SMT回流焊工艺词汇中英文对照

1、SMT回流焊工艺词汇1. Fundamentals of Solders and Soldering （焊料及焊接基础知识） SolderingTheory （焊接理论）Microstructure and Soldering （显微结构及焊接）Effect of Elemental Constituents on Wetting （焊料成分对润湿的影响） Effect of Impurities on Soldering （杂质对焊接的影响）2. Solder Paste Technology （焊膏工艺）Solder Powder （ 锡粉 ）Solder Paste Rheology （

2、锡膏流变学）Solder Paste Composition & Manufacturing （锡膏成分和制造）3. SMT Problems Occurred Prior to Reflow （回流前 SMT问题） Flux Separation （助焊剂分离 ）Paste Hardening （焊膏硬化）Poor Stencil Life （网板寿命问题 ）Poor Print Thickness （印刷厚度不理想）Poor Paste Release From Squeegee（锡膏脱离刮刀问题） Smear（印锡模糊）Insufficiency （印锡不足）Needle Cloggin

3、g （针孔堵塞）Slump（塌落）Low Tack（低粘性）Short Tack Time （粘性时间短）4. SMT Problems Occurred During Reflow （回流过程中的 SMT问题） Cold Joints （冷焊）Nonwetting （不润湿）Dewetting （反润湿）Leaching （浸析）Intermetallics （金属互化物）Tombstoning （立碑）Skewing （歪斜）Wicking （焊料上吸）Bridging （桥连）Voiding （空洞）Opening （开路）Solder Balling（ 锡球 ）Solder Beadi

4、ng （锡珠）Spattering （飞溅）5. SMT Problems Occurred at Post Reflow Stage （回流后问题）White Residue （白色残留物）Charred Residue （炭化残留物）Poor Probing Contact （探针测接问题）Surface Insulation Resistance or Electrochemical Migration Failure （表面绝缘阻抗或电化迁移缺陷）Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants （分层

5、/ 空洞 / 敷形涂覆或包封的固化问题）6. Challenges at BGA and CSP Assembly and Rework Stage （BGA、CSP组装和翻修的挑战）Starved Solder Joint （少锡焊点）Poor Self-Alignment （自对位问题）Poor Wetting （润湿不良）Voiding （空洞）Bridging （桥连）Uneven Joint Height （焊点高度不均）Open（开路）Popcorn and Delamination （爆米花和分层）Solder Webbing（锡网）Solder Balling （锡球）7. P

6、roblems Occurred at Flip Chip Reflow Attachment （倒装晶片回流期间发生的问题）Misalignment （位置不准）Poor Wetting （润湿不良）Solder Voiding （空洞）Underfill Voiding （底部填充空洞）Bridging （桥连）Open（开路）Underfill Crack （底部填充裂缝）Delamination （分层）Filler Segregation （填充分离）Insufficient Underfilling （底部填充不充分）8. Optimizing Reflow Profile via Defect Mechanisms Analysis （回流曲线优化与缺陷机理分析）Flux Reaction （助焊剂反应）Peak Temperature （峰值温度）Cooling Stage （冷却阶段）Heating Stage （加热阶段）Timing Considerations （时间研究）Optimization of Profile （曲线优化）Com