安费诺(禁止和限制物质要求).doc

Amphenol PCD Shenzhen Requirement of Substance Bans and Restrictions 禁止和限制物质要求 Doc. No.: WI-E-0001 Rev.: A0 Page: 5 of 5 主题 Subject: Requirement of Substance Bans and Restrictions禁止和限制物质要求 Eff. Date: Sep 4th, 2009This document is to specify bans and restrictions on substances and materials used in the manufacture of Amphenol PCD (Shenzhen) Co.,Ltds products, including product packaging or shipping materials, for its customers. This specification also bans the use of certain ozone depleting substances during the manufacture of parts, components, materials and products purchased by Amphenol PCD (Shenzhen) Co.,Ltd. This document is intended to ensure compliance with worldwide regulatory and customer requirements regarding banned and reportable substances, and is updated as required to reflect changing requirements.本份文件定义了禁止和限制使用的用在安费诺精密连接器(深圳)有限公司生产的产品上的物质，包括给客户的产品包装或是运输材料被限制使用的物质和原料。这也说明安费诺精密连接器(深圳)有限公司购买的在制造中的零件、原器件、材料、产品禁止了使用某种破坏臭氧层物质。这份文件目的是确保符合全世界和客户关于禁止使用和需申明的物质。并且依据要求的变化而同时更新。.Level A: EU ROHS directive banned substances Table 1等级A：欧盟ROHS 指令禁止使用物质 表1Restricted Substance禁止使用物质Threshold Limit限制含量(mg/kg=ppm)Restricted Applications限制适用范围Reference参考Lead and lead compounds铅和铅的化合物1000PPMAll Applications全部适用Cadmium and cadmium compounds镉和镉的化合物100 PPMAll Applications全部适用Mercury and mercury compounds汞和汞的化合物1000 PPMAll Applications全部适用Hexavalent chromium (chromium VI) and hexavalent chromium compounds六价铬和六价铬的化合物1000 PPMAll Applications全部适用Polybrominated biphenyls (PBB)s, Polybrominated diphenyl ethers (PBDEs) and oxides (PBDOs)多溴联苯和多溴联苯醚1000 PPMAll Applications全部适用包材中的Cd，Pb，Hg，Cr6+Total100 PPMAll Applications全部适用Level B: Halogen Free Spec Table 2等级 B：无卤素要求 表2当客户有无卤素要求时，产品、零部件（包括但不限于半成品、成品、原物料、辅助材料及制程中的各种添加剂等）的采购还应满足无卤素标准:Restricted Substance限制物质Threshold Limit限制含量(mg/kg=ppm)Restricted Applications限制应用范围Reference参考Cl and Cl compounds氯及其化合物900PPMAll Applications全部适用Br and Br compounds溴及其化合物900PPMAll Applications全部适用Cl+Br氯溴溴(Br)+ 氯(Cl) 1,500ppmAll Applications全部适用Level C: Reportable Substances Table 3等级 C：若材料中使用时须申报 表3Restricted Substance限制物质Threshold Limit限制含量(mg/kg=ppm)Restricted Applications限制应用范围Reference参考DEHP、DBP、BBP、DINP、DIDP、DNOP、DNHP特定邻苯二甲酸盐100 PPMAll Applications全部适用铝及铝化合物(Aluminum and aluminum compounds)100 PPMAll Applications全部适用胺,脂肪族类(Amines, aliphatic)100 PPMAll Applications全部适用苯胺盐(Aniline salts)100 PPMAll Applications全部适用三环芳香烃(Anthracene)100 PPMAll Applications全部适用锑及锑化合物(Antimony and its Compounds)100 PPMAll Applications全部适用芳族胺和染料(Aromatic amines and dyes)100 PPMAll Applications全部适用芳族化合物单体，单独列出除外(Aromatic compounds as monomers, except where listed separately)100 PPMAll Applications全部适用对氨基联苯；对氨基苯胺；苯基苯胺(4-Aminobiphenyl)100 PPMAll Applications全部适用钡化合物，除了硫酸钡(Barium compounds, except barium sulfate)100 PPMAll Applications全部适用铍及铍化合物(Beryllium and its compound)100 PPMAll Applications全部适用铋及铋化合物(Bismuth and bismuth compounds)100 PPMAll Applications全部适用铬及其化合物(Chromium(III) and chromium compounds)100 PPMAll Applications全部适用钴及其化合物(Cobalt and conalt compounds)100 PPMAll Applications全部适用铜及其相关物质(Copper and its Materials)100 PPMAll Applications全部适用铁硅齐(Ferrosilicon)100 PPMAll Applications全部适用金及其相关物质(Gold and its Materials)100 PPMAll Applications全部适用卤化芳香族化合物(Halogenated aromatic compounds as monomers)100 PPMAll Applications全部适用卤化物及产品会产生酸蒸气物质(Halogenates that produce acidic vapor with water)100 PPMAll Applications全部适用铁及其化合物(Iron and iron compounds)100 PPMAll Applications全部适用镁及其化合物(Magnesium and its compounds)100 PPMAll Applications全部适用镍及其化合物(Nickle and nickle compounds)500 PPMAll Applications全部适用有机偶氮基化合物(Organic azo and azo-oxy compounds)1000 PPM用于IC中的阻燃剂有机卤化合物，单独列出除外(Organic halogen compounds, except where listed seperately)100 PPMAll Applications全部适用有机磷及其化合物(Organic phosphorous compounds)100 PPMAll Applications全部适用有机硅及其化合物(Organic silicon compounds)100 PPMAll Applications全部适用钯及其化合物(Palladium and palladium compounds)100 PPMAll Applications全部适用过氟烷基磺酸化及其衍生物(Perfluoro alkyl sulfonates(PFAS), and derivatives)100 PPMAll Applications全部适用全氟碳化物(Perfluorocarbons)100 PPMAll Applications全部适用磷苯二甲酸盐(Phthalates)100 PPMAll Applications全部适用硒及其化合物(Selenium and its Compounds)100 PPMAll Applications全部适用银及其化合物(Silver and its Compounds)100 PPMAll Applications全部适用钽及其化合物(Tantalum and tantalum compounds)100 PPMAll Applications全部适用二硫化四甲基秋兰姆(Tetramethylthiuram disulfide (Thiram)100 PPMAll Applications全部适用铊及其化合物(Thallium and thallium compounds)ND用于电子元器件的制造过程锌及其化合物(Zinc and zinc compounds)100 PPMAll Applications全部适用多环芳烃(PAHs)100 PPM塑胶，脱模剂，润滑剂等Plastic, mold dope, lubricant, etcThe exemption item Table 4.豁免条款 表4。Substance / 物质Applications that are exempted / 应用领域豁免Mercury 汞When no other substitute is feasible / 当没有替代物品时: Mercury in compact fluorescent lamps not exceeding 5 mg per lamp / 汞在每只小莹光灯上的含量不超过5毫克. Mercury in straight fluorescent lamps for general purposes not exceeding / 汞在每只荧光管上的含量不超过:o Halophospate / 氯酸盐 10mgo Triphosphate with normal lifetime / 正常寿命的三磷酸盐 5 mgo Triphosphate with long lifetime / 长寿命的三磷酸盐 8 mg Mercury in straight fluorescent lamps for special purposes / 汞用在特殊用途的荧光灯管上. Mercury in other lamps not specifically mentioned above.其它上面没有特别提到的汞灯。 Mercury used as a cathode sputtering inhibition in DC plasma display with a content up to 30mg per display until 1 July 2010 2010年前直流等离子显示器中阴极溅射抑制剂中的汞,其含量不得超过30毫克/显示器Lead 铅 Lead in glass of (a) cathode ray tubes, (b) electronic components, (c) fluorescent tubes.铅在(A) 阴极射线管, (B) 电子元件, (C) 荧光管的玻璃中. Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight / 铅作为合金元素包含在钢铁中达到总重量的0.35%, 铝合金中达到总重量的0.4%。铜合金中达到此为。 Lead: / 铅 In high melting point type solder (i.e. tin-lead solder alloys containing 85% by weight or more of lead高熔点型号焊锡（例如按重会计师计算，锡铅合金焊料达到或以上的）。 In solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunication.用于服务器，存储器、存储系统、网络转换、信号发射、发送的网络的基本设备以及电讯网络管理设备的焊料。 In compliant connector system./在适配器系统。 As a coating material for the thermal conduction module C-ring./用作热传导模块C环的涂层材料 In optical and filter glass./用在光学的和滤色玻璃中 In solders consisting of more than two elements for connection between the pins and the package of microprocessors with lead content of more than 80% and less than 85% by weight.用于连接微处理器和针脚的超过两种成份的焊料，铅的重量比在80%和85%之间。 In solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip packages/用于集成块里连接半导体终端和信号发送器的电子联接器焊料。 In electronic ceramic parts (e.g. piezo-electronic devices) 用于电子陶瓷部件（如：压电单元）。Lead in solder for the soldering of thin copper wires of 100 um diameter and less in power transformers电力变压器中直径100微米及以下细铜线所用焊料中的铅 Lead in cermet-based trimmer potentiometer elements 金属陶瓷质的微调电位计中的铅 Lead in the plating layer of high voltage diode on the basis