PCBEnglishTraininginfactory

PCB常用英语单字PrintedCircuitBoard,诚信Integrity创新Innovation尊重Respect团结TeamWork,1,英文邮件常用语集,P03,厂内常用报告,P11,P13,线路板生产材料及单位,设备一览,01,目录,Contents,02,03,04,2,P15,PCB简易流程图,05,P16,厂内标示牌,06,P17,其他常用单字,07,P26,英文邮件常用语集,3,星期二,Tues.=Tuesday,星期三,Wed.=Wednesday,星期四,Thur.=Thursday,星期五,Fri.=Friday,Mon.=Monday,Sat.=Saturday,星期六,星期一,星期日,Sun.=Sunday,日期：,4,JanFebMarApr,AugSepOctNov,MayJunJul,1,2,3,一月：Jan.=January二月：Feb.=February三月：Mar.=March四月：Apr.=April五月：May.=May六月：Jun.=June,七月：Jul.=July八月：Aug.=August九月：Sep.=September十月：Oct.=October十一月：Nov.=November十二月：Dec.=December,英文邮件常用语集,日期：,5,英文邮件常用语集,常见缩略词:,6,英文邮件常用语集,样品Sample：免费样品：Freesample收费样品：Chargesample,交付：Delivery交期提前：Pullin交期推后：Pushout预计到达时间：ETA=EstimatedArrival预计离开时间：ETD=EstimatedDeparture,7,英文邮件常用语集,在制品：WIP=WorkinProcess试生产：P/R=PilotRun量产：MP=MassProduction退货：Returns重工：Rework报废：ScrapPCB設計專用檔：GerberFile工程问题：EQ=EngineeringQuery周期码：D/C=DateCode禁用周期：ForbiddenDateCode,报价：Quotation订购单：P/O=PurchaseOrder订单取消：CancelOrder装箱单：P/L=PackingList提单：B/L=BillofLanding发票：Invoice,8,英文邮件常用语集,装运Shipment:分批装运：PartialShipment短装：ShortShipment装船日期：ShipmentDate装运港：PortofLoading卸货港：PortofDischarge,运输方式：未完税交货:DDU=DeliveredDutyUnpaid目的地交货:DAP=DeliveredatPlace船上交货价:FOB=FreeOnBoard成本加保险费加运费:CIF=Cost,InsuranceandFreight货交承运人（指定地点）:FCA=FreeCarrier,收付款通知：贷记通知：CreditNote借计通知：DebitNote,9,英文邮件常用语集,Seekformorefeedback寻求反馈：,Givefeedback意见反馈：,Attachment附件:,Lookforwardtoyourfeedbacksandsuggestionssoon.期待您的反馈建议!Pleasecontactmeifyouhaveanyquestions.有任何问题,欢迎和我们联系。,Myanswersareinbluebelow.我的回答已标蓝。Iaddsomecommentstothedocumentforyourreference.我就文档添加了一些备注,仅供参考。,Attachisthedesigndocument,pleasereviewit.设计文档在附件里,请评阅。Ienclosetheevaluationreportforyourreference.我附加了评估报告供您阅读。,10,英文邮件常用语集,Proposal提议,Thanksnote感谢信,Apology道歉,Iwouldreallyappreciatemeetingupifyoucansparethetime.Pleaseletmeknowwhatsuitsyoubest.如果您能从百忙中抽出时间，我希望能与您见面。请让我知道最适合您的时间。,Anycommentswillbemuchappreciated.对于您提出的任何建议，我将深表感谢。Iwouldappreciateyourkindestunderstandingwith/regardingthismatter.我很感激你对这件事情的理解。,Wearesorryforanyinconveniencecaused.对于产生的任何不便，我们感到抱歉。Sorry,Imlateinreplyingtoyoure-maildatedMonday,April1.抱歉，太迟回您在4月1日星期一发给我的邮件。,11,厂内常用报告,纠正措施报告：CAR=CorrectiveActionReport真因：RootCause即时改善行动：ContainmentAction永久改善行动：PermanentActionPlan改善行动有效性验证：VerificationIndicator预防行动：PreventionAction验证结果：VerificationResult,出货报告：OutgoingReport供应商：Supplier供应商编码：SupplierCodeNo.客户：Customer客户编码：CustomerCodeNo.客户料号：CustomerP/N:供应商料号：SupplierP/N:,稽核报告：AuditReport严重问题：Major次要问题：Minor主要管控参数：MainParametersControlledSPC管制图：SPCChart（StatisticalProcessControl）抽检：SamplingInspection国际标准：InternationalStandard,12,厂内常用报告,作业指导书：WI=WorkInstruction版本：Revision,环境：Environment工作区域6S：Workarea6S亮度：Luminance温度：Temperature湿度：Humidity制造区域：Manufacturingarea,作业员：Operator标识：Identification不良品：RejectedParts,物料：Material标识：Identification不良品：RejectedParts,稽核报告,13,原材料Rawmaterials：,基板/覆铜板：Core/CCL（CopperCladLaminate）半固化片：PP=Prepreg铜箔：CopperFoil干膜：DryFilm防焊油墨：SolderMask底片：ArtWork,线路板生产材料及单位,辅料Accessories：,垫板：Back-up铝片：AluminumSheet钻针：Drillbit铣刀：RoutingBit内层油墨：I/LSolderMask药水：Potion,14,线路板生产材料及单位,密耳:mil(1mil=0.0254mm)微米：um（1um=0.001mm）毫米：mm,盎司:OZ(10z=35um=1.35mil)英寸：inch(1inch=25.4mm=1000mil）,平方英尺：SF=SquareFeet层数：Layer,公斤:KG=Kilogram公升：L=Liter,15,设备一览,自动曝光机ExposureMachine,DES线DESline,棕化BrownOxide,钻孔机DrillingMachine,外层前处理O/LPretreatment,显影Developing,PCB简易流程图,16,17,厂内标示牌,内层作业流程:前处理-涂布-曝光-显影-蚀刻-去墨,内层课InnerLayerSection:前处理线-Pretreatment涂布线-Coating半自动曝光-Semi-automaticExposure全自动曝光-AutomaticExposureDES线-DES(Developing、Etching、Stripping),厂内流程标示牌：,光测课OpticalInspectionSection:光学检查区：OpticalInspection,18,厂内标示牌,压合作业流程:棕化-组合-叠板-压合,压合课LaminationSection:裁切-Cutting磨边-EdgingPP裁切-PPCutting钻靶-X-rayTargetDrilling水平棕化-HorizontalBrownOxide叠板-Layup热熔-Bonding压合区：Lamination压机：LaminatingMachine组合-Layup回流线-Reflow,厂内流程标示牌：,19,厂内流程标示牌,钻孔课DrillingSection:钻孔A线-DrillingLineA备针房-DrillBitRoom,外层作业流程:前处理-PTH-一铜-压膜-曝光-显影-二铜-镀锡-蚀板,电镀课PlatingSection:PTH前处理：PTHPretreatmentPTH一铜区-Cu二次铜线-Cu蚀刻区-Etching,厂内流程标示牌：,20,厂内标示牌,外层课OuterLayerSection:外层前处理-OuterLayerPretreatment外层曝光区-OuterLayerExposure外层显影线-OuterLayerDeveloping中检AOI扫瞄区-AOI,防焊课SolderMaskSection:印刷前处理-S/MPretreatment防焊印刷室-S/MPrintingRoom防焊曝光室-S/MExposureRoom防焊显影线-S/MDeveloping,厂内流程标示牌：,21,厂内标示牌,加工课CNC:文字印刷区-PrintingofLegend烘烤/压烤区-Baking成型区-Routing成品清洗区-FinalClean化金线-ENIG,成检课FQC：OSP线-OSP（OrganicSolderabilityPreservatives）测试区-E-Test检修找点区-VRS治具放置区-Fixture外观检验区-VisualInspection包装区-Packing,厂内流程标示牌：,22,厂内标示牌,CAM课CAMSection:网版室-StencilRoom底片室-ArtworkRoom,制前课DesignForManufacturingSection治具室-Fixture,品管课QCSection:化学实验室-CQC(ChemicalQualityControl)MRB（MaterialReviewBoard）,品保课QASection:物理实验室-RQA（ReliableQualityAnalysis）OQC（OutgoingQualityControl）切片室-Micro-sectionRoom阻抗室-ImpendenceRoom,产销课ProductionControlSection：成品仓-FinishedProductWarehouse,23,厂内标示牌,ROHS：ROHS产品关于在电子电气设备中禁止使用某些有害物质指令(RestrictionofHazardousSubstances）,HF+RoHS：无卤产品和RoHS产品（Halogen-free+RoHS）,非RoHS：即一般产品Non-RoHS,生产机台标示牌：,压合热熔机生产HF+RoRS产品放置,压合热熔机生产RoHS产品放置,24,卤素（Halogen）物质？,ROHS物质？,镉Cd，铅Pb，汞Hg，六价铬Cr6+，多溴联苯PBB，多溴二苯醚PBDE,氟F，氯Cl，溴Br，碘I，砹At,厂内标示牌,生产机台标示牌：,25,厂内标示牌,总经理室GMOffice,行政部AdministrationDept.,营业部BusinessDept.,稽核室AuditingOffice,财务部FinanceDept.,品质工程部QualityEngineeringDept.,材料事业部MaterialDep