IC封装流程介绍.pptVIP

IC封裝簡介,內容,現有的IC封裝型式(PackageType)介紹製造流程(ProcessFlow)介紹材料組成(BOM)介紹,封裝形式的定義,DIP:DualIn-linePackageSOP:SmallOutlinePackageSOJ:SmallOutlineJ-leadPackageSSOP:ShrinkSOPTSOP:ThinSOP(inc.typeI&II)QFP:QuadFlatPackageLQFP:LowprofileQFPBGA:BallGridArray,DIP:DualIn-linePackage腳數:28,現有的IC封裝型式(PackageType),現有的IC封裝型式(PackageType),SOP:SmallOutlinePackage腳數:8/18/32/44,現有的IC封裝型式(PackageType),SOJ:SmallJ-leadPackage腳數:24/42,現有的IC封裝型式(PackageType),SSOP:ShrinkSmallOutlinePackage腳數:48,現有的IC封裝型式(PackageType),TSOP-I:ThinSOPtype-I腳數:28/32/48,現有的IC封裝型式(PackageType),TSOP-II:ThinSOPtype-II腳數:40/44/50/54/66/86,現有的IC封裝型式(PackageType),QFP:QuadFlatPackage腳數:100/128/160/208,現有的IC封裝型式(PackageType),LQFP:LowprofileQFP腳數:48/64/100/128/176/208/216,現有的IC封裝型式(PackageType),BGA:BallGridArray尺寸:27x27/35x35,製造流程(ProcessFlow)介紹-前段,製造流程(ProcessFlow)介紹-後段,進料檢驗IQC(IncomingQualityControl),晶片,黏片WaferMount(WM),晶粒,切割WaferSaw(WS),導線架(花架),晶粒,銀膠,黏粒DieBond(DB),頭髮,金線,銲線WireBond(WB),壓模Molding(M/D),切腳前,切腳De-junk&Trim(DT),電鍍Plating(PL),油墨(ink),雷射(laser),蓋印Marking,成型及切單Forming&Singulation(F/S),1.花架(Leadframe)2.銀膠(Epoxy)3.金線(Goldwire)4.膠餅(Compound)*5.黃膠(Polyimide)*6.散熱片(HeatSink)*前四項為四大主料.,材料組成(BOM)BillOfMaterial,花架(導線架)Leadframe(L/F),常用種類(type):1.銅材(Cu):C7025,A-194,E-64T2.鐵材(Fe):A-42,銀膠Epoxy,常用種類(type):1.Ablebond8360forQFP/SOIC2.Ablebond8355FforTSOP&LQFP3.Ablebond8340forTSOP&LQFP4.HitachiEN4065DforTSOP&LQFP5.Ablebond8515forinsulator(絕緣),成份:99.99%Au常用線徑:1.1.3milforbondpitch90um以上.2.1.2milforbondpitch80um以上.3.1.0milforbondpitch7079um.4.0.9milforbondpitch69um以下.,金線GoldWire,主要成份:1.填充料Filler(SiO2):約70%2.合成樹脂Resin:2529%常用型號:1.EME6300/6600forQFP&SOIC2.EME7351LS/KMC260forTSOP3.EME7320ARforLQFP,膠餅Compound,後段(8)壓模Mold(9)烘烤PMC(10)去緯DT(11)電鍍Plating(12)油墨蓋印InkMarking(13)烘烤InkCure(14)切腳成型TrimForm(15)包裝PACK,LeadFrameAssemblyProcess,前段(1)晶片檢驗WaferIncoming(2)晶片粘片UVTapeMount(3)晶片切割Saw(4)UV照射UVirradiation(5)粘晶粒DieBond(6)烘烤EpoxyCure(7)銲線WireBond,WaferIncoming,UVirradiation,WaferMount,Saw,PMC,DT,Mold,DieBond,Plating,WireBond,EpoxyCure,TrimForm,InkCure,InkMarking,PACK,LeadFrameAssemblyProcessFlowChart,晶片粘片,(UV)WaferMount,晶片切割,Saw,UV照射,UVirradiation,粘晶粒,DieBond,烘烤,EpoxyCure,銲線,WireBond,壓模,Mold,烘烤,PMC,去緯,DT,電鍍,Plating,油墨蓋印,InkMarking,烘烤,InkCure,切腳成型,TrimForm,包裝,PACK,Taping,EpoxyCure,UVIrradiation,Saw,Detaping,WaferClean,UVTapeMount,Grinding,SubstratePre-Bake,Clean,WireBond,DieBond,Mold,SBBP,Marking,PMC,BGAAssemblyProcessFlowChart,ReFlow,Pack&Test,SawSingulation,FluxClean,WaferIncoming,Taping,上膠帶,Grinding,晶圓研磨,Detaping,去膠帶,晶圓電漿清潔,WaferClean,UVTapeMount,晶片黏貼(UV膠帶),Saw,晶片切割,UVIrradiation,紫外線照射,SubstratePre-bake,底座預烘烤,DieBond,晶片上片,EpoxyCure,銀膠烘烤,Clean,電漿清洗,WireBond,焊線,Mold,壓模,PMC,成型烘烤,Marking,Laser蓋印,SBBP,植球,ReFlow,迴焊,FluxClean,清洗,SawSingulation,切割成顆粒狀,Pack,ASECLTest,包裝與測試,Shipment,送交客戶,測試製程介紹,測試定義:測試製程是對於IC封裝完成的產品，以保証出廠IC功能的完整性，並對已測試的產品依其功能作分類（即分Bin），作為IC不同等級產品的評價依據；最後並對產品作外觀檢驗及包裝作業（Packing)，及出貨的運送作業(Shipping)。,功能測試及分類,1.上線備料2.功能測試-溫度循環測試(40+125)測試系