倒装焊与芯片级封装技术的研究

1、倒裝焊与晶片級封裝技術的研究Why Flip Chip?nBetter manufacturing yield than wirebond for high pin-count chips.對于高密度引腳芯片，成品率优于丝键合。nFaster manufacturing through-put than wirebond for high pin-count chips.對于高密度引腳芯片，生产效率高于丝键合。 nMore reliability than wirebonded chips.可靠性优于丝键合封装芯片。nBetter electrical characteristics (les

2、s inductance) for high-speed chips. A must for RF, optoelectronics, high-speed digital (500MHz).对于高速芯片，具有良好的电学性能。More on Why Flip Chip?nDesirable for high-performance Ball Grid Array (BGA) package.高性能球形焊点阵列封装需要倒装焊。nDesirable for Chip Size Package (CSP).芯片尺寸封装技术需要倒装焊。nThe Flipchip bonded wafer market

3、 is predicted to grow 37% annually while the overall IC units will only grow 8%.倒装焊晶片市场预计年增长37%，而整体IC增长仅8%。nThe Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers.倒装焊晶片预计由三百四十万片(2000年)增长至二千六百二十万片(2005年)。Forecast on IC Unit IC产量预测产量预测(2000-2005)0204060

4、80100120140200020012002200320042005Units (Billion)YearSource: Electronic Trend Publications Inc, 2001Compound Annual Growth Rate: 8.3%DQ Forecast Bare Die Usage(1999-2004)(Units in Million)CAGR (%)1999200020012002200320042000-2004(UNIT) 3,3744,0264,6915,6267,1659,71119.3%Flip Chip1209182326553876553

5、4886837.2%FCIP14420145510011646262567.2%FCOB10651622220028753888624330.9%COB15161542142512251142590-17.5%COF260264244228212110-16.1%TAB17317616314013067-17.5%DCA21722020415814776-19.2%Total 33744026469156267165971119.3%Note: FCIP is Flip Chip in PackageFCOB is Flip Chip on BoardCOB is wire bonded di

6、e directly to substrate such as those used in watches, smart cardsDCA is direct chip attach to substrates via other methods, such as conductive adhesive, microspring (Form Factor); weldingTAB is tab-on-board (not in a package)Total Bare Chip (Die) Source: Dataquest, April 2001Forecast on Bumped Wafe

7、rs Usage凸点晶片使用预测凸点晶片使用预测 (2000-2005)(2000-2005) 26.2 20 14.8 10.4 6.86 3.4No. of Bumped Wafers200520042003200220012000YearSource: Dataquest, April 2001(Units in Million)Technology Leaders are Sold on Flip Chip倒装焊在技术领先企业中的应用nIntel has migrated completely to flip chip bonded BGA for the Pentium 4 prod

8、uct family due to high clock speed and high pin-count (4000).鉴于高速和高引脚(4000)要求，Intel已在奔腾4产品系列中完全采用倒装焊键合的BGA技术。nThe most advanced opto-electronics components from NTT uses flip-chip technology exclusively.来自NTT的最新光电器件也使用了倒装焊技术 。nIBM has used flip-chip 30 years.倒装焊技术已在IBM使用了超过30年Low Risk and Establishe

9、d Infrastructure低风险和建厂基础nWell established industrial infrastructure.良好的建厂工业基础nProduction equipment similar to chip and printer circuit board industries.生产设备与芯片和印刷电路板工业相近nCompatible to Surface Mount Technology (SMT).与表面贴装技术兼容nProduce smaller and lighter electronic module than wirebonded chips.生产的电子模块

10、比丝键合小且轻Flip Chip and Wafer Level PackagingTechnology in HKUST香港科技大學倒裝焊与晶片級封裝技術的研究nElectroplating solder bumping (Mainstream Flip Chip Technology)电镀凸点工艺(主流倒装焊凸点技术)nElectroless UBM and stencil printing bumping (Lower cost Flip Chip Technology w/o photolithography and vacuum processing)化学镀凸点下金属(UBM)和丝网

11、印刷凸点工艺(低成本倒装焊技术 - 不需用光刻和真空制造工艺)nWafer-Level Input/output Redistribution.晶片级输入/输出再发布工艺Commercial Applications商业应用nFor Integrated Circuit Wafer Foundry集成电路晶片制造厂nWafer bumping advanced integrated circuit chips for high-speed, high input/output counts, and for chips going into advanced packages such as Ball Grid Array (BGA) and Chip Size Package (CSP).晶片凸点制备：用于高速高输入/输出端口的先进集成电路芯片，及先进芯片封装技术，如球形焊点阵列和芯片尺寸封装. nRedistribution of perimeter I/O (designed for wirebonding) to array I/O for advanced packagin