PCBA外观检验标准

,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件X方向)SMDAssemblyworkmanshipcriteria-Chipcomponentalignment(XAxis),1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.,1.零件橫向超出焊墊以外，但尚未大於其零件寬度的50%。(X1/2W)1.Thecomponentshiftedoffthepadandshiftlengthshallless1/2chipwidth,1.零件已橫向超出焊墊，大於零件寬度的50%(MI)。(X1/2W)1.Thecomponentshiftedoffthepadandshiftlengthover1/2chipwith,允收狀況(AcceptCondition),X1/2WX1/2W,330,X1/2WX1/2W,註:此標準適用於三面或五面之晶片狀零件Thisstandardonlybeusedfor3or5faceterminationschipcomponent,w,w,330,330,理想狀況(TargetCondition),拒收狀況(RejectCondition),1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.,1.零件縱向偏移，但焊墊尚保有其零件寬度的25%以上。(Y11/4W)2.零件縱向偏移，但零件端電極仍蓋住焊墊為其零件寬度的25%以上。(Y21/4W)Componentisshiftedtowardslongestpartofthechip,butthetermiuadendofchipstillontheland1.ThePadlengthnotbecoverbychip(Y1)shallover1/4chipwidth(W)2.1/4widthofthelandforsolderfillettoform.,1.零件縱向偏移，但焊墊未保有其零件寬度的25%(MI)。(Y11/4W)2.零件縱向偏移，但零件端電極蓋住焊墊小於其零件寬度的25%。(Y21/4W)3.Whicheverisrejected.,允收狀況(AcceptCondition),WW,330,330,Y21/4W,330,Y11/4W,Y21/4W,Y11/4W,SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件Y方向)SMDAssemblyworkmanshipcriteria-Chipcomponentalignment(YAxis),理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度SMDAssemblyworkmanshipcriteria-Cylindercomponentalignment,1.組件的接觸點在焊墊中心1.Thepointofcontactiscenteredonthelands,1.組件端寬(短邊)突出焊墊端部份是組件端直徑33%以下。(X1/3D)2.零件縱向偏移，但金屬封頭仍在焊墊上。(Y10mil),(Y20mil)1.Thelengthofcomponentshiftedoffthepad(X)shalllessthe1/3Diameterofcomponent2.Shiftedtowardthelongestpartofthecomponent,thesolderterminationsstillontheland,1.組件端寬(短邊)突出焊墊端部份是組件端直徑33%以上(MI)。(X1/3D)2.零件縱向偏移，但金屬封頭未在焊墊上。(Y10mil),(Y20mil)3.Whicheverisrejected.,允收狀況(AcceptCondition),X1/3DX1/3DY20milY10mil,X1/3DX1/3DY20milY10mil,註：為明瞭起見,焊點上的錫已省去。Note:Inordertoclarifythefigure,thesolderjointbeeliminated,D,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度SMDAssemblyworkmanshipcriteria-Gull-Wingfootprintalignment,1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/2W。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)。(S5mil)1.Thelengthoftheleadfootprintshiftedofftheland(X)shallless1/2widthoflead2.Theclearance(S)betweenleadshiftedoffandlandshallover5mil,允收狀況(AcceptCondition),WS,X1/2WS5mil,X1/2WS5mil,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)(MI)。(S5mil)3.Whicheverisrejected.,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度SMDAssemblyworkmanshipcriteria-Gull-Wingtoealingnment,1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過焊墊側端外緣。1.Theleadhadshiftedandfootprintnotovertheendofland,1.各接腳側端外緣，已超過焊墊側端外緣(MI)。1.Theleadhadshiftedandfootprinthadovertheendofland(MI),允收狀況(AcceptCondition),WW,已超過焊墊側端外緣,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度SMDAssemblyworkmanshipcriteria-Gull-Wingheelalingnment,1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands,1.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(XT)。1.Theleadhadshiftedthelengthfromleadheeltoendofland(X)shallbeoverthethicknessofland(T),1.各接腳己發生偏滑，腳跟剩餘焊墊的寬度，已小於接腳厚度(XT)(MI)。,允收狀況(AcceptCondition),TX,TXT,TXT,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量SMDsolderjointworkmanshipcriteria-MinimumsolderofGullWingfootprint,1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.sidefaceandfootprinthavegoodsolderfillet2.concavefilletbetweenlandandlead3.theshape(profile)ofleadbeclearlyvisible,1.引線腳的底邊與板子焊墊間的銲錫帶至少涵蓋引線腳長的2/3L以上。2.腳跟(Heel)焊錫帶涵蓋高度h大於零件腳1/2厚度。(h1/2T)。3.腳跟(Heel)沾錫角需90度。1.Widthofsolderfilletbetweenleadandland(X)shallover2/3leadfootprint(L)2.Minimumsolderfilletflowsupendmorethan1/2thicknessofleadonheel3.Wettingangle90onheel,1.引線腳的底邊與板子焊墊間的銲錫帶不足涵蓋引線腳長的2/3L。2.腳跟(Heel)焊錫帶涵蓋高度h小於零件腳1/2厚度。(h=2/3L,L,X2/3L,h1/2T,T,h1/2T,T,理想狀況(TargetCondition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量SMDsolderjointworkmanshipcriteria-MaximumsolderofGullWingfootprint,1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.sidefaceandfootprinthavegoodsolderfillet2.concavefilletbetweenlandandlead3.theshape(profile)ofleadbeclearlyvisible,1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍凸的焊錫帶。3.引線腳的輪廓可見。1.Goodsolderflowupandconcavefilletbetweenlandandlead2.Concavesolderfilletbetweensidefaceofleadandland3.Theshape(profile)oflead(footprint)beclearlyvisible,1.焊錫帶延伸過引線腳的頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whicheverisrejected.1.solderflowcovertheend(TIP)oflead2.Theshape(profile)ofleadnotbevisibleclearly3.Whicheverisrejected,拒收狀況(RejectCondition),允收狀況(AcceptCondition),理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量SMDsolderjointworkmanshipcriteria-MinimumsolderofGullWingHeel,1.腳跟的焊錫帶延伸到引線上彎曲處底部(B)與下彎曲處頂部(C)間的中心點。註：引線上彎頂部：引線上彎底部：引線下彎頂部：引線下彎底部1.SolderflowuptothecenterbetweenB,Cpointontheheeloflead,1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solderflowuptoBpointontheheel,1.腳跟的焊錫帶延伸到引線上彎曲處的底部(B)，延伸過高，且沾錫角超過90度，才拒收(MI)。1.Solderflowupover(cross)Bpointandthewettingangleover90degree,允收狀況(AcceptCondition),沾錫角超過90度,A,B,D,C,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-J型接腳零件之焊點最小量SMDsolderjointworkmanshipcriteria-MinimumsolderofJtypelead,1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solderconcavefilletonthe4faceoflead2.solderflowuptotheanglehighpointA,B3.Leadshape(profile)canbeclearlyvisible4.Goodsolderingjointateverysoldercontact,1.焊錫帶存在於引線的三側2.焊錫帶涵蓋引線彎曲處兩側的50%以上(h1/2T)。1.Solderconcavefilletonthe3faceoflead2.Heightofsolderflow-upontheleadangle(h)shallover1/2angleheight(T),1.焊錫帶存在於引線的三側以下(MI)。2.焊錫帶涵蓋引線彎曲處兩側的50%以下(h1/2T)(MI)。3.Whicheverisrejected.1.Solderconcavefilletisless3face2.Heightofsolderflow-upontheleadangle(h)under1/2angleheight(T)3.Whicheverisrejected,允收狀況(AcceptCondition),h1/2T,A,TB,h1/2T,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-J型腳零件對準度SMDAssemblyworkmanshipcriteria-Jtypeleadalignment,1.各接腳都能座落在焊墊的中央，未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands,允收狀況(AcceptCondition),SW,S5milX1/2W,S1/2W,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以下(MI)。(S5mil)3.Whicheverisrejected.,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/2W。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以上。(S5mil)Theleadhadshiftedofftheland1.Thelengthofleadshiftedofftheland(X)shallless1/2widthoflead(W)2.Theclearancedistancebetweenshiftedleadandlandedgeshallover5mil,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點SMDsolderjointworkmanshipcriteria-MaximumsolderofJtypelead,1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solderconcavefilletonthe4faceoflead2.solderflowuptotheanglehighpointA,B3.Leadshape(profile)canbeclearlyvisible4.Goodsolderingjointateverysoldercontact,1.凹面焊錫帶延伸到引線彎曲處的上方,但在組件本體的下方。2.引線頂部的輪廓清楚可見。1.Solderflowuptotopofleadangleandnottouchthebody2.Shape(profile)ofleadanglecanbevisibleclearly,1.焊錫帶接觸到組件本體(MI)。2.引線頂部的輪廓不清楚(MI)。3.錫突出焊墊邊(MI)。4.Whicheverisrejected.1.Solderhadtouchedthebody2.Shape(profile)ofleadanglecannotbevisibleclearly3.Excesssolderonthesideofsolderland,允收狀況(AcceptCondition),A,B,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點)SMDsolderjointworkmanshipcriteria-Minimumsolderfilletofchipcomponent(3or5faceterminations),1.焊錫帶延伸到晶片端電極高度的25%以上。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊的距離為晶片高度的25%以上。(X1/4H)1.1/4componentheightbefilletbysolderatleast2.Solderflowspreadonthelandshall1/4widthofcomponentheightatleast,(Countfromtipofcomponent),1.焊錫帶延伸到晶片端電極高度的25%以下(MI)。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。(X1/4T)3.Whicheverisrejected.,允收狀況(AcceptCondition),T,h1/4TX1/4T,h10mil)(MI)且10mil,不易被剝除者L10mil,不易被剝除者L10mil,理想狀況(TargetCondition),拒收狀況(RejectCondition),允收狀況(AcceptCondition),X0,X0,Y,YT,YT,X,1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Thefootprintofeveryleadbecenteredontheland,1.各接腳已發生偏滑，引線腳的側面仍保留在焊墊上(X0),2.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(YT)。Footprinthadshifted1.Sidefacestillontheland(X0)2.Thespacefromendoflandtoheelshalloverthethicknessoflead,1.各接腳己發生偏滑，引線腳的側面已超出焊墊(X2.0mm,傾斜Wh2.0mm,傾斜/浮高Lh2.0mm,傾斜Wh2.0mm,1.量測零件基座與PCB零件面之最大距離2.0mm(MI)。(Lh2.0mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.臥式COIL之Lh或Wh2mm判定距收(MI)。4.Whicheverisrejected,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-臥式電子零組件(Wire)浮件與傾斜(2)DIPcomponentAssemblyworkmanshipcriteria-Tilt&floatingofhorizontalelectroniccomponent(Wire),1.單獨跳線平貼於機板表面。2.固定用跳線不得浮高,跳線需平貼零件。1.Jumperwirelayflatandtouchtheboard2.Jumperwireusedforfixingcomponentshalltouchthecomponentbody,1.單獨跳線Lh,Wh1.0mm。2.被固定零件浮高1.0mm。(Y1.0mm)3.固定用跳線投影於PCB後左右偏移量零件孔邊緣1.0mm。(X1.0mm)4.固定用跳線浮高Z0.8mm(被固定零件平貼於PCB時)1.Theheightofjumperwireabovethelandis1.0mmMaximum2.Jumperwireusedforfixingcomponentis0.8mmmaximum3.Theshiftlengthofreflectionofjumperwireusedforfixingcomponentontheboardis1.0mmmaximummeasuringfromtheedgeofPTH4.Theheightofjumperwireabovethecomponentis0.8mmmaximumsincecomponentlayflat,允收狀況(AcceptCondition),Lh1.0mm,Wh1.0mm,X1.0mm,1.單獨跳線Lh,Wh1.0mm(MI)。2.被固定零件浮高1.0mm(MI)。(Y1.0mm)3.固定用跳線投影於PCB後左右偏移量零件孔邊緣1.0mm(MI)。(X1.0mm)4.固定用跳線浮高Z0.8mm(被固定零件平貼於PCB時)(MI)5.Whicheverisrejected,Lh1.0mm,Wh1.0mm,X1.0mm,Y1.0mm,Y1.0mm,Z0.8mm,Z,Z,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)浮件DIPcomponentAssemblyworkmanshipcriteria-Floatingofverticalelectroniccomponent(C,F,L,Buzzer),1.零件平貼於機板表面。2.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。1.Componentisperpendicularandbaseisparalleltoboardsurface2.ThefloatingheightismeasuredfromfaceofPCBsubstratetothelowestpointofcomponent,1.浮高2.0mm。(Lh2.0mm)2.錫面可見零件腳出孔。3.無短路。1.Theheightofcomponentabovetheland(Lh)is2.0mmmaximum2.Leadprotrusiononthesoldersidecanbeidentified3.Nosolderbridge,1.浮高2.0mm(MI)。(Lh2.0mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whicheverisrejected.,允收狀況(AcceptCondition),1000F6.3F,-,-,-,1016+,1000F6.3F,-,-,-,1016+,Lh2.0mm,Lh2.0mm,1000F6.3F,-,-,-,1016+,Lh2.0mm,Lh2.0mm,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)傾斜DIPcomponentAssemblyworkmanshipcriteria-Tiltofverticleelectroniccomponent(C,F,L,Buzzer),1.零件平貼於機板表面。2.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。1.Componentisperpendicularandbaseisparalleltoboardsurface2.ThefloatingheightismeasuredfromfaceofPCBsubstratetothelowestpointofcomponent,1.量測零件基座與PCB零件面之最大距離2.0mm。(Wh2.0mm)2.傾斜不得觸及其他零件或造成組裝性之干涉。1.Themaximumheightofcomponentabovethelandis2.0mmmaximum2.NotouchneighboringcomponentorNerferingwithneighborcomponentassembly,允收狀況(AcceptCondition),1000F6.3F,-,-,-,1016+,1000F6.3F,-,-,-,1016+,Wh2.0mm,1000F6.3F,-,-,-,1016+,Wh2.0mm,1.量測零件基座與PCB零件面之最大距離2.0mm(MI)。(Wh2.0mm)2.傾斜已觸及其他零件或造成組裝性之干涉(MA)。4.零件傾斜與相鄰零件之本體垂直空間干涉(MI)。5.Whicheverisrejected.,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-機構零件(Slot,Socket,DIMM,Heatsink)浮件DIPcomponentAssemblyworkmanshipcriteria-Floatingofconstructivecomponent(slot,socket,Dim,Heatssink),1.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。2.機構零件基座平貼PCB零件面，無浮高傾斜。(a,b,c,d四點平貼於PCB）。1.ThefloatingheightismeasurefromfaceofPCBsubstratetothelowestpointofcomponent2.ThebaseofconstructivecomponentshalltouchthefaceofPCBsubstrate(a,b,c,dpointtouchPCB),1.短軸a,b兩點平貼PCB或垂直上浮,但c,d兩點浮高0.8mm。(Lh0.8mm)2.錫面可見零件腳出孔3.無短路。1.Theheightofcomponentshortaxissideabovethelandis0.8mmmaximum2.Leadprotrusioncanbeidentifiedonsolderside3.Nosolderbridge,允收狀況(AcceptCondition),CARD,CARD,Lh0.8mm,CARD,Lh0.8mm,a,b,c,d,1.短軸a,b兩點平貼PCB或垂直上浮,但c,d兩點浮高0.8mm(MI)。(Lh0.8mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whicheverisrejected.,a,b,c,d,a,b,c,d,理想狀況(TargetCondition),拒收狀況(REJECTCONDITION),DIP零件組裝工藝標準-機構零件(Slot,Socket,DIMM,Heatsink)傾斜DIPcomponentAssemblyworkmanshipcriteria-Tiltofconstructivecomponent(slot,socket,Dim,Heatsink),1.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。2.機構零件基座平貼PCB零件面，無浮高傾斜現象。(a,b,c,d四點平貼於PCB)。1.ThefloatingheightismeasurefromfaceofPCBsubstratetothelowestpointofcomponent2.ThebaseofconstructivecomponentshalltouchthefaceofPCBsubstrate(a,b,c,dpointtouchPCB),1.長軸a,c兩點平貼PCB或垂直上浮，但b,d兩點傾斜高度0.5mm。(Wh0.5mm)2.若a,b,c三點平貼PCB容許d點浮高/傾斜0.8mm。(Wh0.8mm)3.錫面可見零件腳出。1.Theheightofcomponentlongaxissideabovethelandis0.5mmmaximum2.If3pointof4cornertouchthePCB.Theheightoftheotherpointabovethelandis0.8mmmaximum3.Leadprotrusioncanbeidentifiedonsolderside,允收狀況(AcceptCondition),CARD,Wh0.5mm,CARD,Wh0.5mm,CARD,a,b,c,d,a,b,c,d,a,b,c,d,1.長軸a,c兩點平貼PCB或垂直上浮，但b,d兩點傾斜高度0.5mm(MI)。(Wh0.5mm)2.若a,b,c三點平貼PCB但d點浮高/傾斜0.8mm(MA)。(Wh0.8mm)3.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。4.Whicheverisrejected.,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-機構零件(JumperPins,BoxHeader)浮件DIPcomponentAssemblyworkmanshipcriteria-Floatingofconstructivecomponent(JumperPins,Boxheader),1.零件平貼於PCB零件面。2.無傾斜浮件現象。3.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。1.Componentisperpendicularandbaseisparalleltoboardsurface2.ThefloatingheightismeasuredfromfaceofPCBsubstratetothelowestpointofcomponent,1.浮高1.0。(Lh1.0mm)2.錫面可見零件腳出孔且無短路。1.Theheightofcomponentabovethelandis0.8mmmaximum2.Nosolderbridgeandleadprotrusioncanbeidentifiedonsolderside,允收狀況(AcceptCondition),Lh1.0mm,Lh1.0mm,1.浮高1.0mm(MI)。(Lh1.0mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whicheverisrejected.,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-機構零件(JumperPins,BoxHeader)傾斜DIPcomponentAssemblyworkmanshipcriteria-Tiltofconstructivecomponent(JumperPins,Boxheader),1.零件平貼PCB零件面。2.無傾斜浮件現象。3.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。1.Componentisperpendicularandbaseisparalleltoboardsurface2.ThefloatingheightismeasuredfromfaceofPCBsubstratetothelowestpointofcomponent,1.量測零件基座與PCB零件面之最大距離1.0mm。(Wh1.0mm)2.傾斜不得觸及其他零件或造成組裝性之干涉。3.排針頂端最大傾斜不得超過PCB板邊邊緣。1.Themaximumheight(Wh)ofcomponentabovethelandis1.0mmmaximum2.Notouchneighboringcomponentsassembly3.TheprojectionoftiltedheaderontheboardisnotovertheedgeofPCB,允收狀況(AcceptCondition),Wh1.0mm,Wh1.0mm,1.量測零件基座與PCB零件面之最大距離1.0mm(MI)。(Wh1.0mm)2.傾斜觸及其他零件或造成組裝性之干涉(MA)。3.排針頂端最大傾斜不得超過PCB板邊邊緣(MI)。4.零件傾斜與相鄰零件之本體垂直空間干涉(MI)。5.Whicheverisrejected,1000F6.3F,-,-,-,1000F6.3F,-,-,-,1000F6.3F,-,-,-,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-機構零件(CPUSocket)浮件與傾斜DIPcomponentAssemblyworkmanshipcriteria-Tiltandfloatingofconstructivecomponent(CPUSocket),允收狀況(AcceptCondition),浮高Lh,1.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。2.CPUSocket平貼於PCB零件面。,浮高Lh,浮高Lh,浮高Lh,傾斜Wh0.8mm,浮件Lh0.8mm,浮高Lh,浮高Lh,傾斜Wh0.8mm,浮件Lh0.8mm,1.量測零件基座與PCB零件面之最大距離0.8mm。(Lh,Wh0.8mm)2.錫面可見零件腳出孔。3.無短路。,1.量測零件基座與PCB零件面之最大距離0.8mm(MI)。(Lh,Wh0.8mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whicheverisrejected.,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-機構零件(USB,D-SUB,PS/2,K/BJack)浮件與傾斜DIPcomponentAssemblyworkmanshipcriteria-Tiltandfloatingofconstructivecomponent(USB,D-sub,PS/2,K/BJack),1.USB,D-SUB,PS/2,K/BJack,PrinterPort,COMPort平貼於PCB零件面。,允收狀況(AcceptCondition),浮高Lh0.5mm,傾斜Wh0.5mm,浮高Lh0.5mm,傾斜Wh0.5mm,1.量測零件基座與PCB零件面之最大距離0.5mm。(Lh,Wh0.5mm)2.錫面可見零件腳出孔。3.無短路。,1.量測零件基座與PCB零件面之最大距離0.5mm(MI)。(Lh,Wh0.5mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whicheverisrejected.,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-機構零件(PowerConnector)浮件與傾斜DIPcomponentAssemblyworkmanshipcriteria-Tiltandfloatingofconstructivecomponent(PowerConnector),1.PowerConnector平貼於PCB零件面。,允收狀況(AcceptCondition),1.量測零件基座與PCB零件面之最大距離0.8mm。(Lh,Wh0.8m