SMT英语.doc

SMT常用术语 By 佚名SMT常用术语 微组装技术MPT/Micro electronic Packaging technology混装技术Mixed Component Mounting Technology封装 Package贴片 Pick and Place拆焊 Desoldering再流Reflow浸焊 Dip Soldering拖焊 Drag soldering印制电路Printed Circuit印制线路 Printed Wiring印制电路板 printed circuit board印制线路板printed wiring board层压板laminate覆铜铜薄层压板copper-clad laminate基材base material成品板production board印刷printing导电图形conductive pattern印制组件printed component单面印制板single-sided printed board双面印制板double-sided printed board多层印制板multilayer printed board电烙铁 Iron热风嘴 hot air reflowing noozle吸锡带soldering wick吸锡器tin extractor焊后检验post-soldering inspection目视检验visual inspection机器检验 machine inspection焊点质量 soldering joint quality焊电缺陷 soldering jont defect错焊 solder wrong漏焊 solder skips虚焊 pseudo soldering冷焊 cold soldering桥焊 solder bridge脱焊 open soldering焊点剥离 solder off不润湿焊点 soldering nonwetting锡珠 solder ball拉尖 icicle ； solder projection孔洞 void焊料爬越 solder wicking过热焊点 overheated solder connection不饱和焊点 insufficient solder connection过量焊点 excess solder connection助焊剂剩余 flux residue焊料裂纹 solder crazeing焊角翘起 fillet-lifting ；lift-offAI :Auto-Insertion 自动插件AQL :acceptable quality level 允收水平ATE :automatic test equipment 自动测试ATM :atmosphere 气压BGA :ball grid array 球形矩阵CCD :charge coupled device 监视连接组件(摄影机)CLCC :Ceramic leadless chip carrier 陶瓷引脚载具COB :chip-on-board 芯片直接贴附在电路板上cps :centipoises(黏度单位) 百分之一CSB :chip scale ball grid array 芯片尺寸BGACSP :chip scale package 芯片尺寸构装CTE :coefficient of thermal expansion 热膨胀系数DIP :dual in-line package 双内线包装(泛指手插组件)FPT :fine pitch technology 微间距技术FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作PCB材质)IC :integrate circuit 集成电路IR :infra-red 红外线Kpa :kilopascals(压力单位)LCC :leadless chip carrier 引脚式芯片承载器MCM :multi-chip module 多层芯片模块MELF :metal electrode face 二极管MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package andProduction Conference 国际电子包装及生产会议ppm:parts per million 指每百万PAD(点)有多少个不良PAD(点)psi :pounds/inch2 磅/英吋2PWB :printed wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line packageSIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 表面黏着组件SMD :Surface Mount Device 表面黏着组件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏着设备制造协会SMT :surface mount technology 表面黏着技术SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封装SOT :small outline transistor 晶体管SPC :statistical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之组件(贯穿孔)TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔IA Information Appliance 信息家电产品MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术 LGA封装不需植球，适合轻薄短小产品应用。TCP (Tape Carrier Package)ACF Anisotropic Conductive Film 异方性导电胶膜制程Solder mask 防焊漆Soldering Iron 烙铁Solder balls 锡球Solder Splash 锡渣Solder Skips 漏焊Through hole 贯穿孔Touch up 补焊Briding 穚接(短路)Solder Wires 焊锡线Solder Bars 锡棒Green Strength 未固化强度(红胶)Transter Pressure 转印压力(印刷)Screen Printing 刮刀式印刷Solder Powder 锡颗粒Wetteng ability 润湿能力Viscosity 黏度Solderability 焊锡性Applicability 使用性Flip chip 覆晶Depaneling Machine 组装电路板切割机Solder Recovery System 锡料回收再使用系统Wire Welder 主机板补线机X-Ray Multi-layer Inspection System X-Ray孔偏检查机BGA Open/Short X-Ray Inspection Machine BGA X-Ray检测机Prepreg Copper Foil Sheeter P.P. 铜箔裁切机Flex Circuit Connections 软性排线焊接机LCD Rework Station 液晶显示器修护机Battery Electro Welder 电池电极焊接机PCMCIA Card Welder PCMCIA卡连接器焊接Laser Diode 半导体雷射Ion Lasers 离子雷射Nd: YAG Laser 石榴石雷射DPSS Lasers 半导体激发固态雷射Ultrafast Laser System 超快雷射系统MLCC Equipment 积层组件生产设备Green Tape Caster, Coater 薄带成型机ISO Static Laminator 积层组件均压机Green Tape Cutter 组件切割机Chip Terminator 积层组件端银机MLCC Tester 积层电容测试机Components Vision Inspection System芯片组件外观检查机高压恒温恒湿寿命测试机 High Voltage Burn-In Life Tester电容漏电流寿命测试机 Capacitor Life Test with Leakage Current芯片打带包装机 Taping Machine组件表面黏着设备 Surface Mounting Equipment电阻银电极沾附机 Silver Electrode Coating MachineTFT-LCD(薄膜晶体管液晶显示器) 笔记型用STN-LCD(中小尺寸超扭转向液晶显示器 行动电话用PDA(个人数字助理器)CMP(化学机械研磨)制程研磨液(Slurry)，Compact Flash Memory Card (简称CF记忆卡) MP3、PDA、数字相机Dataplay Disk(微光盘)。交换式电源供应器(SPS)专业电子制造服务 (EMS)，PCB高密度连结板（HDI board， 指线宽线距小于44 mil）微小孔板（Micro-via board），孔俓5-6mil以 下 水沟效应（Puddle Effect）：早期大面积松宽线路之蚀刻银贯孔(STH)铜贯孔(CTH)组装电路板切割机 Depaneling MachineNONCFC无氟氯碳化合物。Support pin支撑柱F.M.光学点ENTEK 裸铜板上涂一层化学药剂使PCB的pad比较不会生锈QFD：质量机能展开PMT：产品成熟度测试ORT：持续性寿命测试FMEA：失效模式与效应分析TFT-LCD(薄膜晶体管液晶显示器) (Liquid-Crystal Displays Addressed by Thin-Film Transistors)导线架（Lead Frame）：单体导线架（Discrete Lead Frame）及积体线路导线架（IC Lead Frame）二种ISP的全名是Internet Service Provider，指的是因特网服务提供ADSL即为非对称数字用户回路调制解调器SOP: Standard Operation Procedure（标准操作手册）DOE: Design Of Experiment （实验计划法）打线接合（Wire Bonding）卷带式自动接合（Tape Automated Bonding, TAB）覆晶接合（Flip Chip）品质规范:JIS 日本工业标准ISO 国际认证M.S.D.S 国际物质安全资料FLUX SIR 加湿绝缘阻抗值1. RMA (Return Material Authorization)维修作业意指产品售出后经由客户反应发生问题的不良品维修及分析。Automatic optical inspection (AOI自动光学检查)上板机：Loader下板机：unloader滴涂器：dispenser点胶机：dispenser真空吸笔：vacuum pick & place tool贴片机：place machine ；chip mounter波峰焊接机： wave soldering systems再流焊炉：reflow soldering systems自定位：self aligment位移：skewing立片： tomb stone掉片： flying在线测试：ict；in cricult testing功能测试：funtion testing自动光学检测仪：AOI ；automated optical inspection自动X射线检查： AXI ；automated X-ray inspection返工工作台： rework station清洗机：cleaning systems THT（Through Hole Technology）：通孔安装技术SMT（Surface Mounted Technology）：表面安装技术PTH （Pin Through the Hole）：通孔安装THT (Through Hole Component) ：通孔插装元件SMB (Surface Mount Printed Circuit Board)：表面安装PCB板SMC (Surface Mount Component)：表面安装元件SMD (Surface Mount Device)：表面安装器件SMA (Surface Mount Assembly)：表面安装组件Component：元件Device：器件Assembly：组件CTE（coefficient of thermal expansion）：热膨胀系数In-circuit test：在线测试 Lead configuration：引脚外形Placement equipment：贴装设备 Reflow soldering：回流焊接 Repair：修理 Rework：返工 Solderability：可焊性 Soldermask：阻焊 Yield：产出率 Packaging density：装配密度 Chip：片状元件melf：圆柱形元件PCB（Printed circuit board）：印刷电路板DIP：双列直插 SIP：单列直插SOT（Small Outline Transistor）：小外形晶体管SOIC（Small outline IC）：小外形集成电路， SOP(Small outline Package)：小外型封装 PLCC（Plastic Leaded Chip Carrier）：塑型有引脚芯片载体 LCCC（Leadless Ceramic Chip Carrier）：无引脚陶瓷芯片载体QFP（Quad Flat Package）：多引脚方形扁平封装 BGA（ Ball grid array）球栅列阵CSP（Chip Scale Package）：芯片规模的封装Bare Chip：裸芯片Accuracy：精度ATE（Automated test equipment）：自动测试设备AOI（Automatic optical inspection）：自动光学检查Blind via：盲孔Buried via：埋孔through via：通孔Bridge：锡桥Circuit tester：电路测试机CTE（Coefficient of the thermal expansion）：温度膨胀系数Cold solder joint：冷焊锡点Component density：元件密度Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化Cycle rate：循环速率Defect：缺陷Desoldering：卸焊Downtime：停机时间FPT（Fine-pitch technology）：密脚距技术 Flip chip：倒装芯片FCT（Functional test）：功能测试Golden boy：金样ICT（In-circuit test）：在线测试JIT（Just-in-time）：刚好准时Lead configuration：引脚外形Packaging density：装配密度Pick-and-place：拾取-贴装设备Placement equipment：贴装设备 Reflow soldering：回流焊接Repair：修理Rework：返工Schematic：原理图Solder bump：焊锡球Solderability：可焊性 Soldermask：阻焊Tape-and-reel：带和盘Tombstoning：元件立起Ultra-fine-pitch：超密脚距Yield：产出率solder mask：阻焊漆silk screen：丝印面via：导孔Copper Clad Laminates：覆铜箔层压板past mask：焊膏膜(漏板） solder mask：焊接掩摸(阻焊膜） Solding Pasts：焊锡膏Stencils：模板、漏板、钢板Bridging：搭锡 Cursting：发生皮层 Excessive Paste：膏量太多 Insufficient Paste：膏量不足 Poor Tack Retention：粘着力不足 Slumping：坍塌 Smearing：模糊 Dpm（defects per million）：百万缺陷率Flexibility：柔性Modularity：模块化Component Pick-Up：元件拾取 Component Check：元件检查Component Transport：元件传送Placement Procedure：元件放置 Chamber System：炉膛系统Blowholes：吹孔 Voids：空洞 Movement：移位 Misalignment：偏斜Dewetting：缩锡 Dull Joint：焊点灰暗 Non-Dewetting：不沾锡 Accuracy：精度 Additive Process：加成工艺 Adhesion：附着力 Aerosol：气溶剂 Angle of attack：迎角 Anisotropic adhesive：各异向性胶 Annular ring：环状圈 Application specific integrated circuit ：ASIC特殊应用集成电路 Array：列阵 Artwork：布线图 Automated test equipment：ATE自动测试设备 Bond lift-off：焊接升离 Bonding agent：粘合剂 CAD/CAM system：计算机辅助设计与制造系统Capillary action：毛细管作用 Chip on board ：COB板面芯片 Circuit tester：电路测试机 Cladding：覆盖层 Cold cleaning：冷清洗Cold solder joint：冷焊锡点 Conductive epoxy：导电性环氧树脂 Conductive ink：导电墨水 Conformal coating：共形涂层 Copper foil：铜箔 Copper mirror test：铜镜测试 Cure：烘焙固化Cycle rate：循环速率Data recorder：数据记录器 Defect：缺陷De