SOP封装工艺流程的介绍.ppt

SOPASSEMBLYPROCESSFLOW QUALITYCONTROLINSTRUCTION Contents PackageInstructionProcessFlowQualityControl PackageInstruction SOP SSOP 3 TSSOP 4 MFP ASE ASE PackageInstruction ASYprocessflow WaferSaw DieAttach WireBond WaferMount WaferGrinding EpoxyCure Molding PostMoldCure Plating Trim Form Packing Shipping De junk LaserMarking 前段制程 后段制程 Wafer Die chip DieonLeadframe Before After LaserMarking LaserMarking LaserMarking WaferGrinding LOAD UNLOAD GRINGING Purpose GrindingthewafertoCustomerrequiredthickness WaferGrinding 晶圓 未研磨 研磨機 晶圓 研磨後 晶元背面Waferbackside Frame MountTape Purpose CombinethewaferwithDicingtapeontotheframefordiesawing WafermountMachine WaferMount Frame Purpose Toseparatediesfromeachotherfordieattach Monitor Load Unload Sawing Cleaning Machine WaferSaw Beforewafersaw Afterwafersaw WaferSaw Purpose Attachthedieswithepoxyonsubstrateforthefollowingprocess DieAttach Output Diebond Substrateloadbond Workingflow DieAttach Robbertip Lead frame Purpose SolidifytheepoxyafterD A Inside Oven EpoxyCure Purpose Connectingthechipandtheexteriorcircuit input Theory Useultrasonic thermal forcetoformtheintermetallicbetweengoldenwireandjointmetal Al Au Ag WireBond MoldMachine Molding Purpose SealtheproductwithEMCtopreventdie goldwirefrombeingdamaged contaminatedandoxygenic Molding Molding Topchase Airvent Bottomchase Cavity Leadframe Plunger Pot Gateinsert Runner Compound Bottomcullblock Topcullblock Molding Molding Topchase Airvent Bottomchase Cavity Leadframe Pot Gateinsert Runner Compound Bottomcullblock Topcullblock Plunger Molding Molding Topchase Airvent Bottomchase Cavity Leadframe Pot Gateinsert Runner Compound Bottomcullblock Topcullblock Plunger Molding AfterMold Molding Topchase Airvent Bottomchase Cavity Leadframe Pot Gateinsert Runner Compound Bottomcullblock Topcullblock Plunger Purpose UselaserlightirradiatedbyCO2orYAGtovapourtheEMCtoshowcontentonthepackage suchasdate schedule placeofproductionandsoon LaserMarking laser EMCvapoured Before After Lasermarking Oven Inside Purpose ToletEMCreactcompletelysothatproductscanbeprotectedmoreeffectively Postmoldcure De junk Purpose Removethedem barofleadframe Workingarea Before After LaserMarking LaserMarking Plating Purpose ToplatingSnontheleadwhichwillmountonboardpad load unload Platingline Plating After Before Purpose Removethetie barandlead frameandformproductstounitsfromstrips fillthemintotubesandthenpasstonextprocess TrimForm Sawworkarea unload Workingarea unload Lasermarking TrimForm Workingarea Lasermarking LeadCut Forming QualityControl DieSaw 切偏 Chipping 外观检查 划片宽度量测 Rej Rej QualityControl DieShear EpoxyVoidCheck DieAttach QualityControl EpoxyThickness FilletHeight DieAttach DieLocation Rej QualityControl WireBond 外观检查 第二焊点重叠 Rej Rej Rej Rej 第二焊点偏移 线弧不良 Rej Rej QualityControl 推球测试 拉力测试 WireBond QualityControl WireBond 验证级工程确认 IMCCoverage IMCThickness CraterTest 1stbond 1stbond 2ndbond Looping QualityControl Mold Looping 外观检查 上下错位 孔洞 缺角 溢胶 内部气泡 冲线值量测 Rej Rej Rej Rej Rej Plating 外观检查 Solderabilitytest 镀层厚度量测 QualityControl 170 C烘烤8小时 90 95 C蒸汽老化10小时 锡覆盖率 95 R