面板制程-CF-process-简介.ppt

CFProcess簡介,JerryTFT/LCD材料工程部,LCD&CF結構簡介CF光阻材料簡介CF製程及檢驗手法簡介MacroInspection判定方法MicroInspection判定方法CFProductIDnamingrule,課程大綱,LCD面板結構圖,LCD:LiquidCrystalDisplay(液晶顯示器),CF結構圖,剖面示意圖,俯視示意圖,實際圖例,CF:ColorFilter(彩色濾光片),光阻材料分類與成分,正型光阻:BM(Cr),MVA負型光阻:ColorResist(R,G,B),PS,RBM,彩色光阻,溶劑,固成分,Paste,Polymer,Monomer,Photo-initiator,Additive,PigmentDispersantSolvent,MonomerInitiator,光阻材料成分v.s光阻特性,CF製造流程,1.廣視角產品(MVA產品):,2.非廣視角產品(TN產品):,*BM依材質類型有Resin及CrBM二種,CF製作方法,CF製程機制:Photolithography,PhotosensitiveMaterials,Substrate,NegativeType,PositiveType,MM,Binder,UV,Pigment,Photo-initiator,Soluble,Insoluble,Coating,Exposure,Development,Images,UV,Photolithography:,顯影液:KOH,CFProcess,優點:1.Process減少(設備簡化)2.光阻用量減少,(1)Spin-轉速(rpm)決定膜厚,(2)Spinless-吐出量(PR值)決定膜厚,Coater,Spin,VCD,EBR,HP/CP,Exposure,Development,AOI,Oven,Cassette,Coater,VCD,HP/CP,Exposure,Development,AOI,Oven,Cassette,Coater:,優點:塗佈均勻性較好缺點：1.多一道製程2.光阻用量多(浪費光阻,增加成本),BMProcess(1300),BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGap,BMProcess,2.BMphotoline,一.CrBMprocess:,X,X:Spinless無,BMProcess,蝕刻,去光阻,紫外線曝光,顯影,烘烤(Oven),去掉邊緣光阻,EBR(EdgeBeadRinse),Aligner,Developer,Hotplate,3.Etchingline,Etching,Stripping,BMpatternglass,真空乾燥,VacuumDryer,Pre-bake&Coolplate,X,X:Spinless無,預烘烤(HP)與冷卻(CP),BMProcess,二.RBMprocess:,X:Spinless無,紫外線曝光,顯影,烘烤(Oven),去掉邊緣光阻,EBR(EdgeBeadRinse),Aligner,Developer,Hotplate,真空乾燥,VacuumDryer,Pre-bake&Coolplate,X,預烘烤(HP)與冷卻(CP),環保意識降低設備及建廠成本(省掉sputtering及Etching的設備)簡化製程流程製程一致性(BM,RGB,PS均使用負光阻),RBM的優點,Blackmatrix的功用,遮蔽TFT避免pixel以外區域漏光增進色彩對比性降低面板的反射光,Blackmatrix的需求,低反射率:減低外來光線的干擾高OD值:阻隔pixel間的背光(增高對比)膜厚薄(避免角斷差發生)低pinhole數:避免漏光,產生亮點低particle數:增加良率,BMInspection,ILSP01:ODStart區&平坦區各1點,片片檢避免Start區&平坦區的OD值差異太大.MUIN01:Macro確認In-lineMacro品質狀況(有無mura)PRIN01:AOI,CD確認In-lineMicro品質狀況避免CD太低,造成LCD漏光,RBMLayerIn-lineSampling,RBMLayeroff-lineSampling,SPME01:OD避免OD太低,造成LCD漏光MACR51:Macro確認BMoff-lineMacro品質狀況CDME01:CD,端寸,Totalpitch避免CD太低,造成LCD漏光避免T/P太大or太小,造成LCD對組後漏光SUFT01:BMThickness控制角段差及OD,RGBProcess(2300,3300,4300),BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGap,RGBProcess-R-Layer,紅色光阻塗佈(1),紅色光阻塗佈(2),Pre-cleaner,Slitcoater,Spincoater,BMpatternglass清洗,紫外線曝光,顯影,去掉邊緣光阻,EBR(EdgeBeadRinse),Aligner,Developer,烘烤,Oven,真空乾燥,VacuumDryer,預烘烤(HP)與冷卻(CP),Pre-bake&Coolplate,X,X,X:Spinless無,RGBProcess-G-Layer,綠色光阻塗佈(1),綠色光阻塗佈(2),Pre-cleaner,Slitcoater,Spincoater,Rglass清洗,紫外線曝光,顯影,去掉邊緣光阻,EBR(EdgeBeadRinse),Aligner,Developer,烘烤,Oven,真空乾燥,VacuumDryer,Pre-bake&Coolplate,X,X,預烘烤(HP)與冷卻(CP),X:Spinless無,RGBProcess-B-Layer,藍色光阻塗佈(1),藍色光阻塗佈(2),Pre-cleaner,Slitcoater,Spincoater,R,Gglass清洗,紫外線曝光,顯影,去掉邊緣光阻,EBR(EdgeBeadRinse),Aligner,Developer,烘烤,Oven,真空乾燥,VacuumDryer,Pre-bake&Coolplate,X,X,預烘烤(HP)與冷卻(CP),X:Spinless無,1,2,1.PixelCD2.Overlay3.厚度(RGB段差),4.RGB色度量測,3,RGBInspection,ITOProcess(5200),BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGap,WhatisITO?,ITO=IndiumTinOxide(銦錫氧化物)90wt.%In2O3+10wt.%SnO2,Sputtering(濺鍍)的原理,於真空環境下,通入高電壓及Ar/O2混合氣體,產生Ar+離子撞擊ITO靶材,形成銦錫離子與O離子反應成銦錫氧化物(ITO),濺鍍於產品上.,ITOsputteringprocess,ITOpre-cleaner(水洗,清洗無機物),R,G,B玻璃投入,DefectInspection(缺陷檢查機),(Micro1,4560),UVasher(清洗有機物),紫外線灰化,Repair(修補),(repair1,4578),ITOInspection,1.RGB色度量測2.Rs(電阻值)量測3.光穿透率量測4.ITO膜厚量測5.T/P量測,ITO,MVAProcess(6300),BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGap,何謂廣視角?,TNtype,SuperMVA,MVAProcess(Multi-domainVerticalAlignment),X:Spinless無,MVAInspection,1.厚度量測2.PixelCD量測3.Overlay4.Macro,膜厚,PSProcess(7300),BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGap(間距),PS,CF,TFT,PSProcess,X,X,X:Spinless無,PSInspection,1.厚度量測2.PixelCD量測3.Overlay4.Macro,膜厚,最終檢查(FinalInspection),Macroinspection,巨觀檢查,AOIPre-cleaner,光學檢查前清洗,AOI(Auto-OptoInspection),光學檢查(Micro2,7560),Microreview,拍照判Code,Judgement&Sorting,判定與品質分類,出貨Shipping,非MVA產品,MVA產品,Repair,修補(repair2,7578),MacroInspection判定方法,註：表示主要檢驗與判定方式；表示輔助檢驗方式。,MicroInspection判定方法,Defectcode設定為三碼,分述如下:,第一碼:群組區分,MicroInspection判定方法,第三碼:Defect類別,第二碼:層別,MicroInspection良率範例,MicroInspection判定方法,513BMBreak2,515BMRemain,517BMRemainParticle,51ABMScratch,521RShift,522RRemain,MicroInspection判定方法,550Dirty,528RSUSParticle,527RParticle,523RThinner,524RPinHole,52ARScratch,CFProductIDnamingrule,尺寸對照表,Thankyou!,Appendix1Col