手机基本结构介绍ppt课件

手機的基本結構介紹,1,內容提要,一.手機基本結構介紹;二.手機零件介紹;三.手機設計開發流程簡介;四.手機測試驗證簡介,2,手機基本結構介紹,手機結構魚骨圖介紹;手機結構爆炸圖分析;.翻蓋型手機(ClamPhone).直板型手機(Candybar),3,天線模組,連接器模組(I),電路板模組,IML機殼,多媒體卡連接器,ShieldingCan,電路板(PCB),SIM卡連接器,天線組件,振動器,按鍵模組,顯示模組,塑膠機殼模組,遮蔽模組,手機機構組件,EMI墊片,開關/接鍵,IMD機殼,EMI處理,多色異材設出,鏡片,防塵墊,單色烤漆,雙色烤漆,電鍍處理,IMLkeyPad,Plastic+Rubber,Multi-pointmolding,Laser刻字,LCD連接器,Rubber,SD卡連接器,電池連接器,電源插口,語音插口腔,輸入輸出端口,多色射出(異材),主動元件,被動元件,Camera,其子電子元件,LCD,TouchScreen,陣列天線,EMIFormINPlace,麥克風,Speaker,面型天線,線型天線,ShieldingStrip,EMISputtering,EMIhousing,EMIGasket,反射薄膜,光源,Lightguide,Metaldome,振動器連接器,連接器模組(I),麥克風連接器,觸摸開關,Volume連接器,Speaker連接器,7,手機機構組件魚骨圖,4,手機結構爆炸圖分析-翻蓋型,專案名稱:ZUMA市場定位:Hightier自動翻蓋手機(2.0MCameraMP3AGPSBLUTOOTH)產品客戶:SpringNextel/BoostMobile,5,Ant_launch_holder,Ant_launch,Baker_Side_button_(withadhesive),SideButton,TopButton,Speak_grill_left,vibrator,Main_PCB,SD_connector,AGPS_carrier,AGPSelement,Housing_front,SpeakerFeltRight,SpeakerFeltLeft,Main_keypad,SpeakerGrill_right,Switch_PTTButtonMylar-,Antenna_Blue_tooth,Antenna_Blue_tooth_carrier,Latch_SIMDoor,Door_SIMConnector,BaseScrewPlugLeft,Antenna,Backer_TOPButton(withadhesive),Hinge,HingePushButton(withadhesive),HingePushButtonCap,Switch_ButtonsTOPMylar,SD_Baker(withADH),Backer_SIM(withadhesive),Base_flex,Speaker-HSG,Seal_BackAcoustic,BatteryFloor,Pin_SIMConnector,ADH_speaker_HSG,BaseScrewPlugRight,BaseScrew(4),Antenna_screw,Spring_BatteryDoorLatch,Battery_cover_HSG,Audiojackseal,Seal_AccessoryConnector,Latch_BatteryCover,Battery,Housing_back,Speaker(withadhesive),Housing_Audiojackconnector,Batterybumper-,Main_keypad_Mylar,ZUMA_bottom_view,6,ZUMA_top_view,Lens_Inner,ADH_Lens_Inner,Screw_flip(4),Transducer_felt,magnet,Flip_inner_HSG,Camera_shield,Transducer,camera,lensFlip_outer,Flip_outer_HSG,Mp3_Button_down,Boostlogolightguide,Felt_Flipouter(with_adhesive),Grill_flip_outer,Lens_flash,Outer_Lens_ADH,Camera_PORON_pad(withadhesive)(2),Camera_lens_adhesive,LCD_bezel,Super_flex_bare,Transducer_Grill,Camera_lens,PORON_CID(withadhesive),Bushing_screw_insert(4),_HOS_pad(withadhesive),Mp3_Button_down_Mylar,Mp3_Button_up_Mylar,Mp3_Button_up,CID-LCD_ASS,LCD_bezel_poron(withADH),7,手機結構爆炸圖分析-直板機,專案名稱:KingfisherII市場定位:LowTier(帶AGPS功能)產品客戶:BoostMobile,8,lens,Fronthousing,Sidekey,Mic_asm,Keypad,Transducerasm,Lcdgasket,MainPCB,Jackseal,Acousticseal,speaker,Vibratorasm,Antennacap,GPSantenna,Backhousing,Batterydoor,Sim_tray,Bump,GPSstopper,AntennaCoil,Antennacushion,Feltspeaker,LCDmodule,LCDframe,Kingfisher2masterassembly,9,手機零件介紹,Uniqueparts-Plasticparts;-Metalparts;-Diecutparts;-Rubberparts;Commonparts-ElectricModule,10,Plasticparts-uniques,常用材料:一般採用PC,PC+ABS,IXEF,Thermotuf,PMMA,ABS等等;主要應用零件:殼體類零件,支架類零件,導光件,鏡片等等;製造工藝:主要是模具射出成型;表面處理一般用烤漆,電鍍,電鑄,IML/IMD,燙印,水轉印,移印等等;尺寸型狀要求:形狀較複雜,尺寸精度較高.,11,Metalparts-uniques,常用材料:不鏽鋼板材,鎂合金,鋁合金,線材,鍍鋅板等等;主要應用零件:殼體類零件,支架類零件,屏蔽罩,彈簧,軸類以及螺絲等等;製造工藝:沖壓成型,壓鑄成型,機加工等等;表面處理一般用電度,陽極,拋光,拉絲,蝕刻,移印,鑽雕等等;尺寸形狀要求:形狀可以較複雜,尺寸精度較高.,12,Rubberparts-uniques,常用材料:Siliconrubber,TPU等等;主要應用零件:按鍵,密封件,緩衝件,以及用於雙色成型等等;製造工藝:注射成型,模壓成型等等;表面處理一般用烤漆,鐳雕等等;尺寸形狀要求:形狀可以較複雜,但尺寸精度一般.,13,Diecutparts-uniques,常用材料:泡棉,背膠,貼紙,薄塑膠板材,保護膜,Film等等;主要應用零件:密封件,緩衝件,外觀貼紙標簽,表面保護膜等等;製造工藝:模具沖切,鐳射切割;尺寸形狀要求:形狀簡單;模具沖切的尺寸精度較低,鐳射切割的精度高,但成本也高,不具備量產性能.,14,Electricalmodule-commonparts,EM零件-電子機構件,電子和結構同時管控的零件.具體如下:,AudioJack-音頻接口,Batteryconnector-連結電池和主板,電池給主板供電,Batterychargeconnector-充電器和數據線接口.,15,Electricalmodule-commonparts,KeypadMylarDome-Keypadswitch,按鍵開關,Mylar+,Adhesive+,Dome,Mic-麥克風,16,Electricalmodule-commonparts,Flex-軟板,起柔性連結作用.,SDconnector-SD卡基座,17,Electricalmodule-commonparts,SIMconnector-SIM卡連接器.,Vibrator-震動馬達,手機震動時動力來源.,Speaker-喇叭,18,Electricalmodule-commonparts,CameraFlash-攝相頭閃光燈,Camerasocket-攝相頭基座,HingeFlex-軟板,起柔性連結作用.,19,Electricalmodule-commonparts,CID-(CallIndicatorDisplay)外部顯示屏,Camera-攝相頭,Transducer-(Receiver)音蘋轉換器.,20,Electricalmodule-commonparts,LCD-(Liquidcrystaldisplay)主顯示屏,21,手機設計開發流程簡介,Pre_MasterfilereceivedfromMotorola,Feasibilitystudy/Conceptdesign,Refine/CompleteIDmasterfile,AAR(ArchitectureAcceptanceReview),Conceptdesignreview,IDmasterlockdown,IDRendering,IDRenderinglockdown,CMF,CMFSignoff,22,Detaildesign,Analysis(Interferencecheck,TA,simulation,etc),CDR(Criticaldesignreview),Finaldesignreview,Toolingrelease,Processcheck(SOP/fixturecheck,Mockupsamples,IDmasterlockdown,23,FOT,Assemble(LV/LX),ABC/ALTTEST,Pilotbuild,Rampup,SA,databasechanges,ECN,DMAIC/ANALYSIS,Processcheck(SOP/fixturecheck,24,手機可靠性驗證,可靠性驗證是手機設計開發過程中必不可少的環節,它是通過在惡劣環境下加速老化來檢測手機和零件的性能.,25,手機可靠性驗証簡介,溫濕度,鹽霧,滴水,輻射,砂塵,按鍵,轉軸耐久性測試,跌落,彎曲,振動,通訊信號參數檢驗,26,手機驗証項目(環境應力驗證),高溫試驗低溫試驗高溫高濕試驗溫濕度循環試驗冷熱沖擊試驗陽光老化試驗,冷凝試驗鹽霧試驗雨淋試驗砂塵試驗紫外光試驗抗化學試驗,27,手機驗証項目(機械應力驗證