PCB板与塑料件的缺陷.doc

专业PCB抄板、PCB设计一, 防焊部分:1, 色差(标准: 上下两级),2.防焊空泡;3.防焊露铜;4.防焊刮伤;5.防焊ON PAD,6.修补不良:绿漆涂布面积过大或修补不完全, 长度大于30mm,面积大于10mm2及直径大于7mm2 之圆;不可允收.7.沾有异物;8油墨不均; 9.BGA之VIAHOL未塞油墨;10.CARD BUS之VIA HOLE未塞油墨11.VIA HOLE未塞孔;12.沾锡:不可超过30mm213.假性露铜;可维修14.油墨颜色用错;不可维修二, 线路部分:1, 断线,2, 短路,3, 线路缺口,4, 线路凹陷&压痕,5, 线路沾锡,6, 线路修补不良,7, 线路露铜,8, 线路撞歪,9, 线路剥离,10, 线距不足,11, 残铜,12, 线路污染及氧化,13, 线路刮伤,14, 线细,三.贯孔部分；1, 孔塞,2, 孔破,3, 零件孔内绿漆,4, NPTH,孔内沾锡5, 孔多锁,不可维修6, 孔漏锁,不可维修.7, 孔偏, 孔偏出PAD,不可维修.8, 孔大,孔小,9, BGA之VIA HOLE孔塞锡, 不可维修.四, 文字部分:1, 文字偏移, 文字偏移,覆画到锡垫.不可维修.2, 文字颜色不符, 文字颜色印错.3, 文字重影, 文字重影尚可辨识,可维修,4, 文字漏印, 文字漏不可维修.5, 文字油墨沾污板面, 文字油墨沾污板面,可维修,6, 文字不清, 文字不清楚,影响辨识.可维修.7, 文字脱落, 有3M600胶带做拉力试验,文字脱落,可维修.六, 其它部分:1, PCB夹层分离,白斑,白点,不可维修,2, 织纹显露, 板内有编织性的玻织布痕迹,大于等于10mm2不可维修,3, 板面污染, 板面不可有灰压,手印,油渍,松香,胶渣,或其它等外来污染,可维修,4, 成型尺寸过大过小,外型尺寸公差超出承认书标准,不可维修,5, 裁切不良, 成型未完全,不可维修,6, 板厚,板薄, 板厚超PCB制作规范,不可维修,7, 板翘, 板杻高度大于1.6mm,不可维修.8, 成型毛边, 成型不良造成毛边,板边不平整,可维修 塑料产品缺陷 1. 毛边(Flash)/毛头(Burr) 塑胶料溢出稜边之余料 2. 疙疮(Bloom) 成形表面有粗糙粒状的现象 A noncontinuous surface coating conming from additives in the plastic. 3. 不饱模/缺料 (Short Shot/Void) 没有射出足够的原料填满外模 Injection of insufficient material to fill the overmold. Failure of plastic to completely fill mold cavity. 4. 烧焦(Burns) 热量分解，通常与变色(Discoloration)同时发生 Thermal decomposition, usually with discoloration. 5. 缩水(Sink/ Shrink mark) 表面龟裂，下沈或凹陷其原因是物质没有同时收缩或被螺丝钳夹住的线材 Surface discontinuity , depression or dimple caused by non-uniform material shrinkage , or clamping of cable; depressions on a surface. 6. 刮伤(Scratches) 材料外观表面产生浅槽的损伤 Damaged outer surface of jacket where material has been removed; Swallow grooves. 7. 割伤(Cut) 外观表面被一尖锐物品损伤 Damaged outer surface of jacket by a sharp object. 8. 夹伤(Tooling Mark) 使用夹子或工具修整线材外被所造成的损伤。 Deformity of cable jacket resulting from clamping or tooling. 9. 合模线开裂(Parting Line Split) 因外模材质收缩、爆裂或破裂而产生外模分裂 This is where the overmold material shrinks and cracks or splits, creating a tear in the overmold. Thin projection or material 90 degree to surface on a parting line. 10. 熔合线(Weld/Knit Line) 熔合线是成形材料合流的部份，在成形品上以熔合痕出现。 A visible line or mark on a surface. 11. 顶白(Clouding) 成型品於顶出点位置残留白点现象 12. 污染(Contamination/Dirt/Blemish/Speck) 墨水、脏物、助焊剂或其他外来物 13. 色差/变色(Color Difference/Discoloration) 与原始色版之颜色有差异 Any change from original color or unintended, inconsistent part color. 14. 断裂(Brittleness) 隔栏、脚柱或卡钩因受力(拉伸或挤压)而断裂 15. 阻塞(Fill in) Pin孔(同轴孔)因异物而阻塞 16. 压痕(Pinch off) 长时间之压力(重压)造成之应变(外被凹陷) Any irregularly shaped, void or impression left on the overmold, caused during preparation or handling. 17. 变形(Deformity/Deformation) 零件受损或与外型不符 Components is bent or show signs of deformation. 18. 凸点(Pimple) 塑胶料内含颗粒物 19. 凹点(Dimple/Pits) 平面上的坑洞 Small hollow/crater on a surface. 20. 流痕(Flow Marks) 外观表面产生波浪或条纹现象 Wavy or streaked appearance of a surface. 21. SR倾斜(Tilted Strain Relief) Cable should exit in a straight line from a connector assembly. 22. 雾(Haze) 成品於制程中所造成表面有白雾状之现象 Cloudiness on an otherwise transparent part. 23. 进料点过深(Gates) 指成形后，进料点有凹陷的现象 24. 翘曲(Warpage) 成形造成外观弯曲的现象 25. 突出(Protrusion) A raised area on a surface(Blister, bump, ridge) 26. 杂质(Specks) Small particles. 27. 气泡(Bubbles) Bubbles can be caused by not having uniform melt in the molding process. 28. Blush(异色) Discoloration caused by plastic flow during molding, usually found near gates. 29. Gate Blush(进料点异色) Discoloration around the gate area. 30. 光泽度偏差(Glossiness) 光泽度过量或不足的部份面积。 An area of excessive or deficient gloss. 31. 凹痕(Gouge) 能被感知的刻纹或是凹陷（并非缩水所致） Indentation or dent that can