PADS逻辑类型说明

中英文大意ANA BGA ball grid array 球栅阵列封装BPF BQF CAP CAPACITOR 电容器 CFP CFP 陶瓷扁平封装 CLC CMO CON CONIN 连接器 CQF DIO DIODE 二极管 DIP Dual In-line Package 双列直插式组件 ECL EDG FUS FUSE 保险丝 HMO HOL IND INDUCTANCE电感 LCC Leadless chip carrier无引脚片式载体 MOS Metal Oxide Semiconductor金属氧化物半导体 OSC Open Source Commerce振荡器PFP PGA butt joint pin grid array 碰焊 (pin grid array) PLC POT POTENTIOMETER可变电阻器 PQF PSO QFJ CLCC(ceramic leaded chip carrier)也称QFJ,QFJ-G QFP quad flat package四侧引脚扁平封装 QSO RES Resistor电阻器 RLY RLY继电器 SCR Silicon Controlled Rectifier可控硅 SKT SOI small out-line I-leaded packageI形引脚小外型封装 SOJ Small Out-Line J-Leaded Package (J形引脚小外型封装) SOP small Out-Line package (小外形封装) SSO SWI SWITCH开关 TQF TRX Transistor (三极管 TSO TTL Transistor-Transistor Logic (BJT-BJT逻辑门 VSO XFR XFMR 变压器 ZEN ZENER齐纳二极管 UND 增加 SIP single in-line package 直插式组件 photoelectric coupler (光电耦合器 LED Light Emitting Diode 发光二极管 TVS Transient Voltage Suppressor (瞬态电压抑制二极管) FB Ferrite bead (磁珠) TP TEST POINT (测试点 MIC MICROPHONE (麦克风) BQFP BQFP(quad flat package with bumper) 带缓冲垫的四侧引脚扁平封装 CLCC ceramic leaded chip carrier (带引脚的陶瓷芯片载体) COB chip on board (板上芯片封装) DFP dual flat package (双侧引脚扁平封装)(是SOP 的别称) FP flat package (扁平封装) FQFP fine pitch quad flat package (小引脚中心距QFP) CQFP quad fiat package with guard ring (带保护环的四侧引脚扁平封装) HSOP H-(with heat sink)HSOP 表示带散热器的SOP LQFP low profile quad flat package (薄型QFP) SMD surface mount devices (表面贴装器件) CPGA Ceramic Pin Grid Array ZIP Zig-Zag Inline Package 之字型直插式封装