SAKI-AOI-专业技术教程

1,技术员教程,年月H.CindyKato培训中心,AllCopyRightsReserved,2,内容,机器原点&电路板原点基础检测程序的编写检测结果*安装AOI(machine:HW)*应用软件的安装*ThePartList*,3,检测程序编写,学完此章,您将能够描述以下内容:调整电路板原点使之与机器原点一致.如何打开数据创建新的格式调整数据的布局.什么是fiducialmarks，如何做成针对检测印刷后,回流焊前和回流焊后的各种不良如何编写检测程序如何查看检测结果,学习目的,4,目录,机器/电路板的原点,打开数据,基准点（FiducialMark）,设置块（block),检测界面,Inspection,window,CAD,F-Mark,blocks,检测程序的内容,库的结构,库,5,机器原点&贴片机,传送方向:从左向右,前导轨(固定),后导轨(可调整),前导轨(可调整),后导轨(固定),*Fuji贴片机,*KME贴片机,机器原点,机器原点,注意:尽量保证电路板原点与机器原点相重合，这样可以使图像输出完整,menu,Inspection,window,CAD,F-Mark,blocks,library,6,机器原点&电路板原点,menu,Inspection,window,CAD,F-Mark,blocks,library,7,设置机器原点,右键点击主界面右边的空白区域弹出此对话框,menu,Inspection,window,CAD,F-Mark,blocks,library,8,检测程序的内容,menu,Inspection,window,CAD,F-Mark,blocks,library,9,制作检测程序的流程,.,menu,Inspection,window,CAD,F-Mark,blocks,library,10,CAD数据,menu,数据分类,打开数据的过程,CAD数据的格式,调整数据的布局,调整方法,复制CAD布局,Inspection,window,CAD,F-Mark,blocks,library,11,数据分类,CAD数据:整条生产线的全部设计数据(如.元件的位号)NC数据/贴片机数据:(x,y,q,macro,location,referencename)将元件贴装在电路板上的次序需要结合所有的NC数据以得到电路板的CAD数据,menu,NEXT,CAD,12,*主要贴片机数据文件的后缀,Fuji贴片机*.pgoSanyo贴片机*.nczYamaha*.txtPanasonic*.mngPos1Pos2Pos3,menu,CAD,13,*在BF上生成文件,Iff.txt在BF机上结合检测程序生成文件如果检测程序更新文件也会更新只用于校正贴片机信息包括内容Reference,block,macro,library,x,y,q,typeType=1:chip,IC=0:systemmark(fiducialmark),menu,CAD,back,14,打开数据-1,1.点击File.,2.选SelectCADData.,3.点Cancel打开CADData.,menu,CAD,back,15,打开CAD数据-2,4.选Cancel继续.,5.点OK继续.,6.选择要打开的CADdata,menu,CAD,16,打开CAD数据-3,7.选择贴片机的种类,注意:如果是选择另外的数据文件则点击“浏览”然后在弹出的对话框中选择目标文件.,menu,CAD,17,CAD数据格式,自定义格式,menu,CAD,NEXT,18,*创建新的CAD格式,menu,CAD,19,*编辑格式,menu,CAD,20,打开数据-4,8.选择或创建一个group以保存检测程序.,输入新的group名称,menu,CAD,back,21,CAD数据的显示,CAD数据:显示了PCB的布局(即元件在电路板上的位置信息).,menu,CAD,22,调整数据的布局-1,调整过程,CAD布局,的图像,载入,2.扫描,3.查看数据的布局与图像是否匹配.,menu,CAD,23,调整CAD布局-2,Layoutmovesintheoppositedirection.,1.点击Edit.,2.选中Offset.,3.选择移动/偏转的方式.,方法1:,menu,CAD,24,调整CAD布局的技巧,Notes:有时因为原点的设置使得数据没有出现在显示区，在这种情况下,变化板子的尺寸得以看到数据窗口的位置使用XYoffset将数据窗口移至显示区的中间查处数据窗口与原点间位置距离根据位置距离使用XYoffset以调整,menu,CAD,25,偏转的选择,Mirror(x,y)Invert(x,y),x,y,MirrorX,x,y,MirrorY,x,y,InvertX,x,y,InvertY,menu,CAD,NEXT,板的中心线,板的中心线,26,*调整布局-2,直接将数据的窗口拖动到大概正确的位置.,方法2:,menu,CAD,27,复制CAD布局-1,选择图像上的block.,3.点击Block.,2.点击Edit.,4.确定偏转的距离与数量,注意:在复制block前,确定将其设置为“block1”,menu,CAD,back,28,复制CAD布局-2,布局显示在图像上,menu,CAD,29,检测程序的做成,.,menu,Inspection,window,CAD,F-Mark,blocks,library,30,基准点,menu,制作基准点,编辑页面,编辑页面的说明,设置基准点的技巧,设置过程,使用光源技巧,使用算法的技巧,设置终结,添加新的基准点,Inspection,window,CAD,F-Mark,blocks,library,31,制作基准点,过程:右键基准点的窗口进入编辑窗口,FiducialMark（基准点）是用于调整所有检测程序窗口位置的参考点,注意:基准点通常设置于板对角线的两端.,menu,F-Mark,32,编辑界面,图像显示区,参数显示区域,算法设置区域,元件信息,图标/功能(帮助设置算法),检测程序窗口列,menu,F-Mark,33,编辑界面详解-1,元件的位号,块号.,用于IC,引角ID,窗口ID,元件的料号:CAD数据中定义的某组元件,该元件应用的检测库,元件的类型,将库更新为此设置,menu,F-Mark,34,编辑界面详解-2,检测窗口列,此窗口检测目的,用于检测,设置检测条件,检测结果的上下限,当前检测窗口的检测值,menu,F-Mark,35,设置检测窗口技巧(FiducialMark),AdjustArea,创建窗口的种类,设置技巧,检测窗口应与Mark点相匹配(尽可能精确)为节省检测时间不要设置过大的搜寻窗口.fiducialmarks最好设置在板子对角线的相反方向fiducialmark只需使用两个检测窗口一个指定大小与位置另外一个指定搜寻范围,窗口设置,搜寻范围,menu,F-Mark,36,设置FiducialMarks-1,1.选择类型=FiducialMark,2.右击空白区域.,3.在弹出的对话框中选择添加(add)检测窗口.,menu,F-Mark,37,设置FiducialMarks-2,4.设置窗口类型=Adjust,8.点击保存设置.,5.设置光源,6.选择算法,7.更新库,menu,F-Mark,38,FiducialMark备注,FiducialMarks所使用的材料铜焊锡涂层黄金(用于手机)在搜寻圆形ark点时通常使用Toplight，但是若mark的轮廓很粗糙时(如.焊锡涂层的ark点),则建议使用add3光源.,注意:基准点的位置有两类:一个是实际的,另外则是当前的,因为板子可能倾斜,所以应该区分实际的和当前的位置！.,menu,F-Mark,39,光源设置的技巧,选择光源应符合以下条件图像最明显图像最清楚对比度最强,menu,F-Mark,40,Gravity:搜寻重心,选择算法的原则,注意:根据基准点的特点来选择算法,如，基准点的形状e.g.圆形,锯形等,*Circle:搜寻圆圈,GrayEdge:搜寻边界的交叉点,*ImageMatchingEX:搜寻相似图像,menu,F-Mark,41,1stFiducialMark的编辑总结,1,2,3,4,选则类型,添加窗口,选择算法和参数,更新库,保存设置,5,menu-,F-Mark,42,添加新的FiducialMarks-1,在图像上选择基准点,3.点击Add.,2.点击Edit.,3.选中FiducialMark和库,menu,F-Mark,43,制作第二个或更多FiducialMarks-2,2.选择类型=FiducialMark,3.选择库,1.在图像上点击FiducialMark位置,menu,F-Mark,44,制作检测程序,.,menu,Inspection,window,CAD,F-Mark,blocks,library,45,块的内容,menu,块的设置过程,设置方法总结,window,CAD,F-Mark,blocks,Inspection,library,46,设置块-1,1.选择区域.,menu,blocks,47,设置块-2,2.给新创建的块定义号码,3.重置基准点,menu,blocks,48,设置块的方法,注意:应该重置所有的块号，因为原有的块号会造成系统错误.设置好块以后,务必重置基准点!,B2,B3,Makingblocks,e.g.,FM1:fiducialmark,FM2:fiducialmark,M4:sub-fiduicalmark,M3:sub-fiduicalmark,用如下基准点来设置块:B2:(FM1,M4)B3:(FM2,M3),menu,blocks,49,检测程序的制作,.,menu,Inspection,window,CAD,F-Mark,blocks,library,50,深入检测程序,menu,AOI应用,回流焊后检查的特点,回流焊后检查的窗口设置,Chip件检测窗口的编辑,回流焊前检查的特点,回流焊前检查的窗口设置,印刷后检查的特点,IC/Connector件的检测窗口编辑,印刷后检查的自动程序设置,检查的应用实例,窗口设置方法,Inspection,window,CAD,F-Mark,blocks,库的使用使检测更加快捷,library,51,检测窗口,Area,Adjust,位置/搜寻目标,缺失,偏移/不对准,不良类型,极性相反,焊锡的不良,桥接,引角翘起,虚焊,反白表里,其它元件,立碑/侧立,Inspection,menu,window,CAD,F-Mark,blocks,library,52,设置窗口的方法,窗口必须是对称的基于亮度(或相素多少)来调整设置参数窗口的大小要适当=如.包括/含有亮度的足够信息检测顺序是按列表的先后顺序进行的(即.从第一号窗口到最后一个),menu,Inspection,window,CAD,F-Mark,blocks,library,53,创建检测程序,3种应用,印刷机,贴片机,回流炉,贴片机,回流炉,Post-reflow,Pre-reflow,Post-printing,menu,Inspection,window,CAD,F-Mark,blocks,library,54,回流焊后的检测特点,回流焊后的检测的常见不良Missing元件的缺失Shift元件位置未对准Solder焊锡量的检查极性其他,menu,back,Inspection,window,CAD,F-Mark,blocks,library,55,窗口结构,AreaAdjustMissingReverseShiftNoSolderBridgeLiftedDryJoint,回流焊后:IC,AreaAdjustMissingShiftNoSolderLiftedBillboard/tombstoneReverseUp-side-down,回流焊后:Chips,位置，区域,搜寻并准确调节位置,较少使用的不良种类,检查主要不良,menu,Inspection,window,CAD,F-Mark,blocks,library,56,Chip件检测程序编写,1.选择元件种类为Chip,2.添加窗口,3.设置光源和算法.,4.更新同一个库的检测程序.,menu,检查窗口是否对称,Inspection,window,CAD,F-Mark,blocks,window,CAD,F-Mark,blocks,Inspection,library,57,详细:窗口编辑,添加窗口,删除窗口,复制窗口,在对称方向复制窗口,在对称方向复制窗口,将此窗口参数(上下限或OK范围)复制给所有同类型窗口,删除所有同类窗口,只复制IC/Connector窗口的设置(不包括引角设置):,把窗口移动到另一个的序列,窗口的位置(检查对称性),Inspection,window,CAD,F-Mark,blocks,menu,library,58,使用库制作检测程序,menu,2.选择类型,如.Chip,1.右键Component图像,5.点击OK保存设置.,Inspection,window,CAD,F-Mark,blocks,3.选择库号,4.点击Update将元件所在的库更新.,library,59,IC/Connectors检测程序的制作-1,1.选择元件类型=IC/Connector,2.定义引角&焊盘尺寸.*(见下页),4.添加area窗口定义位置以即adjust窗口检测元件细微的偏移,3.由引角和焊盘的尺寸自动生成窗口,5.设置参数,menu,EndofIC,Inspection,window,CAD,F-Mark,blocks,library,60,定义引角和焊盘的尺寸(设置方法-1),1.做一个与本体大小一致的窗口,e.g.,2.做一个与引角末端一致的窗口,e.g.,3.做一个与焊盘末端一致的窗口,e.g.,menu,Inspection,window,CAD,F-Mark,blocks,library,61,定义引角和焊盘的尺寸(设置方法),5.检查/修改本体大小,4.定义元件类型,6.选择引角间距.,7.检查/修改焊盘/引角的长度,8.输入引角个数.,9.点击继续,menu,Inspection,window,62,*定义引角和焊盘的尺寸设置(直接输入方式),QFP:4边有引角,SOP:2边有引角,引角/焊盘尺寸,算法设置,本体尺寸,menu,Inspection,window,63,定义引角和焊盘的尺寸-2,注意:以上设置完成后,将自动生成检测窗口查看检测窗口与元件是否一致,如.窗口是否与被检测项目对齐如若没有对准,调整引角尺寸,或重新确认引角数目,系统保存的库(检测窗口)(如.默认),用户创建的库(检测窗口).,将设置复制给其他引角(主要用于修改),menu,interface,Inspection,window,CAD,F-Mark,blocks,library,64,*更新库时的图标含义,定义当库被更新时,会弹出如下对话框，各自含义如下:,将库的改变更新并且应用到同一库中的其它元件(用于使用不只一个库时).,将库的改变更新并用于同一料号的其它元件,将库的改变更新并应用与同一个库的其它元件共享库).,menu,Inspection,window,CAD,F-Mark,blocks,library,65,*高级应用,使用多个库这可用于当客户在制作同一个板时使用变化的元件可用于同一元件外观有较大变化的情况应用界面注意:工作方式是：先用库检查，若未通过则用库检查如此继续当的范围设置较宽时，很容易误查.=为避免此情况,一般需设置另一窗口检查元件的特征,库序号,不检查此元件,注:若跳过某些元件，不检查,可以通过在图像上选择该元件,然后选择此对话框中kip选项.,menu,Inspection,window,CAD,F-Mark,blocks,library,66,Area-1,将此窗口尽量与元件大小调整一致-作为引导,E.g.,元件,窗口,注意:设置该窗口是为确定位置,所以算法与光源的设置不做检查用,算法:colorXY,Black/White(B/W)光源:side,top,焊盘,窗口,menu,Inspection,window,67,Area-2,光源:toplight,基于算法的调整BlackWhite(B/W):指定窗口中给定亮度范围所占的百分比,例:,元件,窗口,样本值=在边界限定范围内设定亮度的百分比,menu,Inspection,window,68,Black/White界面,窗口内明暗变化(由暗到明),定义OK范围,69,Area-3,光源:sidelight,基于颜色的算法ColorXY:样本值在平面内的相对位置e.g.,menu,Inspection,window,Example:,70,ColorXY界面,y方向的颜色,X方向的颜色,71,Adjust-1(单色/基于色调),将窗口位置放置尽量保证与元件对准-调整元件微小的偏移量,E.g.,窗口,算法L-Tracking:在长度方向上寻找与给定长度相似的边界(=通过亮度寻找)W-Tracking:在长度方向上寻找与给定宽度相似的边界(=通过亮度寻找),窗口,L-tracking,W-tracking,menu,Inspection,window,72,*Adjust-2(基于颜色),将窗口位置放置尽量保证与元件对准-调整元件微小的偏移量,E.g.,window,算法Color-L-Tracking:在长度方向上寻找与给定长度相似的边界(=通过颜色寻找)Color-W-Tracking:在宽度方向上寻找与给定长度相似的边界(=通过颜色寻找),window,ColorL-tracking,ColorW-tracking,menu,Inspection,window,73,设置Adjust窗口的更多实例-1,寻找明暗边界.,垂直方向调整,水平方向调整,垂直方向调整,水平方向调整,注:使用引角亮度查找偏移比使用本体更好,因为引角的偏移可能较本体的偏移小,SOP&Connectors,QFP,menu,Inspection,window,74,*设置Adjust窗口的更多实例-2(回流焊前),竖直方向,水平方向,竖直方向,水平方向,注:将窗口设置为元件的最大尺寸！,SOP,QFP&Connector,Chip:搜寻明暗边界,搜寻明暗边界(回流焊前).,menu,Inspection,window,75,Missing首页,认识算法,概要,menu,Inspection,window,76,Missing-1,光源:sidelight,基于颜色的算法ColorXY:样本值平面内的相对位置,例:,窗口,窗口,menu,Inspection,window,Top,77,ColorXY的界面,Y方向颜色分布,X方向颜色分布,78,Missing设置实例,例:OK,元件,窗口,焊盘,窗口,例:NG,窗口,pad,窗口,menu,Inspection,window,Top,79,Missing-2,Lighting:side,toporothers,独立算法Chip-missing:检测两侧焊锡亮度Chip-missing:样本值=(top光样本值)(side光样本值)/2.(1)或=(定义的较低的OK范围)/2.(2)若符合(1)或(2)则判定为不良,即.若140,Examples:,component,window,pad,window,Silkprints,Lighting:side,toporothers,menu,Inspection,window,Top,81,Missing-4,MAX:在选定范围内的最亮相素的亮度,例:,NG,window,MAX:190,丝印,Lighting:side,toporothers,MAX:80,menu,Inspection,window,Top,82,Missing-5,MIN:选定范围内的最暗相素的亮度,Example:(使用于较亮元件),MIN:120,MIN:10,OK,NG,Lighting:side,toporothers,menu,Inspection,window,Top,83,#Missing-6,彩色的算法ColorRect:检测在大窗口中指定的小窗口含有的指定颜色的百分比,Example,Lighting:sidelight,menu,Inspection,window,Top,窗口,84,Missing-7,LandJudgement通过分别设定两种光亮度的范围来计算符合范围要求的像素占整个窗口的百分比.,menu,Inspection,window,Top,Example,window,Lighting:Toplight,85,#Missing-8,Lighting:Sidelight,Examples:,色调的算法AreaColor(与ColorMatching相似),window,OK,NG,window,红,绿,蓝,Ctrl:(R1,G1,B1),Alt:(R2,G2,B2),menu,Inspection,window,Top,86,Missing-9,Lighting:toplight,色调算法BlackWhite(B/W):窗口内在设定范围内的亮区域的面积占整个窗口面积之比,Example:,元件,窗口,样本值=在窗口内检测到的符合明度范围的百分比,menu,Inspection,window,OK,NG,87,Black/White界面,窗口内明暗变化(由暗到明),确定OK范围,88,Missing设置的总结-1,menu,Inspection,window,Top,89,Missing设置总结-1,menu,Inspection,window,Top,90,Shift首页,介绍算法,总结,menu,Inspection,window,91,Shift-1,独立算法Distribution:获取检测窗口内的亮度梯度.窗口内各像素沿着长边方向的亮度差就是Distribution.样本值是检测到的最小亮度差,Example,Lighting:side/toplight,OK,NG,menu,Inspection,window,Top,92,Distribution界面-1,Max与Min中最小的值,样本值:,最小值,最大值,明度0to255,窗口宽度,93,Distribution界面-2,其他元件测得的样本值分布,94,Shift-2,Lighting:top/sidelight,独立算法Distribution:获取检测窗口内的亮度梯度.窗口内各像素沿着长边方向的亮度差就是Distribution.,Examples:,OK,NG,窗口,MAX-MIN:20,MAX-MIN:100,丝印,menu,Inspection,window,Top,95,Shift-3,Lighting:top/sidelight,独立算法Distribution:获取检测窗口内的亮度梯度.窗口内各像素沿着长边方向的亮度差,Examples:,OK,NG,window,MAX-MIN:20,MAX-MIN:150,MAX-MIN:100,menu,Inspection,window,Top,96,Shift-4,Lighting:sidelight,彩色算法ColorXY:样本值显示平面中并得到其相对位置,Examples:,OK,NG,window,menu,Inspection,window,Top,97,ColorXY界面,Y方向的颜色分布,X方向的颜色分布,98,Shift-5,Lighting:toplight,色调算法MAX:检测到窗口中所有最亮相素亮度值,Examples:,OK,NG,窗口,最大:80,最大:190,丝印,menu,Inspection,window,Top,99,Shift-6,Lighting:toplight,色调算法Average:检测窗口中所有相素的平均亮度,Examples:,OK,NG,window,平均值:60,平均值:120,丝印,menu,Inspection,window,Top,100,Shift-7,Lighting:toplight,色调算法Range:MAX-MIN(即.窗口中和值的差),Examples:,OK,NG,window,Range:10,Range:100,丝印,menu,Inspection,window,Top,101,Shift-8,Lighting:toplight,ToneBasedAlgorithmsBlackWhite(B/W):takepercentageofthebrightness/tone(blackandwhite)insidethedefinedwindow,Example:,component,window,Samplevalue=thepercentageofbrightnessdetectedwithintheboundaryconditions,menu,Inspection,window,OK,NG,102,SettingSummaryforShift-1,menu,Inspection,window,Top,103,SettingSummaryforShift-2,menu,Inspection,window,Top,104,Reverse/PolarityTopPage,AlgorithmInsight,Summary,menu,Inspection,window,105,Polarity/Reverse-1,Lighting:toplight,ToneBasedAlgorithmsRange:MAX-MIN(i.e.thedifferenceofthebrightnessbetweenMAXandMIN)M1M2:Thedifferencebetweenthesamplevaluesin2specificwindowsset.,Examples:,OK,NG,M1Range:60,M2=Range:20,M1Range:20,M2=Range:60,M3,M3,M3=M1-M2=40,M3=M1-M2=-40,menu,Inspection,window,Top,106,Polarity/Reverse-2,Lighting:toplight,ToneBasedAlgorithmsEdge:detecttheedge(thedifferenceofthebrightness)toformtheshapeinsidethewindowdefined=commonlyusedforpolarityinspectionfordiode,Example:(Diode),Samplevalue=%ofthedifference,Window,Detectededge,Diode,Pad,menu,Inspection,window,Top,107,Polarity/Reverse-3,Lighting:toplight,ToneBasedAlgorithmsPeak:takethemostrepeatablebrightness,menu,Inspection,window,Top,108,Polarity/Reverse-3,Lighting:toplight,IndependentAlgorithmsImageMatchingEX:matchtheimages,Examples:,OK,NG,SAKI,Window,SAKI,Window,menu,Inspection,window,Top,109,SettingSummaryforPolarity(Reverse)-1,menu,Inspection,window,Top,110,SettingSummaryforPolarity(Reverse)-2,menu,Inspection,window,Top,111,Upside-downTopPage,AlgorithmInsight,Summary,menu,Inspection,window,112,UpsideDown-1,Lighting:toplight,ToneBasedAlgorithmsMAX:themaximumbrightnessinthedefinedwindow,Examples:,OK,NG,window,MAX:60,MAX:200,Silkprints,menu,Inspection,window,Top,113,UpsideDown-2,Lighting:toplight,ToneBasedAlgorithmsMIN:theminimumbrightnessinthedefinedwindow,Examples:,window,MIN:10,MIN:180,OK,NG,menu,Inspection,window,Top,114,UpsideDown-3,Lighting:toplight,ToneBasedAlgorithmsAverage:taketheaverageofthebrightnessinthedefinedwindow,Examples:,window,Average:60,Average:200,OK,NG,menu,Inspection,window,Top,115,UpsideDown-4,ColourBasedAlgorithmsColorRect:detectthe%ofthecoloursinsidethebigwindowfromthedefinedsmallwindow,e.g,Lighting:sidelight,menu,Inspection,window,Top,Example,component,window,pad,116,SettingSummaryforUpside-down,menu,Inspection,window,Top,117,SolderPaste/NoSolderTopPage,AlgorithmInsight,Summary,menu,Inspection,window,118,NoSolder(SolderPaste)-1,Lighting:toplight,Examples:,ToneBasedAlgorithmsBlackWhite(B/W):takepercentageofthebrightness/tone(blackandwhite)insidethedefinedwindow,component,window,0,255,Brightnesslevel,Amount,Samplevalue=thepercentageofbrightnessdetectedwithintheboundaryconditions,window,B/W:80,10,100,OK,NG,window,B/W:20,menu,Inspection,window,Top,119,ExampleofApplyingB/WforSolderInspection(ICLead),SolderInspection,Lighting:Toplight,menu,Inspection,window,Top,120,InterfaceofBlack/White,Luminousinsidethewindow(fromdarktobright),DefinedOKRange,121,*NoSolder(SolderPaste)-2ForPre-Reflow,Lighting:Sidelight,Examples:,ToneBasedAlgorithmsAreaColor(similartoColorMatching),window,OK,NG,window,Red,Green,Blue,Ctrl:(R1,G1,B1),Alt:(R2,G2,B2),menu,Inspection,window,Top,122,*NoSolder(SolderPaste)-2,menu,Inspection,window,Top,Example,component,window,pad,LandJudgementSettingboundariesformaxandminonbothtopandsidelights,e.g.,Lighting:Toplight,123,*NoSolder(forPost-printing)-3,PasteRectLandjudgment+tracking,i.e.Samplevalue=WS/WL*100%,Searcharea(WL),Inspectionarea(WS),menu,Inspection,window,Top,Lighting:Toplight,solder,Example:,window,124,SoldersAroundtheLead,Topviewofthesolderfillets(normalandabnormalones)looksimilarProfilesofthesolderfilletsandtheirtopviews:,OK:normal,NG:insufficient,NG:toolittle,menu,Inspection,window,Top,125,NoSolder-4(forIC),IndependentAlgorithmsPINSolder:Solderinspectionsfocusontheareaaroundthepinandalwaysinspectthesolderatthecorrectposition!,Example:,SolderInspection,ICBody,Definethelocationofthelead,Lighting:MLTlight,menu,Inspection,window,Top,Searchthelocationofthepin,Definetheareaofinspection,InspectionArea,126,SettingofPINSolder-1,ParametersettingsofPINSolderisshownasfollows:,Algorithm,Parametersettings,Tolerancesamplelimit,menu,Inspection,window,Top,127,SettingofPINSolder-2,Detailsandthedefinitionsoftheparametersettings,SolderRange:thedistancebetweenthepinkandyellowwindowsinthe+xdirection.,WidthRange:distancebetweenthepinkandyellowwindowsinthey-direction.,LeadRange:lengthoftheyellowwindow,SolderBrightness:inspectingforthedarknessbetweentheyellowandpinkwindows,i.e.settingfrom0toanydesiredbrightnessvalue.,Shift:vectorusedfortheadjustment,menu,Inspection,window,Top,128,ThePass/FailCriteriaandtheInternalProcessforPINSolder,PASS/OKDarknessarefoundwithinthedefinedtolerance(OKRange)Fail/NGDarknessarefoundoutsidethedefinedtolerance(OKRange),InternalProcessofauto-windowlocationsearchSearchrangeissetas16pixelsFirstdetectthelengthofthelead,i.e.searchforthechangesofbrightnessinsidethewindowdefined,e.g.Thensearchinthewidthdirection,e.g.,LEAD,ICBody,1.DarkBright,2.Bright,Dark,Dark,Bright,Dark,LEAD,ICBody,1.DarkBright,Searchdirection,2.DarkBright,menu,Inspection,window,Top,129,*NoSolder(SolderPaste)-5.1(forIC),ToneBasedAlgorithmsLiftedLead:aimedtosearch/definetheedgeoftheleadandthepad.(forlargepad,i.e.longpadonly),Example:,SolderInspection,PadInspection,ICBody,Toplight:Searchfrombrighttodark,Lighting:top/sidelight,SidelightSearchfrombrighttodark,menu,Inspection,window,Top,130,*NoSolder(SolderPaste)-5.2(forIC),Lifted-leadUseB/Wtoform2sub-windowsinordertoinspectboththesolderconditionsattheleadandthepadsimultaneouslyThetopwindow(pink)detectsthebrightnessandthebottomone(green)looksforthedarknessinthedefinedareaNote:thisalgorithmcanonlybeusedforlong(large)pad(becauseitonlyworkswithaverticalrectangularwindow)SettingsToaccesstotheeditingpage,rightclickontherightcorneroftheimage,Always255(thebrightness),Thewidthofthepinkwindow,Thesearch(adjustment)ofthepinkwindow,Thisisthesamplerateinsidethelevelsdefined,iflargerthanthisvalue,thenitfailsthewindow,Betweenthese2values,itchecksthePad(detectingbythegreenwindow),Lowerthethisvalue,thenitpassesthewindow,menu,Inspection,window,Top,131,*NoSolder(SolderPaste)-5.3(forIC),Thesamplevaluedetectedinsidethelevels,Thewidthofthegreenwindow,Thesearch(adjustment)ofthegreenwindow,OKRange,-1meansnoinspectionperformed,Pinkwindow,Greenwindow,Cross-sectionofthelead,menu,Inspection,window,Top,132,SettingSummaryforSolderInspection-1,MainlyforICs,menu,Inspection,window,Top,Mainlyforthepost-printingprocess,Mainlyforthepre-reflo