材料科学与基础目录与翻译.doc

11. 1。 Introduction 简介 1.1 Historical Perspective 1.1历史透视 1.2 Materials Science and Engineering 1.2材料科学与工程 1.3 Why Study Materials Science and Engineering? 1.3为什么要研究材料科学与工程？ 1.4 Classification of Materials 1.4材料的分类 1.5 Advanced Materials 1.5先进材料 1.6 Modern MaterialsNeeds 1.6现代MaterialsNeeds 2.Atomic Structure and Interatomic Bonding 2.Atomic结构和原子间的键合 2.1 Introduction 2.1简介 2.2 Fundamental Concepts 2.2基本概念 2.3 Electrons in Atoms 2.3原子的电子 2.4 The Periodic Table 2.4周期表 2.5 Bonding Forces and Energies 2.5粘接力和能力 2.6 Primary Interatomic Bonds 2.6主原子间债券 2.7 Secondary Bonding or Van der Waals Bonding 2.7二次粘接或范德华粘接 2.8 Molecules 2.8分子 3. 3 Structures of Metals and Ceramics 金属和陶瓷的结构 3.1 Introduction 3.1简介 3.2 Fundamental 3.2基本 3.3 Unit Cells 3.3单元 3.4 Metallic Crystal Structures 3.4金属的晶体结构 3.5 Density Computations-Metals 3.5密度计算金属 3.6 Ceramic Crystal Structures 3.6陶瓷晶体结构 3.7 Density Computations-Ceramics 3.7密度计算陶瓷 3.8 Silicate Ceramics 3.8硅酸盐陶瓷 3.9 Carbon 3.9碳 3.10 Polymorphism and Allotropy 3.10多态性和同素异形体 3.11 Crystal Systems 3.11水晶系统 3.12 Crystallographic Directions 3.12的晶体方向 3.13 Crystallographic Planes 3.13晶面 3.14 Linear and Planar Atomic Densities 3.14直线和平面的原子密度 3.15 Close-Packed Crystal Structures 3.15紧密堆积的晶体结构 3.16 Single Crystals 3.16单晶 3.17 Polycrystalline Materials 3.17多晶材料 3.18 Anisotropy 3.18各向异性 3.19 X-Ray Diffraction:Determination of Crystal Structures(CD-ROM)S-6 3.19 X射线衍射晶体结构的测定（CD - ROM）的S - 6 3.20 Noncrystalline solids 3.20非晶态固体 4. 4。 Polymer Strutures 聚合物Strutures 4.1 Introduction 4.1简介 4.2 Hydrocarbon Molecules 4.2碳氢化合物分子 4.3 Polymer Molecules 4.3聚合物分子 4.4 The Chemistry of Polymer Molecules 4.4聚合物分子化学 4.5 Molecular Weight 4.5分子量 4.6 Molecular Shape 4.6分子形状 4.7 Molecular Structure 4.7分子结构 4.8 Molecular Configurations(CD-ROM)S-11 4.8分子构型（CD - ROM）的S - 11 4.9 Thermoplastic and Thermosetting Polymers 4.9热塑性塑料和热固性聚合物 4.10 Copolymers 4.10共聚物 4.11 Polymer Crystals 4.11高分子水晶 4.12 Polymer Crystals 4.12高分子水晶 5.Imperfections in Solids 5.Imperfections在固体 5.1 Introduction 5.1简介 5.2 Point Defects in Metals 5.2金属点缺陷 5.3 Point Defects in Ceramics 在陶瓷5.3点缺陷 5.4 Impurities in Solids 5.4固体中的杂质 5.5 Point Defects in Polymers 5.5在聚合物中的点缺陷 5.6 Specification of Composition 5.6规范的组成 5.7 Dislocations-Linear Defects 5.7脱位线性缺陷 5.8 Interfacial Defects 5.8界面缺陷 5.9 Bulk or Volume Defects 5.9散装或卷的缺陷 5.10 Atomic Vibrations 5.10原子振动 5.11 General 5.11秘书长 5.12 Microscopic Techniques 5.12显微技术 5.13 Grain Size Determination 5.13晶粒尺寸的测定 6.Diffusion 6.Diffusion 6.1 Introduction 6.1简介 6.2 Diffusion Mechanisms 6.2扩散机制 6.3 Steady-State Diffusion 6.3稳态扩散 6.4 Nonsteady-State Diffusion 6.4非稳态扩散 6.5 Factors That Influence Diffusion 6.5因素影响扩散 6.6 Other Diffusion Paths 6.6其它扩散路径 6.7 Diffusion in Ionic and Polymeric Materials 6.7离子和高分子材料的扩散 7.Mechanical Properties 7.Mechanical属性 7.1 Introduction 7.1简介 7.2 Concepts of Stress and Strain 7.2应力和应变的概念 7.3 Stress-Strain Behavior 7.3应力应变行为 7.4 Anelasticity 7.4滞弹性 7.5 Elastic Properties of Materials 7.5材料的弹性性能 7.6 Tensile Properties 7.6拉伸性能 7.7 True Stress and Strain 7.7真实应力和应变 7.8 Elastic Recovery During Plastic Deformation 7.8弹性恢复，在塑性变形 7.9 Compressive,Shear,and Torsional Deformation 7.9压缩，剪切和扭转变形 7.10 Flexural Strength 7.10弯曲强度 7.11 Elastic Behavior 7.11弹性行为 7.12 Influence of Porosity on the Mechanical Propertise of Ceramics(CD-ROM)S-22 7.12孔隙率的影响陶瓷机械Propertise（CD - ROM）的S - 22 7.13 Stress-Strain Behavior 7.13应力应变行为 7.14 Macroscopic Deformation 7.14宏观变形 7.15 Viscoelasticity(CD-ROM)S-22 7.15粘弹性（CD - ROM）的S - 22 7.16 Hardness 7.16硬度 7.17 Hardness of Ceramic Materials 7.17陶瓷材料的硬度 7.18 Tear Strength and Hardness of Polymers 7.18撕裂强度和硬度聚合物 7.19 Variability of Material Properties 7.19变异材料特性 7.20 Design/Safety Factors 7.20设计/安全因素 8.Deformation and Strengthening Mechanisms 8.Deformation和加强机制 8.1 Introduction 8.1简介 8.2 Historical 8.2历史 8.3 Basic Concepts of Dislocations 8.3位错的基本概念 8.4 Characteristics of Dislocations 8.4位错的特点 8.5 Slip Systems 8.5 SLIP系统 8.6 Slip in Single Crystals(CD-ROM)S-31 8.6滑单晶（CD - ROM）的S - 31 8.7 Plastic Deformation of Polycrystalline Metals 8.7塑性变形的多晶金属 8.8 Deformation by Twinning(CD-ROM)S-34 8.8变形孪晶（CD - ROM）的S - 34 8.9 Strengthening by Grain Size Reduction 8.9加强减少晶粒尺寸 8.10 Solid-Solution Strengthening 8.10固体解决方案加强 8.12 Recovery 8.12恢复 8.13 Recrystallization 8.13再结晶 8.14 Grain Growth 8.14晶粒生长 8.15 Crystalline Ceramics 8.15结晶陶瓷 8.16 Noncrystalline Ceramics 8.16非晶陶瓷 8.17 Deformation of Semicrystalline Polymers 8.17半结晶聚合物的变形 8.18 Factors That Influence the Mechanical Properties of Semicrystalline PolymersDetailed Version (CD-ROM)S-35 8.18半结晶聚合物的力学性能的影响因素详细版（CD - ROM）的S - 35 8.19 Deformation of Elastomers 8.19的弹性体变形 9.Failure 9.Failure 9.1 Introduction 9.1简介 9.2 Fundamentals of Fracture 9.2骨折的基础 9.3 Ductile Fracture 9.3韧性断裂 9.4 Brittle Fracture 9.4脆性断裂 9.5a Principles of Fracture MechanicsDetailed Version (CD-ROM)S-38 9.5A断裂力学原理详细版本（CD - ROM）的S - 38 9.6 Brittle Fracture of Ceramics 9.6陶瓷的脆性断裂 9.7 Fracture of Polymers 9.7聚合物的断裂 9.8 Impact Fracture Testing 9.8冲击断裂测试 9.9 Cyclic Stresses 9.9循环应力 9.10 The SN Curve 9.10 SN曲线 9.11 Fatigue in Polymeric Materials 9.11在高分子材料的疲劳 9.12a Crack Initiation and PropagationDetailed Version (CD-ROM)S-54 9.12a裂纹的萌生和扩展详细版本（CD - ROM）的S - 54 9.13 Crack Propagation Rate 9.13裂纹扩展速率 9.14 Factors That Affect Fatigue Life 9.14因素影响的疲劳寿命 9.15 Environmental Effects(CD-ROM)S-62 9.15环境影响（CD - ROM）的S - 62 9.16 Generalized Creep Behavior 9.16广义蠕变行为 9.17b Stress and Temperature Effects (Concise Version)S-65 9.17b的应力和温度的影响（简明版）的S - 65 9.18 Data Extrapolation Methods 9.18数据外推法 9.19 Alloys for High-Temperature Use 9.19合金用于高温使用 9.20 Creep in Ceramic and Polymeric Materials 9.20在陶瓷和高分子材料的蠕变 10 Phase Diagrams 10相图 10.1 Introduction 10.1简介 10.2 Solubility 10.2溶解性 10.3 Phases 10.3阶段 10.4 Microstructure 10.4显微 10.5 Phase Equilibria 10.5相平衡 10.6 Binary Isomorphous Systems 10.6二进制同晶系统 10.7 Interpretation of Phase Diagrams 10.7释义相图 10.8 Development of Microstructure in Isomorphous Alloys (CD-ROM)S-67 10.8发展同晶合金的微观结构（CD - ROM）的S - 67 10.9 Mechanical Properties of Isomorphous Alloys 10.9同晶合金的力学性能 10.10 Binary Eutectic Systems 10.10二元共晶系统 10.11 Development of Microstructure in Eutectic Alloys(CD-ROM)S-70 10.11发展的共晶合金的微观结构（CD - ROM）的S - 70 10.12 Equilibrium Diagrams Having Intermediate Phases or Compounds 10.12在中间阶段或化合物的平衡图 10.13 Eutectoid and Peritectic Reactions 10.13共析和包晶反应 10.14 Congruent Phase Transformations 10.14全等的相变 10.15 Ceramic Phase Diagrams(CD-ROM)S-77 10.15陶瓷相图（CD - ROM）的S - 77 10.16 Ternary Phase Diagrams 10.16三元相图 10.17 The Gibbs Phase Rule (CD-ROM)S-81 10.17吉布斯相律（CD - ROM）的S - 81 10.18 The Iron-Iron Carbide (Fe-fe3C)Phase Diagram 10.18铁碳化 铁（以Fe - Fe3C的）相图 10.19 Development of Microstructures in Iron-Carbon Alloys 10.19铁碳合金的微观结构的发展 10.20 The Influence of Other Alloying Elements(CD-ROM)S-83 10.20其他合金元素的影响（CD - ROM）的S - 83 11 Phase Transformations 11相变 11.1 Introduction 11.1简介 11.2 Basic Concepts 11.2基本概念 11.3 The Kinetics of Solid-State 11.3固态反应动力学 11.4 Multiphase Transformations 11.4多相转换 11.5 Isothermal Transformation 11.5等温转变 11.6 Continuous Cooling Transformation Diagrams(CD-ROM)S-85 11.6连续冷却转变图（CD - ROM）的S - 85 11.7 Mechanical Behavior of Iron-Carbon Alloys 11.7铁碳合金的力学性能 11.8 Tempered Martensite 11.8回火马氏体 11.9 Review of Phase Transformations for Iron-Carbon Alloys 11.9审查为铁碳合金相变 11.10 Heat Treatments 11.10热处理 11.11 Mechanism of Hardening 11.11硬化机理 11.12 Miscellaneous Consideratins 11.12杂项Consideratins 11.13 Crystallization 11.13结晶 11.14 Meiting 11.14梅亭 11.15 The Glass Transition 11.15玻璃化转变 11.16 Melting and Glass Transition Temperatures 11.16熔点和玻璃化转变温度 11.17 Factors That Influence Meltiong and Glass Transition Temperatures (CD-ROM)S-87 11.17 Meltiong和玻璃化转变温度（CD - ROM）的S - 87的影响因素 ， 12.Electrical Properties 12.Electrical属性 12.1 Introduction 12.1简介 12.2 Ohms Law 12.2欧姆定律 12.3 Electrical Conductivity 12.3电导率 12.4 Electronic and Ionic Conduction 12.4电子和离子传导 12.5 Energy Band Structures in Solids 12.5能源固体能带结构 12.6 Conduction in Terms of Band and Atomic Bonding Models 12.6乐队条款和原子键合模型的传导 12.7 Electron Mobility 12.7电子迁移率 12.8 Electrical Resistivity of Metals 12.8金属的电阻率 12.9 Electrical Characteristics of Commercial Alloys 商业合金12.9电气特性 12.10 Intrinsic Semiconduction 12.10内在Semiconduction 12.11 Extrinsic Semiconduction 12.11外在Semiconduction 12.15 Conduction in Ionic Materials 12.15离子材料的导电性 12.16 Electrical Properties of Polymers 12.16聚合物的电学性能 14.Synthesis,Fabrication,and Processing of Materials (CD-ROM)S-118 14.Synthesis，制造，加工材料（CD - ROM）的S - 118 14.1 Introduction S-119 14.1介绍的S - 119 14.2 Forming Operations S-119 14.2成型操作的S - 119 14.3 Casting 14.3铸造 14.4 Miscellaneous Techniques 14.4杂项技术 14.5 Annealing Processes 14.5退火过程 14.6 Heat Treatment of Steels 14.6钢的热处理 14.7 Fabrication and Processing of Glasses 14.7加工，眼镜加工 14.8 Fabrication of Clay Products 14.8粘土制品的制备 14.9 Powedr Pressing 14.9 Powedr按 14.10 Tape Casting 14.10磁带铸造 14.11 Polymerizatin 14.11 Polymerizatin 14.12 Polymer Additives 14.12聚合物添加剂 14.13 Forming Techniques for Plastics 14.13塑料成型技术 14.14 Fabrication of Elastomers 14.14弹性体的制备 14.15 Fabricatin of Fibers and Films 14.15 Fabricatin纤维和薄膜 15.Composites(CD-ROM)S-162 15.Composites（CD - ROM）的S - 162 15.1 Introduction 15.1简介 15.2 Large-Particle Composites 15.2大颗粒复合材料 15.3 Dispersion-Strengthened Composites 15.3弥散强化复合材料 15.4 Influence of Fiber Length 15.4纤维长度的影响 15.5 Influence of Fiber Orientation and Concentration 15.5纤维取向和浓度的影响 15.6 The Matrix Phase 15.6基 体相 15.7 The Matrix Phase 15.7基体相 15.8 Polymer-Matrix Composites 15.8聚合物基复合材料 15.9 Metal-Matrix Composites 15.9金属基复合材料 15.10 Ceramic-Matrix Composites 15.10陶瓷基复合材料 15.11 Carbon-Carbon Composites 15.11碳碳复合材料 15.12 Hybrid Composites 15.12混合复合材料 15.13 Processing of Fiber-Reinforced Composites 15.13处理的纤维增强复合材料 15.14 Laminar Composites 15.14层复合材料 15.15 Sandwich Panels 15.15夹心面板 16.Corrosion and Degradation of Materials (CD-ROM) 16.Corrosion和材料降解（CD - ROM） 16.1 Introduction 16.1简介 16.2 Electrochemical Considerations 16.2电化学注意事项 16.3 Corrosion Rates 16.3腐蚀速率 16.4 Prediction of Corrosion Rates 16.4腐蚀速率预测 16.5 Passivity 16.5无源 16.6 Environmental Effects 16.6环境影响 16.7 Forms of Corrosion 16.7腐蚀形式 16.8 Corrosion Environments 16.8腐蚀环境 16.9 Corrosion Prevention 16.9腐蚀预防 16.10 Oxidaton 16.10 Oxidaton 16.11 Swelling and Dissolution 16.11肿胀和解散 16.12 Bond Rupture 16.12键断裂 16.13 Weathering 16.13风化 17.Thermal Properties(CD-ROM) 17.Thermal属性（CD - ROM） 17.1 Introduction 17.1简介 17.2 Heat Capacity 17.2热容 17.3 Thermal Expansion 17.3热扩展 17.4 Thermal Conductivity 17.4导热系数 17.5 Thermal Stresses 17.5热应力 18.Magnetic Properties 18.Magnetic属性 18.1 Introduction 18.1简介 18.2 Basic Concepts 18.2基本概念 18.3 Diamagnetism and Paramagnetism 18.3抗磁性及顺磁性 18.4 Ferromagnetism 18.4铁磁 18.5 Antiferromagnetism and Ferrimagnetism 18.5反铁磁性和亚铁磁性 18.6 The Influence of Temperature on Magnetic Behavior 18.6温度的磁行为的影响 18.7 Domains and Hysteresis 18.7域名和迟滞 18.8 Soft Magnetic Materials 18.8软磁性材料 18.9 Hard Magnetic Materials 18.9硬磁材料 18.10 Magnetic Storage 18.10磁存储 18.11 Superconductivity 18.11超导 19.Optical Properties(CD-ROM) 19.Optical属性（CD - ROM） 19.1 Introduction 19.1简介 19.2 Electromagnetic Radiation 19.2电磁辐射 19.3 Light Interactions with Solids 19.3光的相互作用与固体 19.4 Atomic and Electronic Interactions 19.4原子和电子的相互作用 19.5 Refraction 19.5折射 19.6 Reflection 19.6反思 19.7 Absorption 19.7吸收 19.8 Transmission 19.8传输 19.9 Color 19.9颜色 19.10 Opa