产品研发管理（流程）

C-System Introduction will cover,Role & Responsibility (R&R)ProcessCx Stage:C0: Proposal phase 構想階段C1: Planning phase 規劃階段C2: R&D Design phase 設計階段C3: Lab Pilot Run phase 樣品試作階段C4: Eng Pilot Run phase 工程試作階段C5: PD Pilot Run phase 試產階段C6: Mass Production phase 量產階段,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Wistron C-System Quality Control,ProposalPhase,PlanningPhase,R&DDesignPhase,LabPilot-runPhase,EngineeringPilot-runPhase,ProductionPilot-runPhase,MassProductionPhase,C0,C1,C2,C3,C4,C5,CheckPoint,Wistron C- Phase,Availability,Develop,Plan,Launch,FAI & SPCMTBF DemoCIP/CLCAPareto AnalysisEWG ReadyAFR,Test ReportsPre-QVL ReadyDiagnostics ProgramBug List & ActionDCN/ECN/ECR FAI report PFMEASQRC,TrainingMTBF ReviewQMP/QPA/QSAFPYRPPAPServiceability,Design,Test PlansIntegrate Design Review Signal QualityDFX IndexInitial Supplier AuditMemorandumDFMEASimulationMTBF EstimateMVP,Concept/Proposal,MRS Definition ScopeSCE,Product Life Cycle,MDRR/C4Go/ No Go?,MRR/C5Go/ No Go?,C6,OOB/OBA,ORT/Stress,EWG/FQH,AFR/DOA,New C System Architecture,Progress,Time,Detail Activities,SubjectScopeDefinitionProcedure.,Activities Definition,Record & Report,Format Definition,Escalation Rule,MeasurementStandard,Project Management & System Maintenance,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng. Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list review,C4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts list,C5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test report,PM,PM,C0 meeting,C1 meeting,PM,C1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request form,C2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklistProduct phaseout notice,C0 ChecklistMRS,C0/PM,C0 Meeting,C0-工作重點及檢核項目,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng. Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list review,C4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts list,C5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test report,PM,PM,C0 meeting,C1 meeting,PM,C0 ChecklistMRS,C2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklistProduct phaseout notice,C1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request form,C1/PM,C1 Meeting,C1-工作重點及檢核項目,Case - bottle Coca in England,開採鋁礦,一噸鋁土提鍊半噸氧化鋁半小時加工,半噸氧化鋁熔煉成1/4噸金屬鋁再加工二週成鋁錠,瑞典或梛威熔爐工廠,澳大利亞,澳大利亞化學還原工廠,加熱至華氏900度壓延成1/8 inch薄片,瑞典和德國壓延廠,船運一個月,冷軋成1/80 inch薄片,冷軋廠,英國易開罐廠,成型，清洗，烘乾，防鏽,裝填，印刷,英國可樂廠,消費,鋁罐回收儘16%,Ecological Rucksack (生態包袱),生產一片半導體晶片所產生之廢料為產品重量之十萬倍生產一台筆記型電腦所產生之廢料為產品重量之四千倍生產一公升佛羅里達橘子汁需要兩公升汽油及一千公升之水生產一噸紙需用掉九十八噸之其他資源 資料來源 : 綠色資本主義 天下出版社,EU RoHS Directive,指令期程2003.01.27 指令發布2003.02.13 歐盟公報發行,指令生效2004.08.13 轉為會員國當地法律,法規或行政指令2006.07.01 新投入之產品不得含有禁用物質指令要求/禁用項目鉛 (Pb)鎘 (Cd)汞 (Hg)六價鉻 (Cr6+)多溴聯苯(PBB)多溴化二苯乙醚(PBDE),(The restriction of the use of certain hazardous substances in electrical and electronic equipment),EU RoHS 管制規格,重金屬：汞、鉛、鎘、六價鉻溴性耐燃劑：聚溴聯苯(PBBs)、溴聯苯醚(PBDEs),註：另有管制規範外的項目,EU WEEE Directive,Directive 2002/96/EC期程2003.01.27 指令發布2003.02.13 歐盟公報發行，指令生效2004.08.13 轉為會員國當地法律,法規或行政指令2005.08.13 完成回收系統建構,製造商因應回收之 財務規劃就緒2006.12.31 回收再利用率達每人每年4kg2008.12.31 訂定下階段目標回收Target of Recovery and Recycling,(Waste Electrical and Electronic Equipment),New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng. Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list review,C4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts list,C5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test report,PM,PM,C0 meeting,C1 meeting,PM,C0 ChecklistMRS,PM,C1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request form,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklistProduct phaseout notice,C2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecification,C2/PM,C2 Meeting,C2 -工作重點及檢核項目,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng. Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts list,C5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test report,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklistProduct phaseout notice,C3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork packing drawingPAL/ROM data listingC3 manufacturability review reportSample approve status & bug list review,C3/PM,C3 Meeting,C3 -工作重點及檢核項目,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng. Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list review,C5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test report,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklistProduct phaseout notice,C4 checklistBOMQVLTime standardSystem BIOS/KBC FW releaseS/W Driver/AP/Utility/Diagnostic release EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts list,C4/PM,C4 Meeting,Wistron Mobile Reliability Test Plan,Environment Thermal Profile Test Temperature and Humidity Test Vibration, Shock, Drop Tests Altitude Test, Acoustics Tests MTBF Prediction,EMC Lightning/Surge Test Voltage Dip Test EFT, ESD Test Harmonic Test IEC1000-4-XX EMI/EMS,Power Line Interference Line Voltage/Frequency Test Power Surge Test Voltage Dip and Interruption Power On/Off Test EFT/B Immunity Test Complex Margin Test,Transportation Vibration Test Altitude Test Shock Test Drop Test,User Incline Operation Test Bench Handling Test Power Saving Test Pressure Test Audio Quality Torture Test,Reliability Test LCD Module,Wistron Mobile Reliability Test Plan,Wistron Mobile Reliability Test - LCD,C4 -工作重點及檢核項目,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng. Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list review,C4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts list,PM,PM,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklistProduct phaseout notice,C5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspect