工业工程英语.doc

工业工程英语BS Brain Storming, Facilities Design and Planning,Material Flow System Analysis,Production Planning and Control,Human Engineering,Cost Control,Value Engineering,Work Assessment,Engineering Economics Analysis,Machine Interference,Single Minute Exchange of Dies (SMED) ,Fool-Proof ,Man ,Machine,Material ,Method,Environment ,Temperature(temp),Humidity,leaning curve,Time measurement ,Methods of time measurement,Shop floor observation ,Line Balancing ,Value,NO VALUE ,Incidental work(necessary),Waste,Takt Time,Transport Empty ,Grasp ,Move ,Disassemble , Use ,Assemble ,Release Load ,Inspect ,Search,Select, Play ,Pre-Position,Position ,Hold ,Rest ,Unavoidable Delay ,Avoidable Delay,E: Elimination,C :Combination,R: Re-arrangement,S :Simplification,PRA-Probabilistic Risk.Risk Priority Number (RPN).What .where .When .who .Why .how .delay.operation.inspection.transportation.storage.Color management .Quality Control Circle. (QCC).Activity-Base Management. (ABM).In-Process Quality Control. (IPQC).Incoming Quality Control. (IQC).International Organization for Standardization. (ISO).Predetermined Motion Time Standard .PTS .Methods-time-measurement .Work factor system .(WF).Modolar arrangement of pre-determind time standard MOD.Leveling .= westing .objective rating. synthetic leveling . Work Sampling .Motion time analysis. Business Process Reengineering (BPR).Enterprise Resource Planning ERP.Economic Order Quantity (EOQ).Flexible Manufacture System . (FMS).Finish or Final Quality Control.(FQC).In-Process Quality Control.(IPQC).Incoming Quality Control.(IQC).Just In Time. (JIT).Manufacturing Execution System. (MES).Master Production Scheduling. (MPS).Master Production Planning.Material Requirement Planning. (MRP).Manufacturing Resource Planning. (MRPII).Operation Scheduling.Flow shop.Optimized Production Technology.Supply Chain Management.(SCM).Statistic Process Control. (SPC).Total Production Management. (TPM).Total Quality Management.(TQM).Zero Defect Quality Control.: PDCA Cycle PDCA.continue Improvement.Project.Project Manager.Project Management.Project Plan.Process Improvement. WORK IN PROCESS .President .Visual management .bottleneck 瓶颈Layout .quality engineering .(QE).first article inspection .(FAI).first article assurance.(FAA).capability index.(CP).Quality Improvement Team .(QIT).Classification.(sorting, organization)-seiri.Regulation.(arrangement, tidiness)-seiton.Cleanliness.(sweeping, purity)-seiso.Conservation.(cleaning, cleanliness)-seiktsu.Culture.(discipline)-shitsuke.Save .Safety.Make-to-stock.(MTS).Make-to-order.(MTO).Assemble-to-order.(ATO).Flexible manufacturing system.Group technology.(GT).Concurrent engineering.(CE).Time compression technology.(TCT).Business process reengineering. (BPR).Agile manufacturing.(AM).Leap production. (LP).Intelligent manufacturing .(IM).Computer-aided-manufacturing.(CAM).Computer-aided-design.(CAD).Computer-aided-engineering. (CAE).Computer-aided-process planning.( CAPP).overall cost leadership.differentiation.Market focus.cost efficiency.quality.Dependability.Fduct date management.(PDM).Facility location.Fixed position cess layout.layout based on group technology.Job design.work measurement.Time study.Basic motion study.(BMS).Modolar arrangement of predetermind time standard.Human factor engineering.business plan.Fixed capacity.Adjustable duction rate.Inventory.Job-shop production.Bill of materials (BOM).Lead time.modular bill of materials.Maximum part-period gain. (MPG).distribution requirements planning.scheduling.sequencing.Dispatching.controlling.expediting.supply chain.Purchasing Management.Quick Response.JIT Purchasing.physical distribution.Materials ject.critical path method.optimistic time.Most likely time.pessimistic time.Mean time between failure.Mean time to repair.plan .do .check .action .level production.optimized production technology.(OPT)Overall Equipment Effectiveness.Operation Research.Service Sector.Operation Management.Operation System.World Class Manufacturing.Time-based Competition.Operation Flexibility.Product Development.Dependent Demand.Economic Order Lot .Safety Stock.Shortage Costs.ABC Classing Method A BC.Reorder Point.Holding Costs.Productivity Improvement Team.(PIT).Productivity Improvement Center.(PIC).工厂常用词汇Assembly& Loading Clips 组合上耳夹Break PAD 折 PADBreak PIN 折脚Paste Base 沾BASEapproved by: 核准Apr.(April) 四月assembly(assy)组合Aug.(August) 八月Base 底座bifilar 双线并绕Bobbin（BBN） 绕线管bottom 底部Brush Epoxy On Core 铁芯刷胶 Brush Epoxy On Loop 线圈刷胶 checked by: 审核 Choke电感 clip耳夹 close winding密绕 component 组件 condition条件 condition条件 copper铜箔 立式core铁芯 Curing烘烤 current 电流 CUT WIRE 裁线 Dec.(December) 十二月 defective product box不良品箱 deficient manufacturing procedure制程不良description: 说明 Design Failure Mode and Effect Analysis DFMEA设计Desk Topdip 浸入Direction 方向ECN Engineering Change Notice工程变更通知Electronic Magnetic In EMI 抗电磁干扰Enameled copper wire 漆包线Engineering Change Request 工程变更要求epoxy胶equipment/instrument设备Failure Mode and Effect Analysis FMEA失效模式与效应分析 Feb.(February) 二月fixture治具flow chart 流程窗体flux助焊剂FN: Factory Notice 工厂通知FN: Immediated change 立即变更Function test 测试gap 间隙,缝隙HI-POT安规测试 IEIndustrial Engineering 工业工程 impregnation浸泡inductance 电感ink油墨inspection(INSP)检查Insulating Tape绝缘胶布issued date: 发行日期item发料Jan.(January) 一月 Joint Quality Engineering (JQE)Jul.(July) 七月 Jun.(June) 六月Kapton Tape高温胶布layer 层line线Magnetic Components 磁性组件magnetic 磁性的Mar.(March) 三月 Margin Tape安胶marking印章materials物料May五月 ME: Mechanical Engineering 机械工程measurement测试mechanical dimension 外观尺寸MFG: manufacturing制造Mini-TowerModel: 机种 Not Deviate Measure 量平整度Nov.(November) 十一月 O/I Operation Instruction 作业指导书Oct.(October) 十月OEM:委托代工 (Original Equipment Manufacture)oven 烤箱P/n: part number 品名 P/R Pilot-Run试作验证pad 垫片PE ProductionProcess Engineering 制造工程/制程工程pin adjustment对脚PIN BENDING& WIRE TRIMMING 折弯钢片 pin 脚plastic 塑料,塑料poor processing 制程不良 Pre-solder