KLA缺陷检查培训学习教案

1、会计学1KLA缺陷缺陷(quxin)检查培训检查培训第一页，共25页。21xx Capabilities2第1页/共24页第二页，共25页。3第2页/共24页第三页，共25页。Run Overview4第3页/共24页第四页，共25页。Run one waferInspection Queue5第4页/共24页第五页，共25页。6第5页/共24页第六页，共25页。7第6页/共24页第七页，共25页。8第7页/共24页第八页，共25页。9第8页/共24页第九页，共25页。Stopping the Inspection10第9页/共24页第十页，共25页。Defect Overview To im

2、prove production yields, defects need to be monitored and statistically analyzed at each stage of wafer production.11第10页/共24页第十一页，共25页。Defect Sort1.False : Found nothing after review with inspection data.2.Unkown : Defects were found but there is no suitable defect code to assign.3.Fall on particle

3、 : Particle on surface of patten. 4.In film particle : Particle was contained in film, such as poly, HDP, metal and so on.HDPPoly12第11页/共24页第十二页，共25页。5.Scratch : Especially for scratch caused by robot , other tool parts or man-made. Defect map :Defect iamge:MicroMacro13第12页/共24页第十三页，共25页。6.Discolor

4、: Color difference7.Masking ：Should be etched but still remian(poly,SiN,spacer,metal and so on). Some connect more than two lines,its bridge(killer).14第13页/共24页第十四页，共25页。8.Ring like defect: Such as defects caused by ARC splash, usually related to PHOTO.PolyMetal9.Grape like defect:Induces by PHOTO P

5、U.15第14页/共24页第十五页，共25页。10.Residue ：Always happen after wet station clean.11.Patten abnormal : Roughness,Defocus,Patten shift and so on.RoughnessDefocusPatten shiftPatten Abnormal16第15页/共24页第十六页，共25页。12.Concave: COP（ Crystal oriented pits ）, Oxide Loss，Pits.13.Peeling : Pattern shift or missing（W plu

6、g is one of peeling,always appear at wafer edge.） 17第16页/共24页第十七页，共25页。14.Blind : CT or Via have not been opened.15.Patten damage : Metal damagePoly broken is patten damage too,always happen during High Imp.18第17页/共24页第十八页，共25页。16.W Residue : 1). Caused by Oxide Loss; 2). Caused by CMP.NORMAL ABNORM

7、AL17.Under_Pat ：Under layer pattern fail issue.19第18页/共24页第十九页，共25页。18. Salicide_abnormal:Salicide poor formation.19.Grain : Including poly or metal grain.20第19页/共24页第二十页，共25页。20.Slurry: 21.PR /Polymer_remain :PR has not been stripped completely, typically contains Carbon21第20页/共24页第二十一页，共25页。22.Arcing:23.Line open:22第21页/共24页第二十二页，共25页。24.Corrosion : Caused by etch strip chamber or bad environment. This type defect is 100% killer defect.23第22页/共24页第二十三页，共25页。24第23页/共24页第二十四页，共25页。NoImage内容(nirng)总结会计学。Defect map :。6.Discolor : Color difference。Some connect more than two lines,its bridge