LED安装方法.doc

安装方法注意各类器件外线的排列，以防极性装错。器件不可与发热元件靠得太近，工作条件不要超过其规定的极限。务必不要在引脚变形的情况下安装LED。当决定在孔中安装时，计算好面孔及线路板上孔距的尺寸和公差以免支架受过度的压力。4）安装LED时，建意用导套定位。在焊接温度回到正常以前，必须避免使LED受到任何的震动或外力清洁请勿用有机溶剂(如丙酮、天那水等)清洗或擦拭发光管胶体,使得环氧树酯表面粗化,造成发光 不正常或者胶体内部破裂,导致发光管内部金丝与芯片或芯片与支架的连接破坏，造成不发光或发光不 正常；发光二极管的管脚外表为镀银或镀锡，请勿破坏其表面镀层，以免造成氧化过快。如必须清洁，请用酒精清洁不超过一分钟，强烈建议用超声波清洗发光二极管。成型LED在弯脚或折脚时请不要离胶体太近或紧靠LED的胶体，应与胶体边缘保持2mm以上的距离，否则会使LED胶体里面胶体与金线分离；管脚在同一处的折叠次数不能太多焊接烙铁焊接：烙铁（最高30W）尖端温度不超过300；焊接时间不超过3秒；焊接位置至少离胶体2毫米。浸焊：浸焊最高温度260；浸焊时间不超过5秒；浸焊位置至少离胶体2毫米。请勿带电作业。电流由于LED具有随着电压稍加而电流迅速增加之特性，过高的电流会引起LED灯的烧坏及亮度的超速衰减，应加上一个电阻与LED串联，起到限流作用，LEDs应在相同的电流条件下工作，一般建议通LED之电流为20mA.判定的项目和标准SAMPLING PLANU.S. Ministry of defence MIL-STD-105E level II (Single Sample Plans)INSPECTION ITEMS AND CRITERION FOR JUDGEMENTMeasuring Methods for Light Emitting Diodes (No. 11830) and Light Emitting Diodes (No.11829).Stipulated by Ministry of Economical Affairs of R.O.C. and by reference to QC standards prevailing in prominent LED plants worldwide.RELIABILITY TESTSGeneral Provisions for Environmental Tests of CNS-Categorized Electronics Parts, 3623-3634, 567, 11233-11238, and U.S. Ministry of National Defence MIL-STD-750 Specifications.TESTCONDITIONSTHERMAL SHOCKTESTLED placed in a chamber (-44C) for 20 minutes, temperature increased instantaneously to + 88C for 20 minutes.The duration of the test shall be for 10 complete cycles.HUMIDITYTESTLED placed in humidity chamber which is maintained at 40C, 95% R.H.The duration of test is for 96 hours.LIFETESTLED connected to a source of power and charged with 10mA at room temperature (25C) for 1000 hours.SOLDERABILITYTESTThe pins of LED (1.6mm from body) dipped into tin which is maintained at 260C with +/- 5C.VIBRATIONTESTLED placed on a vibrator which is maintained at 10-55-10 Hz/minute. 0.82mm amplitude. The duration of the test is 30 minutes.PACKINGTESTLED packed in a corrugated fibreboard box and fallen freely on 6 faces at a diagonal angle to the ground. The altitude of the fall will be in the range of 229-609 mm considering of the packed product.MEASURING TERMSFAILURE CRITERIALUMINOUS INTENSITY (IV)LOWER STANDARD LIMIT x 0.5FORWARD VOLTAGE (IF)UPPER STANDARD LIMIT x 1.2REVERSE CURRENT (IR)UPPER STANDARD LIMIT x 2.0LED焊接条件（1）烙铁焊接：烙铁（最高30W）尖端温度不超过300；焊接时间不超过3秒；焊接位置至少离胶体2毫米。（2）浸焊：浸焊最高温度260；浸焊时间不超过5秒；浸焊位置至少离胶体2毫米。引脚成形方法（1）必需离胶体2毫米才能折弯支架。（2）支架成形必须用夹具或由专业人员来完成。（3）支架成形必须在焊接前完成。（4）支架成形需保证引脚和间距与线路板上一致。LED安装方法（1）注意各类器件外线的排列，以防极性装错。器件不可与发热元件靠得太近，工作条件不要超过其规定的极限。（2）务必不要在引脚变形的情况下安装LED。（3）当决定在孔中安装时，计算好面孔及线路板上孔距的尺寸和公差以免支架受过度的压力。（4）安装LED时，建意用导套定位。（5）在焊接温度回到正常以前，必须避免使LED受到任何的震动或外力。清洗当用化学品清洗胶体时必须特别小心，因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯、丙酮等。可用乙醇擦拭、浸渍，时间在常温下不超过