lead free HAL WI.doc

文件名称TITLE:Lead Free(SN100CL) HAL working instruction无铅喷锡(SN100CL)工序操作指引文件状态DOC. STATUS文件编号Doc. No.: MEI125版本修订ISS. REV.页号PAGE 26 OF 25 07-11.0 Purpose 目的 This is to define standard working instruction for HAL. 本规范的目的是为无铅喷锡工序建立一标准工作指示.2.0 Scope范围.This document is applicable to HAL M/C、Pre-treatment、Post-treatment、Laminator and so on.本工作指示适用于无铅喷锡机、喷锡前处理机、喷锡后处理机以及辘板机等设备操作.3.0 Applicable Documents适用文件1) Customer workmanship specification客户工艺标准2) MI、LOT cardMI、lot卡3) Process change notice流程暂改通知4) Industry safety, environment protection and vocational health regulation.工业安全、环保及职业健康守则4.0 Safety安全性 See HR&AI002.见HR&AI002.5.0 Responsibility责任1) Prod dept. is responsible for daily operation, normal working parameters and conditions according to this instruction.生产部负责设备日常操作并控制工作参数/条件.2) ME is responsible for providing technical support in process improvement and trouble shooting.制作工程部负责为流程出现的问题提供技术支援.3) SE is responsible for servicing production equipments.07-1维修工程部负责为各生产设备提供保养及维修服务.4) Chem. Lab is responsible for analyzing contents of daily materials.化验室负责日常所用物料成份分析.5) QA is responsible for process auditing.流程QA负责监督流程参数的实施.6) EIE is responsible for waste treatment.由环境及工业工程部 (EIE) 负责废气、废水的处理.6.0 Equipments设备1) Lead free HAL line 无铅喷锡机2) Pre treatment前处理机3) Post treatment后处理机4) Oven烘炉 7.0 Materials 物料HAR-809KA.Flux 松香HAR-809KA Lead free Solder SN100CL 无铅锡条SN100CL Lead free Solder SN100CLe 无铅锡条SN100CLeLead free Solder SN100CLN3 无铅锡条SN100CL N3 Filter过滤棉芯 AR H2SO4 AR 硫酸 NPS 过硫酸钠 Bluestone (CuSO4 .5H2O)硫酸铜 AR IPA AR 异丙醇 8.0 Process flow chart of lead free HAL line无铅喷锡生产线流程InputScrubbingPressurized water rinsing (1)High pressure water rinsing (1)InspectionMicro-etchingFlooding water rinsingWater-column rinsingHigh pressure water rinsing (2) Pressurized water rinsing (2)DI water rinsingDrying moduleInspectionFlux coatingTurn overLead free HASLAir bedInspectionFlux removingHot water rinsingWipe-washingPressurized water rinsing High pressure water rinsing Ultrasonic dippingPressurized water rinsing DI water rinsingDrying moduleOutgoing07-1入板 磨板 加压水洗(1) 高压水洗(1) 检查 微蚀 溢流水洗水柱式冲洗 高压水洗(2)加压水洗(2) DI 水洗干板组合 检查 辘松香 翻板无铅喷锡气垫浮床 检查洗松香热水洗轻擦洗板加压水洗高压水洗超声波浸洗加压水洗DI水洗干板组合出板9.0 Process parameters (Check them per 4hrs)流程参数(每四小时检查一次)When produce DELLS boards, Record the production parameters settings per lot per P/N.当生产DELL板时, 须记录每lot每P/N做板参数.A. Pre-treatment 前处理机： 1) Speed速度： 31m/min 2) Scrubbing pressure磨板压力：1.80.5 A3) Micro-etching temp微蚀缸温度：3554) Drying temp烘干温度：755 5) Pressure of solution and circulating water药液及循环水压力：v Pressurized water rinsing(1) 加压水洗(1)：31 kg/cm2v High pressure water rinsing(1)高压水洗(1)：155 kg/cm2v Micro-etching 微蚀缸：21 kg/cm2v Flooding water rinsing溢流水洗：1.50.5 kg/cm2 v Water-column rinsing水柱式冲洗：21 kg/cm2v High pressure water rinsing(2)高压水洗(2)：155 kg/cm2v Pressurized water rinsing(2) 加压水洗(2)：31 kg/cm26) City water flow自来水流量: High pressure water rinsing(1) 高压水洗(1)：62 L/min7) DI water flow DI水流量：DI water rinsing DI水洗：62 L/min07-1B. Post-treatment 后处理机 1) Speed速度：31m/min 2) Flux removing IPA cont. 洗松香IPA浓度：205 %(V/V)Flux removing pressure 洗松香压力：1.50.5 kg/cm2Hot water temp热水温度： 455 3) Drying temp烘干温度：755 4) Wipe-washing scrubbing pressure轻擦洗板磨板压力：1.50.5A5) Pressure of circulating water循环水压力v Hot water rinsing pressure热水洗压力：1.50.5kg/cm2v Pressurized water rinsing加压水洗：31kg/cm2v High pressure DI water rinsing高压水洗：155 kg/cm2 6) Ultrasonic dipping Temp超声波浸洗温度：4057) Ultrasonic dipping power control超声波功率控制：6020%8) Pressurized water rinsing Temp加压水洗温度：4059) Hot DI water rinsing热DI水洗：62 L/min10) DI water flow DI水流量：DI water rinsing DI水洗：62 L/minHigh pressure DI water rinsing 高压水洗：62 L/min11) Conductivity(电导率) 5 us/cm.07-110.0 Lead free HAL M/C Operating Condition 无铅喷锡机操作条件Parameter控制参数Control range控制范围Inspection frequency检查频率Dip zone temp浸板区温度2705 Check them per 4hrs.每四小时检查一次.When produce DELLS boards, Record the production parameters settings per lot per P/N.当生产DELL板时, 须记录每lot每P/N做板参数.Pump zone temp泵区温度2705 Front Air Knife Temp前风刀温度29510 Rear Air Knife Temp后风刀温度29510 Insertion speed入板速度500100mm/sWithdrawal speed取板速度600100mm/sAirknife Gap风刀间距6.40.4mmFront Airknife Pressure前风刀压力21barAdjust it as per actual production根据生产需要可调节Rear Airknife Pressure后风刀压力21barAdjust it as per actual production根据生产需要可调节Immersion Time浸锡时间2-4sec.Adjust it as per actual production根据生产需要可调节Preheat Time预热时间2-4sec.Adjust it as per actual production根据生产需要可调节Upright spacing between Air knives 风刀垂直距离51 mmCheck per week每周检查一次Remark备注：1. The air-knife gap setting is 6.40.4mm(which apply board thickness1.6mm). If board thickness 1.6mm, the air-knife gap setting is (4.8+board thickness0.4mm)表格风刀间距为6.40.4mm, 只适用生产板板厚小于等于1.6mm的情况, 当生产板厚大于1.6mm时, 风刀间距=(4.8+板厚)0.4mm07-12. V-block tooling is used to verify the air-knife gap distance, and it is used. Sent to Cab very 3month by QA.风刀间距使用测量工具（V-block）测量，V-block每三个月必须送给QA测量 3. In order to save the electricity using standy mode if it will not manufacture with in 1hour. Switch off the machine if it will not manufacture within 6 hours.为了节省能源，预计超过1小时不生产将喷锡机转至待机状态，预计超过6小时不生产将喷锡机关闭.4. When the first time produce DELL P/N, record the LF-HAL machine parameters setting (FA) as the reference.首次做DELL P/N时, 须记录喷锡机的参数(FA)作为下次做板参数依据.When produce DELL boards, manufacturing the boards refer to the previous parameters settings. If FA PASS, it can start production. If not, adjusting the parameters settings until FA PASS. And record the new LF-HAL machine parameters settings (FA) as the reference.每次生产DELL板时, 参考上次做板参数进行做板, 如FA OK, 正常做板, 如FA 不OK, 调整原有参数再試FA, OK后, 将新参数记录在相关附表中作为下次做板参数依据.07-111.0 Material component and control物料成份组成及控制:A. Micro-etching微蚀缸1) NPS： 10020g/l preferable 100g/l过硫酸钠 (NPS)：10020g/l 适量100g/lAR H2SO4： 6010g/l preferable 60g/l：Cu content: 530g/l AR硫酸： 6010g/l 适量 60g/l：铜含量：530g/l2) Change solution in large maintenance once per month, and the methods of confecting solution as follows：每月一次大保养并换缸，药液配制方法如下：Fill in solution to the upper limit, the capacity is 280L about, keep 60100L solution and add AR (H2SO4) 3L, add doing-solution 100-150L, then add DI water to level, analysis and adjust after makeup, produce after the parameters meet MEI requirement.以到药水缸的上限水位为准，容积约280L，留60100L 母液, 加硫酸3L, 再加补料液100-150L, 然后加DI水至液位.开缸后需分析并调整至MEI范围内方可生产.3) Normal dosing平时加料Automatically dose 10s solution per 50 PCS boards, and the methods of confecting doing solution as follows：每生产50块板，自动补加药水10s，补料药水配制如下： Fill in half barrel water, mixing barrel capacity is 1000L;向配料桶加入半桶清水，配料桶容积为1000L; Put 18L AR H2SO4 into mixing barrel; 向配料桶加入18L AR H2SO4 Put 200kg NPS into mixing barrel; 向配料桶加入200kg 过硫酸钠 Fill in water to the mark level, then turn on the pump to circulate 10mins.加水至配料桶之刻度线, 然后开泵循环搅拌10min.v Dose carefully, avoid scattering H2SO4 and NPS out to pollute environment加料时应小心操作, 避免浓H2SO4或NPS溅落地面, 污染环境.v Churn up sufficiently to make NPS dissolve completely when confect solution07-1凡配制药水, 都必须进行充分的搅拌, 以使过硫酸钠完全溶解.4) Test the content of Cu、H2SO4、NPS once per shift, dose chemical according to test result. In addition, change module when Cu =30g/l, keep 60-100L solution when change tank, analysis Cu concentration after replace tank, produce after Cu concentration is above 5%.微蚀缸铜含量、硫酸含量及过硫酸钠含量每班化验一次, 根据化验结果进行补料.此外,铜含量达30g/l须换缸, 换缸时留60100L母液, 换缸后分析铜含量5g/l以上才能生产.5) Chem. Lab should analyze micro-etching rate two times per week, control it on required value: 5020.微蚀缸每周化验室做三次微蚀速率分析, 要求控制在5020.6) Adjust method for micro-etch solution微蚀缸药水调整方法: When H2SO4 content on the low side, need adjust by H2SO4.The dosing quantity of H2SO4(LT)= (LT). For example: H2SO4 content is 50g/l,then dosing H2SO4= =1.5LT.当H2SO4含量偏低时,需补H2SO4调整,H2SO4补料量(LT)= (LT)如分析出H2SO4含量为50g/l时,需补H2SO4= =1.5LT. When H2SO4 content on the high side, need adjust by water. The quantity of water (LT)= (LT). For example: H2SO4 content is 70g/l, then dosing water= =47(LT). 当H2SO4含量偏高时,需补水调整,补水量(LT)= (LT)如分析H2SO4含量为70g/l时, 需补水= =47(LT).Dosing water result in reduce NPS concentration, then need dosing NPS. The quantity of NPS= . For example: dosing 100LT water need dosing NPS: =4.7kg.07-1因补水降低NPS浓度,需补充NPS,NPS补料量(kg)= (kg). 如补水47LT, 则需补NPS: =4.7kg. When NPS content on the low side, adjust by dosing NPS, the quantity of NPS = (kg).For example: NPS content is 130g/l, need dosing NPS =2.8kg.当NPS含量偏低时, 需补NPS调整, NPS补料量(kg)= (kg).如NPS含量为90g/l时, 需补NPS: =2.8kg. When NPS content on the high side, need adjust by water, the quantity of water(LT). For example: NPS content is 150g/l,the dosing quantity of water is =28LT.当NPS含量偏高时,需补水调整,补水量(LT)= (LT).如当NPS含量为110g/l时,补水量为: =28LT.Dosing water result in reduce H2SO4 concentration, then need dosing H2SO4.The quantity of H2SO4= (LT). For example: dosing 28LT water need dosing H2SO4: =0.9LT at the same time.因补水降低H2SO4浓度,同时需补充H2SO4,H2SO4补料量(LT)= (LT);如当补水28LT, 则需同时补H2SO4=0.9LT.07-1B. HAR-809KA Flux松香809KA Flux control parameters松香控制参数Control parameters控制参数Flux 809KA松香809KAAnalysis frequency分析频率Responsible Dept负责部门PH valuePH值1.02.0Twice/week每周2次Chem. Lab化验室Specific gravity比重1.100.05Twice/week每周2次Chem. Lab化验室 Check flux M/C and replenish flux once/4hrs to ensure the flux level reach 135150mm, also the production level. 松香机每生产4小时检查并添加一次松香至135150mm之间(泵运行时), 保证松香达到生产液位. Restead the Flux every week.松香缸每周换缸一次C. Lead free HAL M/C 无铅喷锡机1) Composing material: there are three kinds of lead free tin bar, as shown below picture: SN100CL is for makeup; SN100CLE is for abjusting the Cu content, and SN100CL3 tin bar is for Ni replenishment.物料组成：无铅喷锡共有三种锡条，如下图所示，SN100CL为开缸锡条，SN100Cle为铜含量调整锡条，SN100CLN3为镍补充锡条。07-1Lead free HAL tin-bar identify无铅喷锡锡条识别开缸锡条镍补充锡条铜含量调整锡条Notice: other tin-bars are prohibited in lead free tin tank.注意: 其它锡条严禁被投入本锡缸2) Tin tank composition control range锡缸成分控制范围：Sn:98.5%； Cu：0.750.25%； Ni：0.04-0.07%； Pb：0.1%Fe：0.02% Ag：0.05%Sn, Ni, Cu content of the tin tank should be tested once/shift. Sampling after tin tank temperature reach to work temperature and tin solution circulating 15mins and above, sampling from pump zone with stainless steel scoop and put into fixed mold to cooling, then send to Chem.Lab analysis. If replenish tin-bars after analysis, churn up half hour or above after add tin-bars before production. Pb, Fe, Ag content of the tin tank should be tested once/week, if Pb, Fe, Ag content is out of control limited, it required to establish the cross-functional team to identify and isolate the suspected WIP and FG which produced among the period. Send a tin tank sample to supplier and third party to analyze the Sn、Ni、Cu、Pb every month, compare it with our chemical lab result.锡缸Sn、Ni、Cu含量每班化验一次。需要在锡缸温度达到工作温度并循环15mins及以上才进行取样，用不锈钢勺子在锡泵附近取样及倒入固定模具中进行冷却，然后送化验室进行化验。如果分析后需要加料，每次加料后需要搅拌半小时以上才能生产.锡缸Pb、Fe、Ag含量每周化验一次, Pb0.1%, Fe0.02%, Ag0.05%时, 需成立交叉功能小组, 并需对一周内的生产板, 包括WIP、FG按怀疑产品处理.每个月取一次锡缸样品给供应商和第三方分析Sn、Ni、Cu、Pb,与本厂化验室进行对比确认.07-13) The process of control of tin bath elements锡缸成分控制流程.Analysis分析Replenish or not是否补料Replenish补料Production生产NY4) Tin tank replenishing method 锡缸补料方法：a. When replacing tin liquid and replenishing, add 9kg SN100CLN3 to the tin tank then Ni content of the tank will rise 0.05% and add SN100CLe to the tin tank then Ni content of the tank keep steady and the aim Ni content is 0.005%, Circulate half an hour before produce.换锡或需要补料时, 以Ni含量0.05%为目标进行补充, 每补充9kg, SN100CLN3 Ni含量将上升0.005%, 补充SN100CLe, Ni含量不变.循环半小时以上才能正式开拉生产.b. When Ni content is lower than 0.045%, we must replenish to add 9kg SN100CLN3 or replenish according to chem.lab indication, circulate half an hour before produce.Ni含量低于0.045%时，必须补加9KG SN100CLN3或者根据化验室指示进行补料，并循环半小时以上，才能正式开拉生产；c. When Ni content is higher than 0.055%, implement SN100CLE into the tin tank. 当Ni含量高于0.055%时，采用SN100Cle进行补料； d. 锡缸更换锡条的方法:a) When Cu content reach to 0.85%0.9% in the tank, we replace the tin liquid, replace 100kg tin liquid so that the Cu content can reach to 0.5%0.6%, circulate half an hour before produce.当锡缸Cu含量达到0.85%0.9%时, 进行换锡, 换锡100kg以使其Cu含量降至0.5%0.6%,然后循环半小时后进行生产.b) When Cu content reach to 0.75%0.85% in the tank, and we can be continuous to product 1000ft2, then analyze Sn, Ni, Cu content of the tin tank and adjust to OK, after that, go on with production.当Cu含量在0.75%0.85%之间时,连续生产量达到1000ft2, 必须进行分析验证锡缸成分,并调整后才能继续生产.e. Record all the complement in the attached table.所有补料按附表做好记录。07-1D. Hot IPA rinsing热IPA洗v Hot IPA rinsing cont. 热IPA洗浓度：205 %(V/V)v Tank solution makeup开缸方法：Put 40L IPA into tank, and then fill DI water to the required production level：about 200L.以生产水位约200L为准，加40L IPA到缸内， 然后补充DI水到生产水位。v Dosing method：Put 20L IPA into tank, then fill DI water to the required production level every shift when production.补料方法:生产时每班补加20L IPA到缸内,然后补DI水到开缸液位.07-112.0 Maintenances： (acted by Prod. dept)操作保养 (由生产部负责)12.1 Pre-treatment and post-treatment small maintenance（Once/shift）前后处理机小保养(1次/班)(1) Wipe outside of machine擦拭机器外壳：(2) Check the blockage, breakage in nozzles, whether sector and spray pipe are in the same direction and whether the adjacent spray area between boards as the below fig：检查喷嘴有无堵塞，损坏及脱落，其扇形方向与喷管长度方向是否一致,并且相邻喷咀喷淋区域是否如下图所示在靠近板子处交错：喷管喷嘴喷淋图线路板 Fig: Chart Spray Way喷咀喷淋方式图(3) Clean tank, filter net and change water. 清洗水缸, 清洗滤网及换水. (4) Cleaning air bed 清洁浮床12.2 Clean conveyors and nozzles，check whether conveyors have abrasions，clean water rinsing tanks with high pressure water gun每月清洗一次各段行辘及喷咀, 检查行辘有否磨损,所有水洗缸用高压水枪进行清洗.12.3 Clean micro-etching once/three monthes.每三个月清洗微蚀缸一次a. Dray out the NPS solution, fill in water to the make-up level, turn on the pump circling 30min.将缸内药水抽出, 用清水循环清洗30min.b. Fill in the 5% NaOH solution to the make-up level, turn on the pump circling 2 hours, then drain off the NaOH solution.加5% NaOH溶液至开缸液位, 打开泵循环2小时, 然后排掉NaOH溶液.c. Clean the micro-etching tank two times with water, circling 30min once time. 用水循环清洗2次, 每次30min.d. Fill in the 5% H2SO4 solution to the make-up level, turn on the pump circling 1hours, then drain off the H2SO4 solution.加5%H2SO4溶液至开缸液位,打开泵循环1小时,排掉H2SO4溶液.07-1e. Clean the micro-etching with DI water circling 30min.用DI水循环清洗30分钟.12.4 Maintenance IPA bath once per week, drain away all liquid in IPA tank, rinse with fresh water, and then do bath make up. Make record corresponding.每周保养一次IPA缸，保养时将缸液排走，用新鲜水清洗干净，再开新缸，并做好记录。12.5 SE is responsible for tearing down blowing machines bolts, and supervise prod dept. members to clean impellers and the inside 每半月保养一次烘干段行辘及风刀，每三月清洗一次烘干段空气过滤棉心。每三个月一次风机拆卸螺栓后清洁风叶及内部，拆卸工作由维修工程人员负责，清洁工作在维修工程人员的指导下由生产部负责12.6 Lead free HAL M/C：无铅喷锡机：Daily Maintenance 日常保养 At the start of every shift：每班开工后所做保养项目： (1) Set controls to raise solder to full working temperature.在控制屏上,轻触“RUN”键,机器开始升温至预设生产状态的温度。 (2) Lower pump (this must be done carefully, due to the possibility of the molten solder spitting when the cold pump is lowered into it)放下锡泵（进行此步骤时应特别小心，已冷却的锡泵放入锡水中可能会因冷热不均而溅起锡水）。(3) Remove solder from overflow tank.清除溢流缸里残留的锡。(4) Clean the board guides，air knife units and chamber using a scraper. Clean the air knife tips using cleaning tool supplied用刮刀清理导轨，风刀连接处及风刀箱，并用专用工具清理风刀口.(5) Replace board guides 装上导轨。At the end of every shift 每班收工前所做保养工作 Clean out accumulated solder from the top of the air knives and air knife extraction duct.清理风刀上部及风刀取出口的锡渣。 Remove board guides and raise the air knife chamber .07-1拆掉导轨，抬起风刀箱。 Clean the board guides，air knife units and chamber using a scraper. Clean the air knife tips using cleaning tool supplied.用刮刀清理导轨，风刀连接处及风刀箱内部，并用专用工具清理风刀口。 Lower the air knife chamber .(DO NOT re-fit board guides)放下风刀箱。（不要装导轨） Remove pump chamber covers and carefully raise pump.移开泵区的盖子，并小心的抬起锡泵。 Clean pump externally.清理锡泵表面锡渣。 Clean pump chamber using scraper, remove dross from surface of solder and push the waste though to the external overflow weir.用刮刀清理泵区。捞出浮在表面的渣滓，并把浮在锡表面的废弃物通过外部的溢流口清理掉。 Replace pump chamber covers, leaving pump raise.盖上泵区的盖子，保持抬起泵的状态。 Fit pump hood cover.把锡泵上罩子装好。 Drain water from air reservoir排掉压缩空气凝结水Weekly maintenance： 每周保养：(1) Remove scale from the sides of the pump at solder level.拆下在焊液上泵边的scale(2) Clean and grease air knife adjustment mechanism.清洁风刀调校装置。(3) Check vertical offset between front and rear air knives, using the setting gauges.用与机器配套的尺子量前后风刀的垂直距离。(4) Remove clean and refit the weir plate positioned between the dip and pump zone. 07-1拆下浸锡区与锡泵区之间的挡片，清洁后重新安装。 (5) Clean carbide in tin tank wall by stainless steel bar (saw blacde)用不锈钢条(锯片)清理锡缸内壁碳化物. (6) Clean the conduit of pump zone and drain hole of tin liquid at the bottom of the dipping zone by steel pin.用钢钎清理泵区的锡液导管和浸板区底部的锡液排出孔。(7) All daily maintenance.所有日常保养。 Monthly maintenance：每月保养：(1) All daily maintenance.按日常保养内容操作。(2) All monthly maintenance.按周保养内容操作。(3) Adjust solder pump drive belt as necessary如有需要调校锡泵传送带。(4) Check flow of