plasma 原理及设备介绍PPT课件

.,1,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,1.等离子清洗技术介绍-2page2.气体离子化的过程介绍-37page3.等离子清洗原理介绍-810page4.等离子清洗应用-11page4.1金属表面去油及清洁-1214page4.2等离子刻蚀-15page4.3刻蚀和灰化-1618page4.4塑料、玻璃和陶瓷的表面活化和清洁-1920page4.5等离子涂镀-20page5.清洗前后产品比对-2127page8.DualChamberDirectPlasma(VSP-88DPro)-2831page9.PlasmaCleaningSystemVSP88H-3234page10.InlineDirectPlasmaCleaningSystemVSIP88D-3537page,.,2,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,等离子清洗技术清除金属、陶瓷、塑料表面的有机污染物，可以显著加强这些表面的粘性及焊接强度。离子化过程能够容易地控制和安全地重复。如果有效的表面处理对于产品的可靠性或过程效率的提高是至关重要的，那么等离子技术对你也许就是最理想的技术。通过表面活化、蚀刻、表面沉积，等离子技术可以改善绝大多数物质的性能：洁净度、亲水性、斥水性、粘结性、标刻性、润滑性、耐磨性。,.,3,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,“离子化的气体”,等离子清洗原理就是在一组电极施以射频电压（频率约为几十兆赫兹），电极之间形成高频交变电场，区域内气体在交变电场的激荡下，形成等离子体，活性等离子对被清洗物进行物理轰击与化学反应双重作用，使被清洗物表面物质变成粒子和气态物质。使被清洗物表面物质变成粒子和气态物质，经过抽真空排出，而达到清洗目的。,.,4,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,为了生成Plasma，需要对自然状态的原子或分子进行离子化.为了进行离子化，必须加上很高的热(Energy).即需要数十万度或数百万度的高温.但是加上高的电极的话，在低温状态下也可以对原子或分子进行离子化.,Nucleus(NeutronsProtons),Electron(e-),.,5,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,.,6,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,因压力高使粒子增多的话，平均行程距离(MeanFreePass)缩短，所以即使电压高也很难进行离子化.-压力低的话可降低撞击的概率，所以需要适当的压力.,500V,10-3,为了使Plasma容易生成离子化，需要适当的压力和适当的电压.,.,7,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,.,8,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,表示的是使用Argon,O2及H2Plasma的洗净原理.ArgonPlasma使用于把表面污染物物理的去除.H2Plasma是和表面的O2反映生成H20，O2Plasma是和C反映生成CO2来除去污染物.(CH2)n+3/2nO2nCO2+nH2O),Pad,HydrogenPlasma,OxygenPlasma,ArgonPlasma,ChemicalEnergy,ChemicalEnergy,PhysicalEnergy,H,H,H,H,H,O,O,O,O,O,C,C,C,C,C,C,C,C,C,C,C,C,C,C,C,C,O,O,O,C,O,O,O,Ar,Ar,.,9,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,.,10,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,利用Plasma洗净技术是主要活用于围绕半导体的金属,Plastic,玻璃种类的脱脂,洗净及活化上.,.,11,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,等离子表面处理系统现正应用于LCD、LED、IC，PCB，SMT、BGA、引线框架、平板显示器的清洗和蚀刻。等离子清洗过的IC可显著提高焊线强度，减少电路故障的可能性。溢出的树脂、残余的感光阻剂、溶液残渣及其他有机污染物暴露于等离子体区，短时间内就能清除。PCB制造商用等离子蚀刻系统进行去污和蚀刻来带走钻孔中的绝缘物。,.,12,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,一、金属表面去油及清洁金属表面常常会有油脂、油污等有机物及氧化层，在进行溅射、油漆、粘合、健合、焊接、铜焊和PVD、CVD涂覆前，需要用等离子处理来得到完全洁净和无氧化层的表面。在这种情况下的等离子处理会产生以下效果：1.1灰化表面有机层表面会受到化学轰击（氧下图）,在真空和瞬时高温状态下，污染物部分蒸发污染物在高能量离子的冲击下被击碎并被真空带出紫外辐射破坏污染物因为等离子处理每秒只能穿透几个纳米的厚度，所以污染层不能太厚。指纹也适用。,.,13,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,1.2氧化物去除金属氧化物会与处理气体发生化学反应（下图）,这种处理要采用氢气或者氢气与氩气的混合物。有时也采用两步处理工艺。第一步先用氧气氧化表面，第二步用氢气和氩气的混合物去除氧化层。也可以同时用几种气体进行处理。,.,14,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,1.3焊接通常，印刷线路板在焊接前要用化学助焊剂处理。在焊接完成后这些化学物质必须采用等离子方法去除，否则会带来腐蚀等问题。,1.4键合好的键合常常被电镀、粘合、焊接操作时的残留物削弱，这些残留物能够通过等离子方法有选择地去除。同时氧化层对键合的质量也是有害的，也需要进行等离子清洁。,.,15,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,二、等离子刻蚀在等离子刻蚀过程中，通过处理气体的作用，被刻蚀物会变成气相（例如在使用氟气对硅刻蚀时，下图）。处理气体和基体物质被真空泵抽出，表面连续被新鲜的处理气体覆盖。不希望被刻蚀部分要使用材料覆盖起来（例如半导体行业用铬做覆盖材料）。,等离子方法也用于刻蚀塑料表面，通过氧气可以灰化填充混合物，同时得到分布分析情况。刻蚀方法在塑料印刷和粘合时作为预处理手段是十分重要的，如POM、PPS和PTFE。等离子处理可以大大地增加粘合润湿面积。,.,16,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,三、刻蚀和灰化PTFE刻蚀PTFE在未做处理的情况下不能印刷或粘合。众所周知，使用活跃的碱性金属可以增强粘合能力，但是这种方法不容易掌握，同时溶液是有毒的。使用等离子方法不仅仅保护环境，还能达到更好效果。（下图）,.,17,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,等离子结构可以使表面最大化，同时在表面形成一个活性层，这样塑料就能够进行粘合、印刷操作。,.,18,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,PTFE混合物的刻蚀PTFE混合物的刻蚀必须十分仔细地进行，以免填充物被过度暴露，从而削弱粘合力。,处理气体可以是氧气、氢气和氩气。可以应用于PE、PTFE、TPE、POM、ABS和丙烯。,.,19,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,四、塑料、玻璃和陶瓷的表面活化和清洁塑料、玻璃、陶瓷与聚丙烯、PTFE一样是没有极性的，因此这些材料在印刷、粘合、涂覆前要进行处理。同时，玻璃和陶瓷表面的轻微金属污染也可以用等离子方法清洁。等离子处理与灼烧处理相比不会损害样品。同时还可以十分均匀地处理整个表面，不会产生有毒烟气，中空和带缝隙的样品也可以处理。不需要用溶剂进行预处理所有的塑料都能应用具有环保意义占用很小工作空间成本低廉等离子表面处理的效果可以简单地用水来验证，处理过的样品表面完全被水润湿。长时间的等离子处理（大于15分钟），材料表面不但被活化还会被刻蚀，刻蚀表面具有最大润湿能力。常用的处理气体为：空气、氧气、氩气、氩氢混合气体、CF4等,.,20,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,五、等离子涂镀聚合在涂镀中两种气体同时进入反应舱，气体在等离子环境下汇聚合。这种应用比活化和清洁的要求要严格一些。典型的应用是保护层的形成，应用于燃料容器、防刮表面、类似PTFE材质的涂镀、防水涂镀等。涂镀层非常薄，通常为几个微米，此时表面的亲和力非常好。常用的有3种情况防水涂镀环己物类似PTFE材质的涂镀-含氟处理气体亲水涂镀-乙烯醋酸,.,21,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,LCDGlassCleaning,.,22,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,Acrylsheet,PC(polycarbonate),Siliconsheet,PE(polyetylene),Power:200WSpeed:20100mm/sec,VariousMaterialtreatment,.,23,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,WaferPR,AFMtip,LCDPI,MEMSsensor有机物,Test,Ashing,.,24,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,应用范围:重金属(Au,Ag,Pd)的表面还原长时间放置产品的表面还原,处理前,处理后,Test,Reduction,.,25,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,Coating,Plating,Printing,Taping,Molding,ApplicationArea,Cleaning,And,Bonding,.,26,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,低真空PLASMA:10-1-2(0.10.01Torr)1.Polymer系列:PBGA,CABGA,MMC,MicroBGA,FLIPCHIPCameramodule,ChipLED,TopviewLEDPCBSoldering,GoldPlating2.Glass系列:LCD,PDP,OLED,TouchPanel,Lens中真空PLASMA:10-3-4(0.010.0001Torr)1.CopperLeadframe:TQFP,QFP,LTCC,PLCC2.Ceramics:LTCC,PGA,FLIPCHIP3.HardMetal:SuperBGA,FlexBGA,TABGA,.,27,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,电极设计技术试料Loading方法真空度Gas种类Plasma处理时间Power种类及量7.清洗过程的温度,影响等离子清洗效果的因素,.,28,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,DualChamberDirectPlasma(VSP-88DPro),PRODUCTAPPLICATIONHighthroughputwithdualchambereach6lanetransferring&shortcycletime-Max1200Strip/Hr(Below45mmwidthSubstrate)-YieldImprovementwithexcellentplasmacleaningquality/uniformityPRODUCTFEATURESHighUPHwithexcellentuniformityFullautomaticoperationeasyoperation,.,29,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,PRODUCTSPECIFICATIONpowersource:RFGenerator,13.65MHz,1000wattsVacuumpump:2800L/minoilrotarypump【option:Drypump】Gasflowcontroller:1massflowcontrollerforstandard/Chamber【option:AdditionMFC(O2orothergas)】SubstratewidthMax82mm:4lanes/Chamber:800strip/Hr(adjustable3382mm)Max62mm:5lanes/Chamber:1000strip/Hr(adjustable3362mm)Max45mm:6lanes/Chamber:1200strip/Hr(adjustable3345mm)Available13lanesforwidePCB/substateover82mmwidth,.,30,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,Systemdimension:W1700H1700D1200mmChamberdimensionExternal:W320H113D585mmChamberdimensioninternal:W280H71D430mm(Plasmaarea)Utility:220VAC,3Phase,Air46kgf/cm2PCbasedmaincontrol&Touchscreen:C+LanguageCustomdesignisavailabledependsonintegration/application,BallshareStrength&CPK,.,31,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,Adhesionvaluesareincreasedby89timesafterPlasmaprocess,WirePullStrength&CPKdependsonSubstratePosition,.,32,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,PlasmaCleaningSystemVSP88H,.,33,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,PRODUCTSPECIFICATIONpowersource:RFGenerator,13.65MHz,600wattsVacuumpump:1500L/minoilrotarypumpwith300m3/hGasflowcontroller:1massflowcontrollerforstandard/ChamberSystemdimension:W1200H1850D1000mmChamberdimensioninternal:W600H530D640mmUtility:220VAC,3Phase,25A,Air46kgf/cm2PCbasedmaincontrol&Touchscreen:C+LanguageCustomdesignisavailabledependsonintegration/applicationWeight400kg,.,34,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,FeatureAdoptedtheStainlessSteelmaterialsforVacuumChamberandthespecialinsulatingmethodinorderthatPowertransmitstoonlytargetmaterialDesignedwithverticalloadingmethodtopreventthedamageofbondedwireswhenoperatorloadstargetmaterialstoshelfIncreasedabout20%pointsofcleaningcapabilitybetterthantheexistingequipmentdevelopingtheVerticalShelfforslotmagazineAdoptedtheSwingDoorratherthanUp/DownmethodtoguaranteethesafetyoftheoperatorDesignedtomakethecleaningstateuniformthenozzletothefrontsideofdoorInstalledthevacuumpumptotheinsideofequipmentfor5Sandmountedtheplatewithwheeltoeasilymove,.,35,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,InlineDirectPlasmaCleaningSystemVSIP88D,.,36,Room1017,HuabaoPlazaNo.3065HongxinRd,MinhangDistrict,ShanghaiChina201101Tel:51793931Fix:51793933HomePage:,PRO