一1backplane背板2Bandgapvoltagereference带隙电压参考3.doc

1、一：1 backplane 背板2 Band gap voltage reference 带隙电压参考3 benchtop supply 工作台电源4 Block Diagram方块图5 Bode Plot 波特图6 Bootstrap 自举7 Bottom FET Bottom FET8 bucket capcitor桶形电容9 chassis 机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 铁芯饱和13 crossover frequency 交叉频率14 current ripple

2、 纹波电流15Cycle by Cycle 逐周期16 cycle skipping周期跳步17Dead Time 死区时间18 DIE Temperature 核心温度19Disable 非使能，无效，禁用，关断20 dominant pole主极点21 Enable 使能，有效，启用22 ESD Rating ESD 额定值23Evaluation Board 评估板24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operat

3、ion outside of the parameters specified in the Electrical Characteristics section is not implied. 超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。25Failling edge 下降沿26 figure of merit 品质因数27 float charge voltage浮充电压28 flyback power stage 反驰式功率级29 forward voltage drop前向压降30 free-running自由运行31Freewheel

4、 diode 续流二极管32 Full load 满负载33 gate drive 栅极驱动34 gate drive stage 栅极驱动级35 gerber plot Gerber 图36 ground plane 接地层37 Henry 电感单位：亨利38 Human Body Model 人体模式39Hysteresis 滞回40 inrush current 涌入电流41Inverting反相42 jittery 抖动43Junction结点44 Kelvin connection 开尔文连接45Lead Frame 引脚框架46 Lead Free 无铅47 level-shift

5、电平移动48 Line regulation 电源调整率49 load regulation负载调整率50 Lot Number批号51Low Dropout低压差52 Miller 密勒53 node 节点54 Non-Inverting非反相55 novel 新颖的56 off state 关断状态57Operating supply voltage 电源工作电压58 out drive stage 输出驱动级59Out of Phase 异相60 Part Number产品型号61 pass transistor pass transistor62 P-channel MOSFET P

6、沟道 MOSFET63Phase margin 相位裕度64 Phase Node 开关节点65 portable electronics便携式电子设备66 power down掉电67 Power Good 电源正常68 Power Groud功率地69 Power Save Mode 节电模式70 Power up 上电71 pull down下拉72 pull up 上拉73Pulse by Pulse 逐脉冲74 push pull converter 推挽转换器75 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二极管78 resisti

7、ve divider 电阻分压器79 ringing 振 铃80 ripple current纹波电流81 rising edge 上升沿82 sense resistor 检测电阻83Sequenced Power Supplys 序列电源84 shoot-through 直通，同时导通85 stray inductances. 杂散电感86 sub-circuit 子电路87 substrate 基板88 Telecom 电信89Thermal Information热性能信息90 thermal slug散热片91Threshold 阈值92 timing resistor 振荡电阻93

8、 Top FET Top FET94 Trace 线路，走线，引线95 Transfer function传递函数96 Trip Point跳变点97 turns ratio 匝数比， Np / Ns 。（初级匝数 /次级匝数）98 Under Voltage Lock Out (UVLO)欠压锁定99 Voltage Reference 电压参考100 voltage-second product 伏秒积101 zero-pole frequency compensation 零极点频率补偿102 beat frequency拍频103 one shots 单击电路104 scaling缩放

9、105 ESR 等效串联电阻106 Ground地电位107 trimmed bandgap 平衡带隙108 dropout voltage压差109 large bulk capacitance 大容量电容110 circuit breaker断路器111 charge pump 电荷泵112 overshoot 过冲二（ 1）元件设备三绕组变压器： three-column transformer ThrClnTrans双绕组变压器： double-column transformer DblClmnTrans电容器： Capacitor并联电容器： shunt capacitor电抗器：

10、 Reactor母线： Busbar输电线： TransmissionLine发电厂： power plant断路器： Breaker刀闸 (隔离开关 )： Isolator分接头： tap电动机： motor（2） 状态参数有功： active power无功： reactive power电流： current容量： capacity电压： voltage档位： tap position有功损耗： reactive loss无功损耗： active loss功率因数： power-factor功率： power功角： power-angle电压等级： voltage grade空载损耗：

11、no-load loss铁损： iron loss铜损： copper loss空载电流： no-load current阻抗： impedance正序阻抗： positive sequence impedance负序阻抗： negative sequence impedance零序阻抗： zero sequence impedance电阻： resistor电抗： reactance电导： conductance电纳： susceptance无功负载： reactive load 或者 QLoad有功负载 : active load PLoad遥测： YC(telemetering)遥信：

12、YX励磁电流 (转子电流 )： magnetizing current定子： stator功角： power-angle上限 :upper limit下限： lower limit并列的： apposable高压 : high voltage低压： low voltage中压： middle voltage电力系统 power system发电机 generator励磁 excitation励磁器 excitor电压 voltage电流 current母线 bus变压器 transformer升压变压器step-up transformer高压侧 high side输电系统 power tra

13、nsmission system输电线 transmission line固定串联电容补偿 fixed series capacitor compensation稳定 stability电压稳定 voltage stability功角稳定 angle stability暂态稳定transient stability电厂 power plant能量输送power transfer交流 AC装机容量 installed capacity电网 power system落点 drop point开关站 switch station双回同杆并架 double-circuit lines on the s

14、ame tower变电站 transformer substation补偿度 degree of compensation高抗 high voltage shunt reactor无功补偿 reactive power compensation故障 fault调节 regulation裕度 magin三相故障 three phase fault故障切除时间 fault clearing time极限切除时间 critical clearing time切机 generator triping高顶值 high limited value强行励磁 reinforced excitation线路补偿

15、器LDC(line drop compensation)机端 generator terminal静态 static (state)动态 dynamic (state)单机无穷大系统 one machine - infinity bus system机端电压控制 *R电抗 reactance电阻 resistance功角 power angle有功（功率） active power无功（功率） reactive power功率因数 power factor无功电流 reactive current下降特性 droop characteristics斜率 slope额定 rating变比 rat

16、io参考值 reference value电压互感器 PT分接头 tap下降率 droop rate仿真分析 simulation analysis传递函数 transfer function框图 block diagram受端 receive-side裕度 margin同步 synchronization失去同步 loss of synchronization阻尼 damping摇摆 swing保护断路器circuit breaker电阻： resistance电抗： reactance阻抗： impedance电导： conductance电纳： susceptance导纳： admitt

17、ance电感： inductance电容 : capacitance三 PCBprinted circuit印制电路printed board 印制板printed wiring board印制线路板printed contact印制接点board 板flexible printed circuit挠性印制电路flush printed board齐平印制板metal base printed board 金属基印制板molded circuit board模塑电路板micro wire board微线印制板surface laminar circuit表面层合电路板chip on board

18、 载芯片板mother board 母板backplane 背板copper-invar-copper board 键盘板夹心板static flex board静态挠性板cable 电缆membrane switch 薄膜开关printed wiring印制线路printed circuit board印制板电路printed component印制元件printed board assembly 印制板装配 rigid printed board 刚性印制板flexible printed wiring 挠性印制线路 metal core printed board 金属芯印制板mulit

19、-wiring printed board多重布线印制板discrete wiring board散线印制板buile-up printed board积层印制板B2it printed board埋入凸块连印制板buried resistance board 埋电阻板daughter board 子板bare board 裸板dynamic flex board动态挠性板break-away planel 可断拼板flexible flat cable (FFC) 挠性扁平电缆 hybrid circuit 混合电路thick film厚膜thick film circuit 厚膜电路thi

20、n film薄膜thin film hybrid circuit薄膜混合电路interconnection互连conductor trace line 导线flush conductor齐平导线transmission line传输线crossover 跨交edge-board contact 板边插头stiffener增强板substrate 基底real estate 基板面conductor side导线面component side元件面solder side 焊接面printing印制grid 网格pattern 图形conductive pattern 导电图形non-conduc

21、tive pattern 非导电图形legend 字符mark 标志base material 基材laminate层压板metal-clad bade material 覆金属箔基材copper-clad laminate (CCL)覆铜箔层压板composite laminate 复合层压板thin laminate 薄层压板basis material基体材料prepreg预浸材料bonding sheet粘结片preimpregnated bonding sheer 预浸粘结片epoxy glass substrate 环氧玻璃基板mass lamination panel 预制内层覆

22、箔板core material内层芯板bonding layer 粘结层film adhesive粘结膜unsupported adhesive film无支撑胶粘剂膜cover layer (cover lay) 覆盖层stiffener material 增强板材copper-clad surface铜箔面foil removal surface 去铜箔面unclad laminate surface 层压板面base film surface 基膜面adhesive faec 胶粘剂面plate finish原始光洁面matt finish 粗面length wise direction

23、 纵向cross wise direction模向cut to size panel剪切板ultra thin laminate 超薄型层压板A-stage resin A 阶树脂B-stage resin B 阶树脂C-stage resin C 阶树脂epoxy resin 环氧树脂phenolic resin酚醛树脂polyester resin聚酯树脂polyimide resin聚酰亚胺树脂bismaleimide-triazine resin双马来酰亚胺三嗪树脂acrylic resin 丙烯酸树脂brominated epoxy resin 溴化环氧树脂melamine form

24、aldehyde resin 三聚氰胺甲醛树脂polymer 聚合物polyfunctional epoxy resin多官能环氧树脂epoxy novolac环氧酚醛fluroresin 氟树脂silicone resin 硅树脂silane 硅烷amorphous polymer无定形聚合物crystalline polamer结晶现象dimorphism 双晶现象copolymer 共聚物synthetic 合成树脂thermosetting resin热固性树脂thermoplastic resin热塑性树脂photosensitive resin感光性树脂epoxy value 环氧

25、值dicyandiamide双氰胺binder 粘结剂adesive 胶粘剂curing agent 固化剂flame retardant阻燃剂opaquer遮光剂plasticizers 增塑剂unsatuiated polyester 不饱和聚酯polyester 聚酯薄膜polyimide film (PI)聚酰亚胺薄膜polytetrafluoetylene (PTFE) 聚四氟乙烯reinforcing material增强材料glass fiber 玻璃纤维E-glass fibre E 玻璃纤维D-glass fibre D 玻璃纤维S-glass fibre S 玻璃纤维gla

26、ss fabric 玻璃布non-woven fabric 非织布glass mats 玻璃纤维垫yarn 纱线filament 单丝strand 绞股warp yarn 经纱warp-wise经向weave structure 织物组织grey fabric坏布bow of weave 弓纬mis-picks缺纬crease 折痕fish eye 鱼眼mark 厚薄段twist of yarn捻度size residue 浸润剂残留量size 浸润剂finished fabric处理织物aromatic polyamide paper 聚芳酰胺纤维纸 height of capillary

27、rise 吸水高度whitenness 白度conductive foil导电箔rolled copper foil压延铜箔thin copper foil薄铜箔resin coated copper foil 涂胶脂铜箔carrier foil载体箔foil profile箔（剖面）轮廓matte side粗糙面stain proofing防锈处理shematic diagram原理图printed wire layout印制线路布设computer aided drawing 计算机辅助制图placement 布局layout 布图设计simulation模拟circit simulati

28、on电路模拟modularization模块化MDF databse机器描述格式数据库design origin设计原点predominant axis供设计优化坐标轴mirroring 镜像intermediate file中间文件queue support database 队列支撑数据库graphics dispaly图形显示scan filling扫描填充region filling填充域logic design逻辑设计hierarchical design层次设计bottom-up design自底向上设计design rule checking 设计规则检查net list 网络表

29、objective function目标函数interactive drawing design 交互式制图设计 engineering drawing 工程图 moze 迷宫weft yarn 纬纱denier 但尼尔thread count 织物经纬密度plain structure平纹组织woven scrim 稀松织物end missing 断经bias 纬斜waviness 云织feather length 毛圈长split 裂缝size content 浸润剂含量finish level处理剂含量couplint agent偶联剂polyarmide fiber聚酰胺纤维break

30、ing length断裂长wet strength retention湿强度保留率ceramics 陶瓷copper foil铜箔annealed copper foil退火铜箔adhesive coated foil 涂胶铜箔composite metallic material复合金属箔invar殷瓦shiny side光面treated side处理面double treated foil双面处理铜箔logic diagram逻辑图master drawing布设总图computer controlled display计算机控制显示routing布线rerouting 重布logic

31、simulation逻辑模拟timing simulation时序模拟layout effeciency布线完成率design database 设计数据库 optimization (design) 优化（设计） table origin 表格原点drive file驱动文件manufacturing documentation 制造文件 component positioning 元件安置 scaling factor 比例因子rectangle filling矩形填充physical design 实体设计logic circuit逻辑电路top-down design 自顶向下设计ne

32、t 线网digitzing数字化router (CAD)走（布）线器subnet 子线网post design processing (PDP) 设计后处理 cost metrix 费用矩阵 block diagram 方块框图component density 元件密度traveling salesman problem回售货员问题四学科名词degrees freedom 自由度 incoming degree 出度 euclidean distance 欧几里德距离 array 阵列logic 逻辑separated time 分线definite sequence 定顺序conducto

33、r width导线（体）宽度conductor layer导线层conductor layer No.1第一导线层square pad 方形盘oblong pad 长方形焊盘teardrop pad 泪滴盘 V-shaped pad V 形盘 non-circular pad 非圆形盘 monfunctional pad 非功能连接盘back-bard land 腹（背）裸盘land pattern 连接盘图形annular ring 孔环mounting hole安装孔unsupported hole 非支撑孔plated through hole (PTH) 镀通孔 blind via (

34、hole) 盲孔buried blind via埋 ,盲孔all drilled hole 全部钻孔 landless hole 无连接盘孔 landless via hole 无连接盘导通孔 terminal clearomee hole 端接全隙孔 via-in-pad 在连接盘中导通孔 hole density 孔密度drill drawing钻孔图datum referan 参考基准out going degree 入度manhatton distance 曼哈顿距离network网络segment 段logic design automation 逻辑设计自动化 separated

35、layer 分层conduction (track)导线（通道）conductor spacing 导线距离conductor line/space 导线宽度 /间距round pad 圆形盘diamond pad 菱形盘bullet pad 子弹形盘snowman pad 雪人盘annular pad 环形盘isolation pad隔离盘offset land偏置连接盘anchoring spaur 盘址land grid array连接盘网格阵列component hole 元件孔supported hole 支撑孔via 导通孔access hole 余隙孔buried via hol

36、e埋孔any layer inner via hole 任意层内部导通 toaling hole 定位孔interstitial hole中间孔pilot hole引导孔dimensioned hole 准尺寸孔hole location孔位hole pattern 孔图assembly drawing 装配图五元件 /电路ircuit吸收电路AC/ACFrequency Converter交交变频电路AC power control交流电力控制AC Power Controller交流调功电路AC Power Electronic Switch 交流电力电子开关Ac V oltage Controller交流调压电路Asynchronous Modulation异步调制Baker Clamping Circuit贝克箝位电路Bi-directional Triode Thyristor双向晶闸管Bipolar Junction Transistor-BJT双极结型晶体管Boost-Buck Chopper升降压斩波电路Boost Chopper