Wire-Bond-Introduction(焊线动作分解说明)PPT课件

,CONTENTS,ASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT,封裝簡介,晶片Die,金線GoldWire,導線架Leadfram,WaferGrinding,DieBonding,WaferSaw,toaster,WireBonding,DieSurfaceCoating,Molding,LaserMark,SolderBallPlacement,Singulation,Packing,封裝流程,DejunkTRIM,SolderPlating,SolderPlating,FORMING/Singulation,TRIM/FORMING,BGA,SURFACEMOUNTPKG,THROUGHHOLEPKG,WireBond原理,pad,lead,Goldwire,BallBond(1stBond),WedgeBond(2ndBond),Al,B.PRINCIPLE,銲接條件,HARDWELDINGPressure(Force)Amplify&FrequecyWeldingTime(BondTime)WeldingTempature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power),BondingProcess,TheWireBondTemp,PREHEATBONDSITECUL/F200+/-10200+/-10ALL/F210+/-10230+/-10BGA150+/-10160+/-10TFBGA150+/-10160+/-10LBGA150+/-10160+/-10NOTINCLUDEDEDICATELINE,pad,lead,Freeairballiscapturedinthechamfer,pad,lead,Freeairballiscapturedinthechamfer,SEARCHHEIGHT,pad,lead,Freeairballiscapturedinthechamfer,SEARCHSPEED1,SEARCHTOL1,Freeairballiscapturedinthechamfer,pad,lead,SEARCHSPEED1,SEARCHTOL1,Freeairballiscapturedinthechamfer,pad,lead,SEARCHTOL1,SEARCHSPEED1,Freeairballiscapturedinthechamfer,pad,lead,SEARCHTOL1,SEARCHSPEED1,Freeairballiscapturedinthechamfer,pad,lead,SEARCHTOL1,SEARCHSPEED1,Formationofafirstbond,pad,lead,SEARCHSPEED1,SEARCHTOL1,Formationofafirstbond,pad,lead,SEARCHSPEED1,SEARCHTOL1,IMPACTFORCE,FormationofafirstbondContact,pad,lead,heat,PRESSURE,UltraSonicVibration,FormationofafirstbondBase,pad,lead,UltraSonicVibration,heat,PRESSURE,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,RH,Formationofaloop,pad,lead,RD(ReverseDistance),Formationofaloop,pad,lead,pad,lead,pad,lead,CalculatedWireLength,WIRECLAMPCLOSE,pad,lead,CalculatedWireLength,pad,lead,SEARCHDELAY,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,2ndSearchHeight,SearchSpeed2,SearchTol2,2ndSearchHeight,pad,lead,SearchSpeed2,SearchTol2,pad,lead,SearchSpeed2,SearchTol2,Formationofasecondbond,pad,lead,heat,FormationofasecondbondContact,pad,lead,heat,heat,pad,lead,heat,heat,FormationofasecondbondBase,pad,lead,TailLength,pad,lead,TailLength,pad,lead,TailLength,pad,lead,Taillength,TailLength,pad,lead,Disconnectionofthetail,pad,lead,Disconnectionofthetail,pad,lead,Disconnectionofthetail,pad,lead,Formationofanewfreeairball,pad,lead,Formationofanewfreeairball,Material,LeadframCapillaryGoldWire,Leadfram(I),Leadfram(II),CAPILLARY(I),CapillaryManufacturer(SPT,GAISER,PECO,TOTO)CapillaryData(Tip,Hole,CD,FA&OR,IC),CAPILLARY(II),CAPILLARY(III),HowToDesignYourCapillary,TIP.PadPitchPadpitchx