SD卡协议1、SDIO-SD卡tf卡座

1 2008.2 microSD Card Connectors DM3 Series NEW Features Common to the entire Series 1. Extremely small size Small external dimensions and the above-the-board height make the connectors the smallest on the market. 2. Reverse card insertion protection Unique card slot design (patent pending) protects the connector from damage when the card is attempted to be inserted in reverse, allowing it to re-inserted correctly. 3. Effective ground and shield configuration 4-connection points of the metal cover to the printed circuit board assures secure connection of the ground circuit and provides EMI protection. 4. Rigid and strong construction Despite its small size, high-strengths materials used in the connectors produced a strong and rigid structure. 5. Card detection switch The card detection switch is Normally Open 6. RoHS compliant All components and materials comply with the requirements of the EU Directive 2002/95/EC DM3AT and DM3B (Push - Push, with ejection mechanism) Card fall-out prevention Built-in card tray and the unique push insertion-push ejection mechanism (patent pending) prevent accidental card ejection or fall-out. Despite its small size the connectors will eject the card to a distance of 4.0 mm, allowing easy hold and removal of the card. Exposed termination leads Easy inspection and rework of the solder termination joints. DM3C (Hinge, Push-Pull, manual, without ejection mechanism) Simple and reliable card insertion Hinged metal cover provides location and guides the card during the insertion / removal. Closing of the cover confirms the electrical and mechanical connection with a tactile click sensation. Reliable contact with the card contact pads Unique contact design and card slide action will clean the contact areas of the card. Accessible termination areas Contact solder terminations may be inspected and reworked. DM3D (Push -Pull, manual, without ejection mechanism) Partial card insertion hold Card will not fall-out even when it is not fully inserted. Full insertion and electrical / mechanical connection is confirmed with a distinct tactile feel. Accessible termination areas An inner lead system that can be reworked is used in this design. Contact solder terminations may be inspected and reworked. Applications Mobile phone terminals, digital cameras, PDAs, miniature information terminals and any other portable device requiring use of small size high reliability microSD memory card connectors. etc. Card insertion-ejection Push-Push Hinge-manual insertion/ ejection Push-Pull manual insertion/ ejection DM3AT DM3B DM3C DM3D 24 57 810 1113 SeriesImagePage The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. DM3 SeriesmicroSD Card Connectors 2 DM3 AT SF PEJ Specifications(DM3 Series) Ratings Current rating: 0.5A Voltage rating: 125V AC Operating temperature range: -25 to +85 (Note 1) Storage temperature range: -40 to +85 (Note 2) Operating humidity range: RH 95% max. (No condensation) Ordering information 1423 Measure at 500 V DC 500 V AC / 1 minute 1mA Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 3 directions for 2 hours 96 hours at of 40 2, and humidity of 90 to 95% -55 5 to 35 85 5 to 35 Times: 30 min. 5 min. 30 min. 5 min. 5 cycles 10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B) 5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D) Reflow: At the recommended temperature profile Manual soldering : 350 for 3 seconds 1000 M min. (Initial value) No flashover or insulation breakdown 100m max. (Initial value) No electrical discontinuity of 100 ns or longer No damage, cracks or parts dislocation. Contact resistance: 40 m max. (change from initial value) Insulation resistance: 100 M min. No damage, cracks or parts dislocation. Contact resistance: 40 m max. (change from initial value) Insulation resistance: 100 M min. No damage, cracks or parts dislocation. Contact resistance: 40 m max. (change from initial value) No deformation of components affecting performance. 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 5. Humidity 6. Temperature cycle 7. Durability 8. Resistance to soldering heat ItemSpecificationConditions Note 1: Includes temperature rise caused by current flow. Note 2. The term storage refers to products stored for long period prior to mounting and use. Series name: DM3 Connector type: AT Push-Push (ejection mechanism), Top board mounting (Standard) B Push-Push (ejection mechanism), Bottom board mounting (Reverse) C Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard) D Push-Pull (no ejection mechanism), Top board mounting (Standard) Number of contacts : 8 Termination type : SF Right-angle SMT(Standard) DSF Right-angle SMT(Reverse) Card ejection code : PEJ (Push insert/push eject) None : Manual card insertion/ejection 1 4 2 3 Materials and Finishes Remarks UL94V-0 - - - Part Material Finish Insulator Contacts Guide cover Other components LCP Copper alloy Stainless steel (DM3AT) Copper alloy (DM3B) Stainless steel Piano wire Color: Black Contact area: Gold plated Lead area: Gold plated Lead area: Gold plated - Nickel plated DM3AT, DM3B Remarks UL94V-0 - - Part Material Finish Insulator Contacts Guide cover LCP Copper alloy Stainless steel Color: Black Contact area: Gold plated Lead area: Gold plated Tin plated DM3C, DM3D The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. 3 DM3 SeriesmicroSD Card Connectors Example of applications DM3AT-SF-PEJ Portable device Recommended PCB mounting pattern 8.2MAX 8.65 1.3 15.1 0.15 14.1MAX 2.7 0.8 2.8 1 1.9 ( 3.2 ) 3.259.1 9.25MAX MIN 7.7 1.55 P=1.1 0.7 1 1.2 14.5 0.15MIN 1.2 3.7 9.9 14.05 7.9MIN 0.7 13.3MIN 0.15MIN8.2MIN 4.4MAX 6MIN 5.7MAX 8.9MIN 3 3 3 1 C 10 L C C L indicates the center line of the microSD card slot. No conductive traces. Card inserted Card detection switch Without the card Open Closed (A)(B)(A)(B) 1 3 2 Note All dimensions: mm DM3AT Push-Push (ejection mechanism), Top board mounting (Standard) Part number CL No.RoHS DM3AT-SF-PEJ609-0023-2YES ( 3.2 ) ( 7.35 ) #1(DAT2) #2(CD/DAT3) #3(CMD) #4(VDD)#5(CLK) #6(VSS) #7(DAT0) #8(DAT1) 13.85 2.90.15 ( 15 ) ( 0.8 ) (16.75): Card pushed-in for ejection (17:55): Card fully inserted (21.55): Card ejected 15.95 ( 11 ) ( 5.5 ) 1.68 15.95 1 L C Outline of the microSD card All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. DM3 SeriesmicroSD Card Connectors 4 Packaging Specifications ( 3.2 ) 32 28.4 P=4 2 1.75 1.5 20 14.2 ( 16.35 ) Unreeling direction Embossed carrier tape dimensions (1,500 pieces per reel) Reel Dimensions Top cover tapeEmbossed carrier tape End sectionMounting sectionLead section (400mm min.) Blank section (100mm min.) Blank section (160mm min.) 32.4 380 80 Unreeling direction All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. 5 DM3 SeriesmicroSD Card Connectors Example of applications DM3B, Push-Push (ejection mechanism), Bottom board mounting (Reverse) Part number CL No.RoHS DM3B-DSF-PEJ609-0018-2YES 15.45 15.1 (15) 15.95 13.85 (6.5)0.4 1.83 (0.55) #8(DAT1)#1(DAT2) #7(DAT0)#2(CO/DAT3) #6(VSS) #5(CLK)#4(VDD) #3(CMO) (5.5) (11) 16.05 (16.75): Card pushed-in for ejection (17:55): Card fully inserted (21.55): Card ejected 1 Outline of the microSD card Recommended PCB mounting pattern 10MIN 9.25MAX 8.65 7.7 1.9 10.05 P=1.1 0.7 0.7 1.28.9 0.5 3.05 1.5 (3.2) 0.2 0.35MIN 3.5 7.7MIN 9.7 0.8 3.2 1.9 13.3 14.3 C0.15 14.751.4 1.2 1 3 C L indicates the center line of the microSD card slot. No conductive traces. Card inserted Card detection switch Without the card Open Closed (A)(B)(A)(B) 1 3 2 Note All dimensions: mm All dimensions: mm DM3B-DSF-PEJ Portable device The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. DM3 SeriesmicroSD Card Connectors 6 Top cover tapeEmbossed carrier tape End sectionMounting sectionLead section (400mm min.) Blank section (100mm min.) Blank section (160mm min.) 80 380 32.4Unreeling direction Packaging Specifications 32 28.4 (16.35) 14.21.75 1.5 P=4 2 20 Unreeling direction (3.75) Embossed carrier tape dimensions (1,200pieces per reel) Reel Dimensions All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. 7 DM3 SeriesmicroSD Card Connectors Recommended PCB mounting pattern ( )3.2 1.4 6.31.65 2.7 2.71.2 14.4 12.9 2.6 12.9 2.6 2.89.311.5 1.2 1.4 0.7 P=1.1 7.7 9.5MAX 10.1MIN 3.5MAX 4.1MIN L C 12.4 ( 14.1 ) ( 13.8 ) 2.9MAX 8.25MIN0.55MIN 7.8MAX 7.8MAX 5.4MIN 3 3 3 1 GND(1) GND(2) GND(3) GND(4) GND(1) GND(2) GND(3) GND(4) ClosedOpen C L indicates the center line of the microSD card slot. No conductive traces. Card inserted Card detection switch Without the card 1 3 2 Note Example of Use applications DM3C, Hinge, Push -Pull (no ejection mechanism), Top board mounting (Standard) Part number CL No.RoHS DM3C-SF609-0019-5YES ( 1.78 ) ( 0.93 ) C L 12 0.1 ( 0.2 ) 13.9 ( 15.45 ):Card fully inserted 14.1 13.8 ( 11 ) ( 5.5 ) ( 6.9 ) 1.83 #1(DAT2) #2(CD/DAT3) #3(CMD) #4(VDD) #5(CLK) #6(VSS) #7(DAT0) #8(DAT1) 1 Outline of the microSD card All dimensions: mm All dimensions: mm DM3C-SF (shown open for card insertion) DM3C-SF (shown closed, with card inserted) Portable device The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. 8 DM3 SeriesmicroSD Card Connectors Top cover tapeEmbossed carrier tape End sectionMounting sectionLead section (400mm min.) Blank section (100mm min.) Blank section (160mm min.) 80 380 32.4 Unreeling direction Packaging Specifications 32 28.4 P=4 2 1.75 1.5 20 14.2 Unreeling direction ( 3.4 ) Embossed carrier tape dimensions (1,300pieces per reel) Reel Dimensions All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. 9 DM3 SeriesmicroSD Card Connectors Example of applications Recommended PCB mounting pattern 1.5 1.75 1.5 1.1 7.7 7.5 9.15 10.7 6.85 1.5 8.35 1 0.55 9.4 10.9 0.8 0.8 8.1MIN 1 1.85 0.4MIN 2.55MAX ( 4.5 ) 5.05MIN 4MAX 6MIN 8.2MAX 10.2MIN 1.4 3 C L 1 C L indicates the center line of the microSD card slot. No conductive traces. Card inserted Card detection switch Without the card Open Closed (A)(B)(A)(B) 1 3 2 Note DM3D, Push-Pull (no ejection mechanism), Top board mounting (Standard) Part number CL No.RoHS DM3D-SF609-0025-8YES 9.65 ( 0.7 ) ( 15 ) ( 5.5 ) 3.35 11.95 11.45 11.45 1.55 2.7 #8(DAT1) #7(DAT0) #6(VSS) #5(CLK) #4(VDD) #3(CMD) #2(CD/DAT3) #1(DAT2) ( 11 ) ( 6 ) ( 4.5 ) 0.9 1 ( 15.8 ):Card fully inserted C L 1 Outline of the microSD card, fully inserted All dimensions: mm All dimensions: mm DM3D-SF Portable device The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. DM3 SeriesmicroSD Card Connectors 10 Lead section (400mm min.) Mounting section End section Top cover tape Blank section (100mm min.) Embossed carrier tape Blank section (160mm min.) 24.4 380 80 Unreeling direction Packaging Specifications Unreeling direction 2 24 22.25 11.51.75 1.5 16 ( 11.85 ) P=4 Embossed carrier tape dimensions (2,000pieces per reel) Reel Dimensions All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-, or contact your Hirose sales representative. 11 DM3 SeriesmicroSD Card Connectors Refer to applicable Operation Manual listed below for additional precautions. Series DM3AT Series DM3B Series DM3C Series DM3D Series ETAD-F0345 ETAD-F0324 ETAD-F0335 ETAD-F0353 Operation Manual Number Recommended temperature profile Precautions 1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the ejection mechanism and electrical performance of the connector 2. Do not apply excessive force to the connector when handling or after installation on the PC board. 3. The connectors will reliably connect and operate with the correctly inserted microSDTMcards. Follow the correct insertion / ejection procedure for the specific connector in use. Attempts of incorrect insertion of the c