LED英文.doc

1 backplane 背板2 Band gap voltage reference 带隙电压参考3 benchtop supply 工作台电源4 Block Diagram 方块图 5 Bode Plot 波特图6 Bootstrap 自举7 Bottom FET Bottom FET8 bucket capcitor 桶形电容9 chassis 机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 铁芯饱和13 crossover frequency 交叉频率14 current ripple 纹波电流15 Cycle by Cycle 逐周期16 cycle skipping 周期跳步17 Dead Time 死区时间18 DIE Temperature 核心温度19 Disable 非使能，无效，禁用，关断20 dominant pole 主极点21 Enable 使能，有效，启用22 ESD Rating ESD额定值23 Evaluation Board 评估板24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ; 超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。25 Failling edge 下降沿26 figure of merit 品质因数27 float charge voltage 浮充电压28 flyback power stage 反驰式功率级29 forward voltage drop 前向压降30 free-running 自由运行31 Freewheel diode 续流二极管32 Full load 满负载 33 gate drive 栅极驱动34 gate drive stage 栅极驱动级35 gerber plot Gerber 图36 ground plane 接地层37 Henry 电感单位：亨利38 Human Body Model 人体模式39 Hysteresis 滞回40 inrush current 涌入电流41 Inverting 反相42 jittery 抖动43 Junction 结点44 Kelvin connection 开尔文连接45 Lead Frame 引脚框架46 Lead Free 无铅47 level-shift 电平移动48 Line regulation 电源调整率49 load regulation 负载调整率50 Lot Number 批号51 Low Dropout 低压差52 Miller 密勒 53 node 节点54 Non-Inverting 非反相55 novel 新颖的56 off state 关断状态57 Operating supply voltage 电源工作电压58 out drive stage 输出驱动级59 Out of Phase 异相60 Part Number 产品型号61 pass transistor pass transistor62 P-channel MOSFET P沟道MOSFET63 Phase margin 相位裕度64 Phase Node 开关节点65 portable electronics 便携式电子设备66 power down 掉电67 Power Good 电源正常68 Power Groud 功率地69 Power Save Mode 节电模式70 Power up 上电71 pull down 下拉72 pull up 上拉73 Pulse by Pulse 逐脉冲（Pulse by Pulse）74 push pull converter 推挽转换器75 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二极管78 resistive divider 电阻分压器79 ringing 振 铃80 ripple current 纹波电流81 rising edge 上升沿82 sense resistor 检测电阻83 Sequenced Power Supplys 序列电源84 shoot-through 直通，同时导通85 stray inductances. 杂散电感86 sub-circuit 子电路87 substrate 基板88 Telecom 电信89 Thermal Information 热性能信息90 thermal slug 散热片91 Threshold 阈值92 timing resistor 振荡电阻93 Top FET Top FET94 Trace 线路，走线，引线95 Transfer function 传递函数96 Trip Point 跳变点97 turns ratio 匝数比，Np / Ns。（初级匝数/次级匝数）98 Under Voltage Lock Out (UVLO) 欠压锁定99 Voltage Reference 电压参考100 voltage-second product 伏秒积101 zero-pole frequency compensation 零极点频率补偿102 beat frequency 拍频103 one shots 单击电路104 scaling 缩放105 ESR 等效串联电阻 Page106 Ground 地电位107 trimmed bandgap 平衡带隙108 dropout voltage 压差109 large bulk capacitance 大容量电容110 circuit breaker 断路器111 charge pump 电荷泵112 overshoot 过冲1） 元件设备 三绕组变压器：three-column transformer ThrClnTrans双绕组变压器：double-column transformer DblClmnTrans电容器：Capacitor并联电容器：shunt capacitor电抗器：Reactor母线：Busbar输电线：TransmissionLine发电厂：power plant断路器：Breaker刀闸(隔离开关)：Isolator分接头：tap电动机：motor2） 状态参数 有功：active power无功：reactive power电流：current容量：capacity电压：voltage档位：tap position有功损耗：reactive loss无功损耗：active loss功率因数：power-factor功率：power功角：power-angle电压等级：voltage grade空载损耗：no-load loss铁损：iron loss铜损：copper loss空载电流：no-load current阻抗：impedance正序阻抗：positive sequence impedance负序阻抗：negative sequence impedance零序阻抗：zero sequence impedance电阻：resistor电抗：reactance电导：conductance电纳：susceptance无功负载：reactive load 或者QLoad有功负载: active load PLoad遥测：YC(telemetering)遥信：YX励磁电流(转子电流)：magnetizing current定子：stator功角：power-angle上限:upper limit下限：lower limit并列的：apposable高压: high voltage低压：low voltage中压：middle voltage电力系统 power system发电机 generator励磁 excitation励磁器 excitor电压 voltage电流 current母线 bus变压器 transformer升压变压器 step-up transformer高压侧 high side输电系统 power transmission system输电线 transmission line固定串联电容补偿fixed series capacitor compensation稳定 stability电压稳定 voltage stability功角稳定 angle stability暂态稳定 transient stability电厂 power plant能量输送 power transfer交流 AC装机容量 installed capacity电网 power system落点 drop point开关站 switch station双回同杆并架 double-circuit lines on the same tower变电站 transformer substation补偿度 degree of compensation高抗 high voltage shunt reactor无功补偿 reactive power compensation故障 fault调节 regulation裕度 magin三相故障 three phase fault故障切除时间 fault clearing time极限切除时间 critical clearing time切机 generator triping高顶值 high limited value强行励磁 reinforced excitation线路补偿器 LDC(line drop compensation机端 generator terminal静态 static (state)动态 dynamic (state)单机无穷大系统 one machine - infinity bus system机端电压控制 AVR电抗 reactance电阻 resistance功角 power angle有功（功率） active power无功（功率） reactive power功率因数 power factor无功电流 reactive current下降特性 droop characteristics斜率 slope额定 rating变比 ratio参考值 reference value电压互感器 PT分接头 tap下降率 droop rate仿真分析 simulation analysis传递函数 transfer function框图 block diagram受端 receive-side裕度 margin同步 synchronization失去同步 loss of synchronization阻尼 damping摇摆 swing保护断路器 circuit breaker电阻：resistance电抗：reactance阻抗：impedance电导：conductance电纳：susceptance导纳：admittance电感：inductance电容: capacitance印制电路printed circuit印制线路 printed wiring印制板 printed board印制板电路 printed circuit board印制线路板 printed wiring board印制元件 printed component印制接点 printed contact印制板装配 printed board assembly板 board刚性印制板 rigid printed board挠性印制电路 flexible printed circuit挠性印制线路 flexible printed wiring齐平印制板 flush printed board金属芯印制板 metal core printed board金属基印制板 metal base printed board多重布线印制板 mulit-wiring printed board塑电路板 molded circuit board散线印制板 discrete wiring board微线印制板 micro wire board积层印制板 buile-up printed board表面层合电路板 surface laminar circuit埋入凸块连印制板 B2it printed board载芯片板 chip on board埋电阻板 buried resistance board母板 mother board子板 daughter board背板 backplane裸板 bare board键盘板夹心板 copper-invar-copper board动态挠性板 dynamic flex board静态挠性板 static flex board可断拼板 break-away planel电缆 cable挠性扁平电缆 flexible flat cable (FFC)薄膜开关 membrane switch混合电路 hybrid circuit厚膜 thick film厚膜电路 thick film circuit薄膜 thin film薄膜混合电路 thin film hybrid circuit互连 interconnection导线 conductor trace line齐平导线 flush conductor传输线 transmission line跨交 crossover板边插头 edge-board contact增强板 stiffener基底 substrate基板面 real estate导线面 conductor side元件面 component side焊接面 solder side导电图形 conductive pattern非导电图形 non-conductive pattern基材 base material层压板 laminate覆金属箔基材 metal-clad bade material覆铜箔层压板 copper-clad laminate (CCL)复合层压板 composite laminate薄层压板 thin laminate基体材料 basis material预浸材料 prepreg粘结片 bonding sheet预浸粘结片 preimpregnated bonding sheer环氧玻璃基板 epoxy glass substrate预制内层覆箔板 mass lamination panel内层芯板 core material粘结层 bonding layer粘结膜 film adhesive无支撑胶粘剂膜 unsupported adhesive film覆盖层 cover layer (cover lay)增强板材 stiffener material铜箔面 copper-clad surface去铜箔面 foil removal surface层压板面 unclad laminate surface基膜面 base film surface胶粘剂面 adhesive face原始光洁面 plate finish粗面 matt finish剪切板 cut to size panel超薄型层压板 ultra thin laminateA阶树脂 A-stage resinB阶树脂 B-stage resinC阶树脂 C-stage resin环氧树脂 epoxy resin酚醛树脂 phenolic resin聚酯树脂 polyester resin聚酰亚胺树脂 polyimide resin双马来酰亚胺三嗪树脂 bismaleimide-triazine resin丙烯酸树脂 acrylic resin三聚氰胺甲醛树脂 melamine formaldehyde resin多官能环氧树脂 polyfunctional epoxy resin溴化环氧树脂 brominated epoxy resin环氧酚醛 epoxy novolac氟树脂 fluroresin硅树脂 silicone resin硅烷 silane聚合物 polymer无定形聚合物 amorphous polymer结晶现象 crystalline polamer双晶现象 dimorphism共聚物 copolymer合成树脂 synthetic热固性树脂 thermosetting resin Page热塑性树脂 thermoplastic resin感光性树脂 photosensitive resin环氧值 epoxy value双氰胺 dicyandiamide粘结剂 binder胶粘剂 adesive固化剂 curing agent阻燃剂 flame retardant遮光剂 opaquer增塑剂 plasticizers不饱和聚酯 unsatuiated polyester聚酯薄膜 polyester聚酰亚胺薄膜 polyimide film (PI)聚四氟乙烯 polytetrafluoetylene (PTFE)增强材料 reinforcing material折痕 crease云织 waviness鱼眼 fish eye毛圈长 feather length厚薄段 mark裂缝 split捻度 twist of yarn浸润剂含量 size content浸润剂残留量 size residue处理剂含量 finish level偶联剂 couplint agent断裂长 breaking length吸水高度 height of capillary rise湿强度保留率 wet strength retention白度 whitenness导电箔 conductive foil铜箔 copper foil压延铜箔 rolled copper foil光面 shiny sidenbsp;粗糙面 matte sidenbsp;处理面 treated sidenbsp;防锈处理 stain proofingnbsp;双面处理铜箔 double treated foilnbsp;模拟 simulation逻辑模拟 logic simulation电路模拟 circit simulation时序模拟 timing simulation模块化 modularization设计原点 design origin优化（设计） optimization (design)供设计优化坐标轴 predominant axis表格原点 table origin元件安置 component positioning比例因子 scaling factor扫描填充 scan filling矩形填充 rectangle filling填充域 region filling实体设计 physical design逻辑设计 logic design逻辑电路 logic circuit层次设计 hierarchical design自顶向下设计 top-down design自底向上设计 bottom-up design费用矩阵 cost metrix元件密度 component density自由度 degrees freedom出度 out going degree入度 incoming degree曼哈顿距离 manhatton distance欧几里德距离 euclidean distance网络 network阵列 array段 segment逻辑 logic逻辑设计自动化 logic design automation分线 separated time分层 separated layer定顺序 definite sequence导线（通道） conduction (tr