005_韦东山1期新b盘芯片手册dc-dc电感VIP

1、SpecNo.JELF243A-0069J-01P1/81.ScopeThis reference specification applies to LQH44PN_P0 Series, Chip coil (Chip Inductors).2.Part Numbering(ex) LQH 44 P N 4R7 M P 0LProduct ID Structure Dimension ApplicationsCategory Inductance Tolerance FeaturesElectrodePackaging L:Taping(LW)andCharacteristics3. Rati

2、ng Operating Temperature Range.(Ambient temperature; Self-temperature rise is not included) (Product temperature; Self- temperature rise is included)-40 to +85C-40 to +125C Storage Temperature Range.-40 to +125C*1:When applied Rated current to the Products,Inductance will be within 30% of nominal In

3、ductance value.*2:When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to 40 max.*3:Keep the temperature(ambient temperature plus self-generation of heat) under 1254. Testing ConditionsUnless otherwise specifiedTemperature : Ordinary Temperature

4、 (15 to 35C)In case of doubtTemperature : 20 2CHumidity: Ordinary Humidity(25 to 85 %(RH)Humidity: 60 to 70 %(RH)Atmospheric Pressure : 86 to 106 kPa5.Appearance and Dimensions1.650.154 002 Unit Mass (Typical value) 0.104.00.2No Marking. (in mm)0.2MURATA MFG.CO., LTDCustomerPart NumberMURAT

5、APart NumberInductanceDCResistance (W)Self Resonant Frequency (MHz min)*3 Rated Current (mA)(H)Tolerance*1 (Based on Inductancechange)*2 (Based onTemperature rise)LQH44PN1R0NP0L1.0N:300.03020%9029502450LQH44PN2R2MP0L2.2M:200.04920%7025001800LQH44PN3R3MP0L3.30.06520%5021001770LQH44PN4R7MP0L4.70.0820%

6、4017001700LQH44PN6R8MP0L6.80.1220%3514001340LQH44PN100MP0L100.1620%2511501170LQH44PN220MP0L220.3720%17800790CHIP COIL（CHIP INDUCTORS）LQH44PNP0L Reference SpecificationReference OnlySpecNo.JELF243A-0069J-016.Electrical PerformanceP2/87.Mechanical PerformanceMURATA MFG.CO., LTDNo.ItemSpecificationTest

7、 Method7.1Shear TestChip coil shall not be damaged.Substrate: Glass-epoxy substrate Applied Direction :Chip coilForce: 10NHold Duration: 51s7.2Bending TestSubstrate: Glass-epoxy substrate(100401.0mm)Speed of Applying Force: 0.5mm / s Deflection: 2mmHold Duration: 5seconds.Pressure jig FDeflection454

8、5Product(in mm)7.3VibrationOscillation Frequency: 10200010Hz for 20minutes Total Amplitude: 1.5mmTesting Time: A period of 2 hours in each of3 mutually perpendicular directions. (Total 6 hours)7.4SolderabilityThe wetting area of the electrode shall be at least 90% covered with new solder coating.Flu

9、x: Ethanol solution of rosin,25(wt)% (Immersed for 5s to 10s)Solder: Sn-3.0Ag-0.5CuPre-Heating: 15010C / 60 to 90seconds Solder Temperature: 2405CImmersion Time: 31 s7.5Resistance to Soldering HeatAppearance:No damage Inductance Change: within 10%Flux: Ethanol solution of rosin,25(wt)% (Immersed for

10、 5s to 10s)Solder: Sn-3.0Ag-0.5CuPre-Heating: 15010C / 60 to 90seconds Solder Temperature: 2705CImmersion Time: 101 sThen measured after exposure in the room condition for 242 hours.R230SubstrateNo.ItemSpecificationTest Method6.1InductanceInductance shall meet item 3.Measuring Equipment : Agilent 42

11、84A or equivalent Measuring Frequency:1MHz6.2DC ResistanceDC Resistance shall meet item 3.Measuring Equipment:Digital multi meter6.3Self Resonant Frequency(S.R.F)S.R.F shall meet item 3.Measuring Equipment: Agilent 4991A or equivalentReference OnlySpecNo.JELF243A-0069J-01P3/88.Environmental Performa

12、nce (It shall be soldered on the substrate.)9. Specification of Packaging9.1 Appearance and Dimensions of plastic tape1.750.11.5 +0.1-0*Lead-in/out wire(0.3)5.50.0512.0.4.00.18.01.9(in mm)4.32.0Direction of feedDimension of the Cavity is measured at the bottom side.9.2 Specification of Tapi

13、ng(1) Packing quantity (standard quantity) 1,000 pcs / reel(2) Packing MethodProducts shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.(3) Sprocket holeThe sprocket holes are to the right as the tape is pulled toward the user.(4) Spliced pointPlastic tape and Cove

14、r tape has no spliced point.(5) Missing components numberMissing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept.MURATA MFG.CO., LTDNo.ItemSpecificationTest Method8.1Heat ResistanceAppearance:No dam

15、age Inductance Change: within 10% DC Resistance Change:within 10%Temperature:852C Time:100048 hours0Then measured after exposure in the room condition for 242 hours.8.2Cold ResistanceTemperature:-402C Time:100048 hours0Then measured after exposure in the room condition for 242 hours.8.3HumidityTempe

16、rature:702C Humidity:9095%(RH) Time:100048 hours0Then measured after exposure in the room condition for 242 hours.8.4Temperature Cycle1 cycle:1 step: -402C / 303 minutes2 step:Ordinary temp. / 10 to 15 minutes3 step:+852C / 303 min4 step: Ordinary temp. / 10 to 15 minutes Total of 10 cyclesThen meas

17、ured after exposure in the room condition for 242 hours.Reference OnlySpecNo.JELF243A-0069J-019.3 Pull StrengthP4/89.4 Peeling off force of cover tape165 to 180 degreeFCover tapePlastic tape9.5 Dimensions of Leader-tape, Trailer and ReelThere shall be leader-tape (cover tape) and trailer-tape (empty

18、 tape) as follows.Trailer : 160 min.Leader2.00.5f 13.00.21f 600f 21.00.8Direction of feed13.01017.01.4f 1800(in mm)39.6 Marking for reelCustomer part number, MURATA part number,pection number(*1), RoHS marking(*2), Quantity etc OOOO *1) (1)(2)(3): Year / Last digit of year: Month / Jan. to Sep. 1 to

19、 9, Oct. to Dec. O, N, DFirst digit Second digitThird, Fourth digit : Day(3) Serial No.*2) Expression of RoHS marking ROHS Y ()(1) (2)(1) RoHS regulation conformity parts.(2) MURATA classification number9.7 Marking for Outside package (corrugated paper box)Customer name, Purchasing order number, Cus

20、tomer part number, MURATA part number, RoHS marking (*2) ,Quantity, etc 9.8. Specification of Outer CaseLabelHD* Above Outer Case size is typical. It depends on a quantity of an order.WMURATA MFG.CO., LTDOuter Case Dimensions (mm)Standard Reel Quantity in Outer Case (Reel)WDH186186934Label190 min210

21、 minEmpty tapeCover tapeSpeed of Peeling off300mm/minPeeling off force0.2 to 0.7N(minimum value is typical)Embossed carrier tape10N min.Cover tape5N min.Reference OnlySpecNo.JELF243A-0069J-01P5/810.CautionLimitation of ApplicationsPlease contact us before using our products for the applications list

22、ed below which require especially high reliability for the prevention of defects which might directly cause damage to the third partys life, body or property.(1) Aircraft equipment(2) Aerospace equipment(3) Undersea equipment(4) Power plant control equipment(5) Medical equipment(7) Traffic signal eq

23、uipment(8) Disaster prevention / crime prevention equipment(9) Data-processing equipment(10) Applications of similar complexity and /or reliability requirements to the applications listed in the above(6) Transportation equipment (vehicles, tra, ships, etc.)11. NoticeThis product is designed for sold

24、er mounting.Please consult us in advance for applying other mounting method such as conductive adhesive.11.1 Land pattern designing (Reflow Soldering)Recommended land patterns for reflow soldering are as follows:These have been designed for Electric characteristics and solderability.Please follow th

25、e recommended patterns. Otherwise, their performance which includes electrical performanceor solderability may be affected, or result to position shiftoldering process.LandChip Colil4.40Solder Resist3.0(in mm)1.301.5511.2 Flux, Solder11.3 Soldering conditions (Reflow) Pre-heating should beuch a way

26、that the temperature difference between solder and product surfaceis limited to 100C max. Cooling into solvent after soldering also should be temperature difference is limited to 100C max.uch a way that theufficient pre-heating may cause cracks on the product, resulting in the deterioration of produ

27、ct quality. Standard soldering profile and the limit soldering profile is as follows.The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality.MURATA MFG.CO., LTDFluxUse rosin-based flux.Dont use highly acidic flux with ha

28、lide content exceeding 0.2(wt)% (chlorine conversion value).Dont use water-soluble flux.SolderUse Sn-3.0Ag-0.5Cu solder.Standard thickness of solder paste : 100m to 150mReference OnlySpecNo.JELF243A-0069J-01soldering profileP6/8Reflow soldering profileTemp.()mit Profile180150Standard ProfileTime.(s)

29、11.4 Reworking with soldering iron.The following conditions must be strictly followed when using a soldering iron.Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock.11.5 Solder Volume Solder shall be use

30、d not to be exceeded the upper limits as shown below. Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance.Upper LimitRecommendable1/3T t T(T: Lower flange thickness)T11.6 Prod

31、ucts locationThe following shall be considered when designing and laying out P.C.B.s.(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.Products directionElectrodeThe electorode part of the products should be located like the picture to th

32、e mechanical stress.(Good example)（Poor example）ElectrodeMURATA MFG.CO., LTDtPre-heating150C,1 minTip temperature350C max.Soldering iron output80W max.Tip diameterf 3mm max.Soldering time3(+1,-0)sTimes2 timesStandard ProfileLimit ProfilePre-heating150180C 、90s30sHeatingabove 220C、30s60sabove 230C、60

33、s max.Peak temperature2453C260C,10sCycle of reflow2 times2 times 2602453 22023L30s60s60s max.90s30sReference OnlySpecNo.JELF243A-0069J-01P7/8(2) Products location on P.C.B. separationProducts (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warpin

34、g the board.Because they may be subjected the mechanical stress in order of ACB D.ElectrodeCSeamBDASlitElectrode11.7 Cleaning ConditionsProducts shall be cleaned on the following conditions.(1) Cleaning temperature shall be limited to 60C max.(40C max for IPA.)(2) Ultrasonic cleaning shall comply wi

35、th the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B.Power : 20 W / l max.(3) Cleaner1. Alternative cleaner Isopropyl alcohol (IPA)2. Aqueous agent PINE ALPHA ST-100SFrequency : 28kHz to 40kHzTime : 5 minutes max.(4) There shall be no residual flux and

36、 residual cleaner after cleaning.In the case of using aqueous agent, products shall be dried completely after re with de-ionized water in order to remove the cleaner.(5) Other cleaningPlease contact us.11.8 Resin coatingThe inductance value may change due to high cure-stress of resin to be used for

37、coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, oroperating condition etc. Some resin contasome impurities or chloride possible to generate chlorine byhydrolysis under some operating condition may cause corrosion of wir

38、e of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board.11.9 Caution for use S

39、harp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core11.10 Handling of

40、 a substrateAfter mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, erting and removing a connector from the substrate or tightening screw to the substrate.Excessive mechanical stress may cause crackin

41、g in the product.BendingTwistingMURATA MFG.CO., LTDReference OnlySpecNo.JELF243A-0069J-01P8/811.11 Storage and Handling Requirements(1) Storage periodUse the products within 12 months after delivered. Solderability should be checked if this period is exceeded.(2) Storage conditions Products should be stored in the warehouse on the following conditions. Temperature : -10 40CHumidity: 15 to 85% relative humidity No rapid change on temperature and humidityThe electrode of the