CCM产品工艺知识培知识PPT课件

.,CCM产品工艺知识培训,制作:陈建文日期:2011.8.20,.,2,产品的应用产品的类型产品的构造产品的制作工艺问与答附录:专业名词介绍,.,3,PartI产品的应用,.,4,PartI产品的应用,拆解,拆解,手机摄像模组,.,5,PartII产品的类型,软板定焦模式(FF)1.B-To-B2.GoldFinger,.,6,PartII产品的类型,软板变焦模式1.手动变焦(MF)2.自动变焦(AF),.,7,PartII产品的类型,插槽模式(Socket),.,8,PartII产品的类型,像素分类CIF(352*288)10万像素(0.1M)VGA(640*480)30万像素(0.3M)SXGA(1280*1024)130万像素(1.3M)UXGA(1600*1200)200万像素(2.0M),.,9,PartIII产品的构造,CSP(ChipScalePackage),.,10,PartIII产品的构造,COB(ChipOnBoard),.,11,PartIII产品的构造,镜头(Lens),镜座(Holder),芯片(Chip),电路板(PCB),连接器(Con.),.,12,PartIII产品的构造,FPC,.,13,PartIV产品的制作工艺,材料1.晶圆(Wafer)主要是由硅和锗组成,是摄像头模组的核心部分,称之为影像传感器。,.,14,PartIV产品的制作工艺,2.线路板PrintedCircuitBoard印刷电路板,是电子元器件的支撑体,是电子元器件电气连接的提供者,简称PCB.,.,15,PartIV产品的制作工艺,3.镜座(Holder),.,16,PartIV产品的制作工艺,4.镜头(Lens),.,17,PartIV产品的制作工艺,5.软板(FPC)FlexibleCircuitBoard软性印制电路是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性绝佳的可挠性印刷电路。,.,18,PartIV产品的制作工艺,工艺流程,Wafer清洗,Plasma清洗,固晶,固晶烘烤,邦线,金线检查,DAM邦定,DAM烘烤,二流体清洗,CCD检查,Glass贴附,CCD检查,固化,半成品测试,.,19,dispense,CMOSChip,dispense,IRGlass,dispense,+,+,+,+,LensBarrel,.,20,PartIV产品的制作工艺,DieBonding:使芯片与PCB粘合。注意点：1.芯片方向2.胶量3.顶针和吸嘴印4.芯片角度5.芯片位置6.芯片倾斜,.,21,PartIV产品的制作工艺,WireBonding:通过金线焊接使芯片与PCB线路导通。注意点：1.接线是否正确2.线弧3.金球大小4.金球厚度5.金线拉力6.金球推力,.,22,SolderPaste,ScreenPrint,PassivePlacement,ForDieAttach,Passive,SolderPaste,Passive,Substrate,.,23,DieAttach,WireBonding,WetClean,Chip,SensorArea,AuWire,Chip,SensorArea,AuWire,.,24,IRGlassMount,IRGlassSAW,WaferRing,IRGlass,IRGlass,.,25,GlueDispense,IRGlassAttach,Holder,Holder,Glue,Glue,IRcutGlass,IRGlass,CA800-IR,CA800-IR,.,26,GlueDispense,HolderAttach,Glue,Glue,BarrelInsert,Barrel,Holder,CA800-HA,CA800-HA,CA-800-BI,.,27,Singlation,cut,cut,.,28,Focusadjust,Barrel,BarrelFixation,Motor,Lighting（PercolationMethod),chart,AchromaticLens,ND4（AdjustmentofLightQuantity）,Laser,.,29,PartV问与答,Q&A,.,30,PartVI专业名词介绍,.,31,ENDThanks!,.,32,BondingProcess,.,33,pad,lead,Freeairballiscapturedinthechamfer,.,34,pad,lead,Freeairballiscapturedinthechamfer,SEARCHHEIGHT,.,35,pad,lead,Freeairballiscapturedinthechamfer,SEARCHSPEED1,SEARCHTOL1,.,36,Freeairballiscapturedinthechamfer,pad,lead,SEARCHSPEED1,SEARCHTOL1,.,37,Freeairballiscapturedinthechamfer,pad,lead,SEARCHTOL1,SEARCHSPEED1,.,38,Freeairballiscapturedinthechamfer,pad,lead,SEARCHTOL1,SEARCHSPEED1,.,39,Freeairballiscapturedinthechamfer,pad,lead,SEARCHTOL1,SEARCHSPEED1,.,40,Formationofafirstbond,pad,lead,SEARCHSPEED1,SEARCHTOL1,.,41,Formationofafirstbond,pad,lead,SEARCHSPEED1,SEARCHTOL1,IMPACTFORCE,.,42,FormationofafirstbondContact,pad,lead,heat,PRESSURE,UltraSonicVibration,.,43,FormationofafirstbondBase,pad,lead,UltraSonicVibration,heat,PRESSURE,.,44,Capillaryrisestoloopheightposition,pad,lead,.,45,Capillaryrisestoloopheightposition,pad,lead,.,46,Capillaryrisestoloopheightposition,pad,lead,.,47,Capillaryrisestoloopheightposition,pad,lead,.,48,Capillaryrisestoloopheightposition,pad,lead,.,49,Capillaryrisestoloopheightposition,pad,lead,RH,.,50,Formationofaloop,pad,lead,RD(ReverseDistance),.,51,Formationofaloop,pad,lead,.,52,pad,lead,.,53,pad,lead,CalculatedWireLength,WIRECLAMPCLOSE,.,54,pad,lead,CalculatedWireLength,.,55,pad,lead,SEARCHDELAY,.,56,pad,lead,TRAJECTORY,.,57,pad,lead,TRAJECTORY,.,58,pad,lead,TRAJECTORY,.,59,pad,lead,TRAJECTORY,.,60,pad,lead,TRAJECTORY,.,61,pad,lead,TRAJECTORY,.,62,pad,lead,TRAJECTORY,.,63,pad,lead,TRAJECTORY,.,64,pad,lead,TRAJECTORY,.,65,pad,lead,TRAJECTORY,.,66,pad,lead,2ndSearchHeight,SearchSpeed2,SearchTol2,.,67,pad,lead,SearchSpeed2,SearchTol2,.,68,pad,lead,SearchSpeed2,SearchTol2,.,69,Formationofasecondbond,pad,lead,heat,.,70,FormationofasecondbondContact,pad,lead,heat,heat,.,71,pad,lead,heat,heat,FormationofasecondbondBase,.,72,pad,lead,.,73,p