璃盘对接触面积/长度和形状进行量测确认并作记录(FIPEI-ITL-020- F6.01).12.9 Use Libra to check the quantity of flux applied to the board to ensure it adequate per day and fill the record ( FIPEI-ITL-020-F4.01). 每天用电子称去检查喷洒在PCB板上的松香的用量以确保它是适量的，并作记录（FIPEI-ITL-020-F4.01）。12.9.1 Use Libra to weigh up the bare PCB every time (define the weigh as A). 每次用电子称去称出空板的重量（把这重量定义为A）。12.9.2 Under normal condition except turning off the preheat and wave system, let the bare PCB go through wave soldering machine on conveyor . 除关闭预热及波峰系统外, 其他一切正常的条件下, 让空板随链条穿过波峰炉。12.9.3Then use Libra to weigh up the bare PCB again (define the weigh as B). 然后再用电子称去称出过炉后空板的重量（把这重量定义为B）。12.9.4 Calculate the quantity of flux。Following is the formula for calculating the quantity of flux: C (the quantity of flux)=B (the weigh of bare PCB across wave soldering)A (the weigh of bare PCB) 计算松香用量(把松香的用量定义为C)，下面是计算松香用量的公式： C （松香用量）=B （过炉后空板的重量）- A （空板重量）12.9.5 Clean the bare PCB, as to ensure next time nicety。 清洗空板,确保下次测量的准确。12.10 The solder level must keep around 1mm at the mark station on the ruler when turn off all waves, it must be checked after PM or add solder bar/当熄灭所有波峰时, 锡面必须保持在钢尺所做标识的1毫米的地方, 在保 养后和加锡条时须特别检查.12.11 When there is pilot production, need to conduct machine temper