Genesis操作指引.doc

Genesis 操作指引序号流程菜单或命令注意事项1Input原稿文件含Wheel 文件,并创建job及edit stepIdentify Translate注意不规则光圈表和钻孔前后省零读入的正确性2层命名层排序定义层属性Job matrix popup按板由上到下排序3对齐所有层editmove 或register4增加rout 层和Copy定义Profile外围线生成rout 层并建立profilerout 层要定义属性5定义Origin 和datumSnap popuporigStepdatum pointOrigin datum 全部定于profile 的左下角6原稿层复制做备份Job matrix popup 中copy属性为misc7a文字层成型线 外文字移入/或删除7b删除profile以外的东西以及成型线Editclip area外层防焊文字正性内层删除成型线,其余保留8a删除多余的线Dfm redundancy cleanup redundancy line removal8b自动转padDfmcleanupconstruct pads先转防焊后参照防焊转线路, 转pad 后检查正确是否9Compare 转pad后的线路,防焊选Layer menu 下graphic compare或目视比较，尤其注意BGA 位10a定义孔的属性Drill tools manager10b产生reference netlistActionsnetlist analyzer11a加大钻嘴Drill tools manager正确定义孔属性(via pth npth) 客户未提供钻孔时分孔图转钻孔11b有slot 时pad to slots或add slot.12钻孔与焊盘对齐Dfmrepairpad snapping注意所有层向L1 层对齐13Open checklist orig 分析客户资料AnalysisDrill checkspower ground check 内层正性signal layer checks signal layer checks solder mask checks silk screen checks14a修改内层菲林 (负性) 优化隔离pad, 功 能pad 内削铜箔Dfmoptimizationpower ground opt加宽边框线14b修改内层菲林 (正性)删除独立 pad 和npth pad补偿线宽优化线路加泪滴 (指内层条)填小间隙内削铜箔dfmredundancy clenauynfp removalisolated pads dfmyield improvementetchcompensate或手动补偿 dfmoptimizationsignal layer opt或 dfmoptimizationpositive plane opt dfmyield improvementadvanced teardrops creation dfmsliversliver´加大rout 层反掏15Open checklistinn分析内层资料Analysispower ground check内层正性signal layer checks16比较原稿Compare 或手动对比17netlist 比较Actionsnetlist analyzer18Pnl1 排板与编辑(单pcs 排板跳过此步骤)Steppanelizationpanel size Steppanelizationstep&repeattableSteppanelizationS&R edit19Pnl1自动加板边(script)快捷键F8/是否单pnl1 加logo等20Panel排板与编辑Steppanelizationpanel sizeSteppanelizationstep&repeattableSteppanelizationS&R edit21Panel自动加板边(script)快捷键F822加内层平行曝光机,PE机和外层曝光机定位孔23自动加尾孔,切片孔和输出钻孔程序快捷键F924输出内层光绘资料与map 图及TGZ 文件压缩为*.RAR 放入服务器25定义SMD 属性Dfmcleanupset smd attribute26修改外层菲林 删除 npth pad补偿线宽 补偿SMD 外层优化 加泪滴 (指内层条) 填小间隙 npth 挖铜 内削铜箔 填针孔dfmredundancy clenauynfp removalnpth pads手动补偿线dfmyield improvementetchcompensate补偿SMD dfmoptimizationsignal layer opt dfmyield improvementadvancedteardrops creationdfmsliversliver´加大npth 孔反掏加大rout 层反掏Dfmrepairpinhole elimination27Open checklist out 分析外层工作稿Analysissignal layer checks28比较原稿Compare 或手动对比29修改防焊菲林金手指及IC是否开通窗加挡点Dfmoptimization solder mask opt30Open checklist mask 分析防焊工作稿Dfmoptimization solder mask checks31比较原稿Compare 或手动对比32netlist比较Actionsnetlist analyzer33修改文字菲林Dfmoptimizationsilk screen opt