电气工程师常用缩略语

Abbreviations/AcronymsTopic: 电平种类接口种类通信方式SATA: Serial Advanced Technology Attachment（串行高级技术附件，一种基于行业标准的串行硬件驱动器接口）; USB有提供bus power的优势，这是SATA或eSATA所无法媲美USB的地方USB: Universal Serial BusUSB1.0: 1.5MbpsUSB1.1 (Full Speed): 12MbpsUSB2.0 (High Speed): 480Mbps半双工, 二线制总线, 0.5AUSB3.0 (Super Speed): 5Gbps全双工, 对偶单纯形四线制差分信号线, 1A. USB 3.0 并没有采用设备轮询，而是采用中断驱动协议。因此，在有中断请求数据传输之前，待机设备并不耗电。简而言之，USB 3.0支持待机、休眠和暂停等状态。请求包（IRP）令牌包 PID循环冗余校验（CRC）NCQ（Native Command Queuing，原生命令队列）PSC: Programmable series controller SSVP: Sub-System Verification ProcedureTST: Technical Systems Testing？SDD: Software Design DescriptionHDD: Hardware Design DescriptionADW: Assembly DrawingSRS: Software Requirements SpecificationDRS: Design Requirement SpecificationDHF: Design History FileJIG: Joint Industry GuideFOV: Field of ViewRCIM: Remote Control Interface Module(远程控制接口模块) DAP: DoseIQST: 图像质量校准测试？ASARA：As Low As Reasonably AchievableWS: Wall StandHWVP: Hardware Verification Procedure?HALT: Highly Accelerated Life Testing(高加速寿命试验)OOC: Out of CatalogePDM: BUC:ETL:ETA: Estimated Time of ArrivalMTBF: Mean Time Between Failures MTBC: Mean Time between Customers Calls RBD: Reliability Block Diagram PDF: Probability Density Function NFF: No Failure Found IB: Installed Base CL: Confidence Level B10: The time at which 10% of the components have failedRTC: Real Time ClockFDA: Food and Drug Administration美国食物与药品管理局ECM: Employee Control MeetingRCN: 本底噪声？SFDA: State Food and Drug Administration国家食品药品监督管理局ISP: In-System Programming指电路板上的空白器件可以编程写入最终用户代码， 而不需要从电路板上取下器件，已经编程的器件也可以用ISP方式擦除或再编程。BSP: Board support package PCI-E: DMS : Defect Management SystemFMEA: Failure Modes and Effects Analysis. A safety analysis intended to identify potential safety risks and the effects that can occur if it occurs. FRU - Field Replaceable Unit. The part or Sub-assembly can be replaced by service. FTA - Fault tree analysis. A safety analysis intended to identify potential safety risks and the effects that can occur if it occurs. GMP - Good Manufacturing Practices. As defined by 21 CFR, Part 820. MTBF-Mean Time Between Failure MTTD - Mean Time To Diagnose Prototype - Initial development units NOT intended to be sent to a customer Pilot - An initial shipment of manufacturing built units, typically less than 10 units, intended to validate the sales, manufacturing and service processes for a new product. SPR - System Problem Report. A system used internal to GEHC to track issues and their resolution. FMI Field Modification InstructionESD: Electrostatic DischargeXHCI: eXtensible Host Controller Interface可扩展的主机控制器接口EHCI: Enhanced Host Controller Interface增强型主机控制器接口OHCI: UHCI: 标准测试与编程语言（Standard Test And ProgrammingLanguage，STAPL）CMT Cause Mitigation Table CTQ Critical To Quality DHF Design History File DMR Device Master Record ECCB Engineering Change Control Board ECOECO Engineering Change Order ECRECR Engineering Change Request FMEA Failure Modes and Effects Analysis FMECA Failure Modes and Effects Criticality Analysis FTA Fault Tree Analysis HLB High Level Buy LSD Lead System Designer MRP Material Requirements Planning/Manufacturing Resource Planning NRTL Nationally Recognized Testing Laboratory PDM Product Data Management system (including MyWorkshop, Agile, eMatrix) RA Regulatory Affairs RACRAC Risk Assessment and Control RMR Risk Mitigation Required (from Risk Management) SDLC Software Development Life Cycle UA Unacceptable (from Risk Management)ASPApplication Support PackageCCAClear Channel AssessmentCRCCyclic Redundancy CheckFFDFull Function DeviceGPIOGeneral Purpose Input/OutputGTSGuaranteed Time SlotISRInterrupt Service Routine中断服务例程IRQInterrupt RequestLNALow Noise AmplifierMACMedium Access Control介质接入控制子层MCPSMAC Common Part SublayerMCU Micro Control UnitMLME MAC sub Layer Management EntityNWKNetworkPAPower AmplifierPAN Personal Area Network个人区域网络WPANwireless personal area network无线个人区域网络LR-WPANLow rate WPAN低速率无线个人区域网络PHYPHYsical LayerPIBPAN Information BaseRAMRandom Access MemoryRFDReduced Function DeviceSAP Service Access PointXMLExtensible Markup Language 可扩展标记语言OSIOpen System Interconnection开放系统互连ZDOZigBee设备对象HALHardware Abstraction Layer硬件抽象层OSALOperating System Abstraction Layer操作系统抽象层Operating System Adaptation Layer操作系统适配层DSSS直扩序列调制FFDfull-function device全功能设备RFDreduced-function device精简功能设备NVRAMNon-Volatile Random Access Memory非易失性随机访问存储器ISP: Internet Service ProviderICP: Internet Content ProviderUART: Universal Asynchronous Receiver/TransmitterSPI: Serial Peripheral Interface(串行外设接口)I2C: InterIntegrated Circuit (两线式串行总线)SSI: Synchronous Serial Interface (同步串行接口)RS232RS422RS485DTR（Data Terminal Ready数据终端就绪）DSR（Data Set Ready数据预备好）RTS（Request To Send请求发送）CTS（Clear To Send清除发送）TXD: Transmit DataRXD: Receive DataTDI测试数据输入TDO测试数据输出TMS测试模式选择TCK测试时钟输入TRST测试复位输入SOPC：System-on-a-Programmable-Chip，即可编程片上系统。 用可编程逻辑技术把整个系统放到一块硅片上，称作SOPC。可编程片上系统（SOPC）是一种特殊的嵌入式系统：首先它是片上系统（SOC），即由单个芯片完成整个系统的主要逻辑功能；其次，它是可编程系统，具有灵活的设计方式，可裁减、可扩充、可升级，并具备软硬件在系统可编程的功能。LE: 逻辑单元LE（logic element）LAB: 逻辑阵列块,或称逻辑块(LB) OE：GUI: 图形用户界面（Graphical User Interface）LUT: 查找表(Look-Up-Table,)Focal SpotGeometrical point in the X-ray Tube where the X-ray beam is generated. SIDSource Image Distance. The distance between the X-ray focus and the Image Receptor Reference Plane.SFDSource Fringe Distance. The distance between the X-ray focus and the collimator entrance plane.FOVField of View. It refers to the greatest projection area allowed in the Image Receptor Reference Plane CANController Area Network, a standardized serial bus system.CANopenA CAN-based higher layer protocol.API (Application Program Interface)，应用软件接口NMT (Network Management)SDO：服务数据对象(Service Data Objects)LDO: 低压差线性稳压器Low Dropout RegulatorSQCS: 供应商质量交互系统SCR: 供应商更改申请SCN: 供应商更改通知ECO: 工程更改命令(要求供应商承认)ECR: 但工程更改请求(不要求供应商承认)SCAR: 供应商纠正措施申请LTB: Last Time BuyAC 交流 MIPS 每秒百万条指令ADC 模数转换器 OCD 片上调试API 应用程序编程接口 PCB 印刷电路板CMOS 互补金属氧化物半导体 PDIP 塑料双列直插封装CPU 中央处理器 PGA 可编程增益放大器CRC 循环冗余校验 POR 加电复位CT 连续时间 PPOR 精密加电复位DAC 数模转换器 PRS 伪随机序列DC 直流 PSoC 可编程片上系统 (Programmable System-on-Chip )DTMF 双音多频 PWM 脉冲宽度调制器EEPROM 可电擦除可编程只读存储器 QFN 四方扁平无引脚器件GPIO 通用 I/O SAR 逐次逼近寄存器ICE 在线仿真器 SC 开关电容IDE 集成开发环境 Integreted Developer EnvironmentSLIMO 低速 IMOILO 内部低速振荡器 SOIC 小外形集成电路IMO 内部主振荡器 SPI 串行外设接口I/O 输入 / 输出 SRAM 静态随机存取存储器IrDA 红外数据关联性 SROM 监控只读存储器ISSP 在系统串行编程 TQFP 薄型四方扁平封装LCD 液晶显示器 UART 通用异步接收器 / 发射器LED 发光二极管 USB 通用串行总线LPC 低功耗