塑封基础知识培训PPT课件

-,1,塑封基础知识培训,-,2,樹脂Resin,填充料Filler,硬化劑Curingagent,添加劑Additive,混合Pre-mixing,加熱混練Kneading,冷卻Cooling,粉碎Crushing,混合Blending,錠粒成型Tableting,秤量包裝WeighPackage,EMEProduct,1-EME的原材料和生产过程,-,3,1.1-RawMaterialSupportforEMEInCCP(蓝色为CCP自产）,-,4,环氧树脂,填充剂,添加剂,粉碎、混合、搅拌,塑封料,塑封料生产流程,-,5,2-EME固化（交联）过程2.1-树脂体系,-,6,-,7,2.2-EME固化（交联）程度行为曲线,-,8,3-在充填过程中，EME黏度行为曲线Viscositybehaviorduringfilling,-,9,EME系列胶化时间&螺旋流动长度v.s.模温EMESeriesGelTime&SpiralFlowv.s.MoldingTemperature,-,10,4-成型Molding,冷冻保存(10)ColdStorage(10),回温Stabilizing(20-30,50-70%RH),成型Molding,再保存(必要时)Re-Storage,在成型车间,原封不动.需回温16-24小时.(温度平衡)Keepthepackagesealed.Thaw16-24hoursinmoldingroomcondition,*需重新包装好*回温后72小时内用完Sealuppackageasbeforeitwasopened.,*不要用手直接碰触黑胶.*72小时内使用完毕Donttouchcompoundwithyourbarehand.,4.1.黑胶准备CompoundPreparation,-,11,StorageLifeVSTemp.,EME存储寿命随着存储温度的提高显著短缩。,-,12,成型条件MoldingConditions,-,13,a.锭粒预热PreheatingofPellet,预热前的准备Preparationforstablepreheating*回温充分，赶走湿气Stabilizationofcompoundtemperatureandhumidity*预热时间Preheattime：2040sec.(根据预热设备调整Dependingonpre-heater)*精确的设定Preciseadjustmentof：滚筒间的距离Distancebetweenrollers电极间的距离/水平度Distance/horizontallevelofelectrode如何测量预热温度Howtomeasurethepreheattemp.*确认锭粒表面温度优于确认锭粒内部温度Checkthesurfacetemp.ofpelletsratherthaninsideofpellets,此法之优点Advantagesofthismethod：预热后可快速的进行测量Quickcheckingrightafterheating不会受黑胶本身的影响Notaffectedbytheheatfromcompounditself可以快速、个别地测量锭粒温度Cancheckthetemp.pellettopelletindividually,-,14,b.残留饼厚度/锭重CullThickness/PelletWeight,通过获得合适的残留饼厚度确认锭粒重量是否合适ADJUSTPELLETWEIGHTTOGETPROPERCULLTHICKNESS,理想的厚度IDEALTHICKNESS,太厚TOOTHICK黑胶的浪费，cull固化不完全(COMPOUNDLOSS,UNCUREDCULL),太薄TOOTHIN(不完全充填INCOMPLETEFILL),转进方向Transferdirection,-,15,c.转进压力TRANSFERPRESSURE,正确的判断表压和实际转进压力之间的关系ACCURATEADJUSTMENTISREQUIREDGAUGEPRESSUREVSACTUALPRESSURE,注意NOTE实际的转进压力需要周期性地用压力计校正ACTUALPRESSURESHOULDBECHECKEDPERIODICALLYWITHDILLONGAUGE(FORCEGAUGE)转进头和转进筒需要周期性地进行更换PLUNGERHEADANDTRANSFERPOTSHOULDBEREPLACEDPERIODICALLY.(PREVENTPRESSURELOSS),-,16,转进压力TransferPressure表压和实际的转进压力Gaugepressurev.s.Actualpressure,PrxSr=PpxSpSr=(Dr/2)2Sp=(Dp/2)2Dr:DiameterofRamDp:DiameterofPlungerPp:actualpressuretoPKG.Pr:oilpressureshownonGagewithunitkg/cm2(AlsoallRampressure(=PrxSr)isshownonthesamegagewithunitton)Diesurfaceareadoesntrelateinideal.Butcomplexedrunnerandcavitystructurewillmakepressureloss.,-,17,d.转进速度/时间TRANSFERSPEED/TIME,转进速度是通过转进距离除于转进时间得到的TR.SPEEDISCALCULATEDWITHTR.DISTANCEANDTR.TIMETR.SPEED(CM/SEC)=TR.DISTANCE(L)L=r2hn/R22r:锭粒直径PELLETDIAMETERh:锭粒高度PELLETHEIGHTn:锭粒的颗数NO.OFPELLETS2R:转进筒直径POTDIAMETER锭粒的直径应该要和转进筒的直径相近PELLETDIAMETERSHOULDBECLOSETOPOTDIAMETEREXAMPLE2R=50mm2r=48mm,-,18,e.后固化POSTMOLDCURE,烘箱OVEN为了加热的均匀性，烘箱必需是通过热风扇加热OVENWITHINSIDEHEATINGFANISDESIRABLEFORUNIFORMHEATING固化温度和时间CURETEMP.ANDTIME后固化时间要在烘箱达到合适的温度后开始计时CURETIMESHOULDBECOUNTEDAFTERREACHINGPROPERTEMP.LEVEL,-,19,后固化后各个主要参数的比较PostMoldCureComparison,-,20,5-EME成型常见问题及其对策,充填不良(IncompleteFill)气孔(Voids)麻点(PinHole)溢料（ResinBleed）流痕(Flowmark)黏模(Stick)开裂(Crack)冲线(Wiresweep),-,21,5-1EMC封装成型不良相关因素,-,22,充填不良(IncompleteFill),-,23,充填不良(趋向性）,充填不良(随机性）,-,24,气孔（Void）,-,25,外部气孔（airvent侧）,外部气孔（gate侧）,内部气孔,-,26,麻点,在封装成形后,封装体的表面有时会出现大量微细小孔,而且位置都比较集中,看卜去是一片麻点。这些缺陷往往会伴随其他缺陷同时出现,比如充填不良、气孔等。这种缺陷产生的原因主要是料饼在预热的过程中受热不均匀,各部位的温差较大,注入模腔后引起固化反应不一致,以至于形成麻点缺陷。,-,27,锭粒无间隙,预热不均,锭粒有间隙(均匀摆放),预热均匀,麻点,-,28,溢料(Resinbleed/Flash),-,29,溢料,-,30,流痕(FlowMark),