使用FLOTHERM PACK仿真电子元件封装的热特性

Voon Hon Wong, PhD. Thermal Characterization of IC Packages using FloTHERM PACK Chengdu, 8 November 2013 Senior Application Engineer Mentor Graphics Asia Pte. Ltd. Mechanical Analysis Division Products 2 1D Thermo-Fluid CFD for Aero, Auto, Process and Power Generation Industries Flowmaster fast and accurate simulation of fluid mechanics and pipe flow in complex systems Concurrent CFD for All Industries FloEFD a paradigm shift in CFD: fully embedded in the mechanical design environment Heating and Ventilation in Buildings FloVENT optimizes airflow, temperature distribution and contamination control in and around buildings Hardware for Thermal and Optical Testing T3Ster thermal testing of electronic parts and systems Thermal Analysis of Electronic Systems FloTHERM CFD market leader in the electronics vertical market (IC Packages, PCBs, Systems) FloTHERM XT Concept through verification electronics The Importance of Thermal Characterization In any semiconductor IC package, we are concerned with the Junction Temperature Temperature effects are linked to: Functional performance Timing errors in digital ICs Performance of analog circuits LED colour and brightness Reliability Solder joint cracking PCB trace delamination PCB FR4 melt Fusing 3 Source: Lumileds How Thermal Simulations can help ? Minimise the risk of 1st physical prototype failure By observing performance of simulated virtual prototypes throughout the design process 4 Source: Wikipedia IC Package Representation 5 Various methods of component representation exist Choice most often based on data availability rather than simulation intent! Increasing Tj and Tc predictive accuracy ja Thermal resistance from junction to ambient metric Good for comparative purposes only, NOT predictive Junction Leads Bot Inner Bot Outer Side Top Inner Top Outer Junction Board Case (top) Thermal Resistor Network model “2-Resistor” and “DELPHI” types Capable of Tj and Tc prediction Generally DELPHI models are better than 2-Resistor Results as good as the derivation of the characteristic thermal resistances k=? Simple block model Good for typical case temperature prediction at best Detailed model Explicit representation of internal construction geometry, materials, die size etc. Capable of Tj and Tc prediction Most accurate model type available How can we get accurate IC models ? 6 FloTHERM PACK () Creates detailed IC designs Compact thermal models of detailed models JEDEC standard test setup Downloadable into FloTHERM & XT FloTHERM PACK options Your Initials, Presentation Title, Month Year 7 Any tools to verify our FloTHERM PACK models ? Experimental characterisation of model parts Demanded from the supplier Conducted by end-user T3Ster measured structure functions provide a thermal x- ray of ICs and semiconductors Can be used to calibrate/