MGW_硬件介绍

1、MGW 硬件介绍2012-11-03网络拓扑图一网络拓扑图二 一、一、MGWMGW基本介绍基本介绍 Softswitch（软交换机或软交换设备） -于1997年由贝尔实验室提出 -相对于传统的“硬”交换机而言，指 实现呼叫控制和语音承载分离后通过 软件实现呼叫控制等多种控制功能的 一种设备 软交换的核心思想是： 一个IP核心承载网 呼叫控制与呼叫承载两分离 Ericsson Mobile Softswitch MSCTraditional MSC(control and switching)MSC-SMSC Server(Control)Mobile Media Gateway (Switch

2、ing)MGW MSC Server功能：功能： 完成呼叫控制、移动性管理、用户业务数据和CAMEL 相关数据的管理（VLR功能）等信令处理功能。MGW功能：功能： 移动媒体网关M-Mgw R6是基于CPP平台开发的，现在基本是采用Product Package GMP V3.0& GMP V4.0的商用性媒体网关，与MSC Server、GMSC Server配合完成核心网络资源的配置，同时完成回声消除、信号的编解码、传真以及通知音的播放等功能，具有强大的媒体应用处理。 信令转接+话务接续 二、硬件详细介绍二、硬件详细介绍 实物图 Product Packages in GMP V3

3、.0Product PackagesNumber of ModulesModulesBC 3050/305111xMGM BC 30012+11xCPM, 1xMGM (MSB configuration 1) +1xOETMBC 30022+11xCPM, 1xMGM (MSB configuration 2) +1xOETMBC 30033+11xCPM, 2xMGM (MSB configuration 1) +1xOETMBC 30043+11xCPM, 2xMGM (MSB configuration 2) +1xOETMBC 30054+11xCPM, 3xMGM (MSB con

4、figuration 2) +1xOETMBC 30245+11xCPM, 4xMGM (MSB configuration 2) +1xOETMBC 302661xCPM, 5xMGM (MSB configuration 2) 框介绍：框介绍：CPM实物图实物图 CPM MGM OETM PCU实物图实物图 PCU CCF实物图实物图 CCF1 CCF2 CCF3 ECF实物图实物图 FAN Air Filter 风扇过滤器过滤进入机框的空气 MACU 提供风扇告警连接口，通过RS-232口连接所有风扇单元，形成一条链，提供RS-485口连接到主框的SCB板。 板的介绍：板的介绍：GPB（

5、通用处理器板通用处理器板）功能）功能 主处理器Main Processor (MP) 完成基本的连接分组平台的功能,，如核心控制功能,操作维护功能，7号信令等功能 提供以太网口和RS-232 连接 内置硬盘 SCB SCB板是主要的交换板，处理不同板子间的数据交换、提供4个ISL（ Inter Subrack Link ）链路接口用于连接扩展子架以及电源接入。 SXB 提供4个ISL（ Inter Subrack Link ）链路接口用于连接扩展子架。 TUB提供稳定的系统时钟用作网络同步。2MHz MSB 完成媒体流处理功能, 如: AMR 编码/解码(speech coder) 电路交换数

6、据(Circuit Switched Data) 回声抑制(echo cancellers) 多方通话(Multi-Party Call) 双音多频信号收发 录音通知(tone sending/receiving) ET-MC41 每块板子有1个光口 ，可打散。提供155Mb/s ATM/TDM模式接口，支持MSP(Multiple Section Protection)。 ET-C41 每块板子有4个光口 ，可打散。提供155Mb/s TDM模式接口，支持MSP（Multiple Section Protection）。 ET-MC1提供8个E1接口提供2Mb/s接口,ATM/TDM模式接口

7、 ET-MFG提供2个千兆以太网口 CCF Opto Board 提供6对光口用以光纤连接 CCF board for Optical Fibre ConnectionsSW Upgrades on hw generations38GMP V2Hw generationsM-MGw R6M-MGw R4M-MGw R5M-MGw R3SW releasesGMP V3GMP V43. Software Upgrades within release(tentative plan)2. No Hardware Upgrades1. Software UpgradesR6.1.0.0R6.0.0.

8、0R6.0.2.0R6.0.4.0R6.1.2.0R6.1.4.0GMP Generic Media Gateway PlatformSoftware Upgrade 39GMP V4 base ConfigurationsOne subrackOne cabinet 40GMP V4 Hardware & Software ViewBC4010Main subrackControl subrackMSE subrackO/E converter (opt)ECFCCF (opt)MAIN Subrack（BC40 x0）MAIN 012345678910111213141516171

9、819202122232425262728SCB-DF2TUBDummyGPB64SXB3SXB3SXB3DummyDummyDummyDummyDummyDummyDummyDummyDummyDummyGPB64GPB64GPB64GPB64GPB64GPB64GPB64GPB64DummyTUBSCB-DF241话务接续处理Core MP standbyCore MP acitve 42 =SMN APN BOARD PRODUCT NR REV = 0 1 SCB-DF ROJ1192334/2 R1D/A 0 2 TUB2 ROJ1192104/4 R3F 0 4 GPB64 ROJ

10、1192106/64 R1D 0 5 SXB3 ROJ1192109/3 R1D 0 6 SXB3 ROJ1192109/3 R1D 0 7 SXB3 ROJ1192109/3 R1D 0 22 GPB64 ROJ1192106/64 R1D 0 23 GPB64 ROJ1192106/64 R1D 0 24 GPB64 ROJ1192106/64 R1D 0 25 GPB64 ROJ1192106/64 R1D 0 27 TUB2 ROJ1192104/4 R3F 0 0 SCB-DF ROJ1192334/2 R1D/A On site photo-Main subrackCTRL Sub

11、rack（BC40 x0）CTRL 112345678910111213141516171819202122232425262728SCB-DF2GPB64CMXBET-IPGGPB64ET-IPGGPB64DummyDummyGPB64GPB64GPB64GPB64GPB64GPB64GPB64GPB64GPB64GPB64GPB64ET-IPGGPB64ET-IPGGPB64ET-IPGCMXBGPB65SCB-DF245CAR MPSIGTRANSIGTRANGCP备用版46=SMN APN BOARD PRODUCT NR REV = 1 1 SCB-DF ROJ1192334/2 R

12、1D/A 1 2 GPB64 ROJ1192106/64 R1D 1 3 CMXB ROJ208504/1 R1C 1 4 ET-IPG ROJ1192345/1 R3A 1 5 GPB64 ROJ1192106/64 R1D 1 6 ET-IPG ROJ1192345/1 R3A 1 20 GPB64 ROJ1192106/64 R1D 1 22 GPB64 ROJ1192106/64 R1D 1 23 ET-IPG ROJ1192345/1 R3A 1 24 GPB64 ROJ1192106/64 R1D 1 25 ET-IPG ROJ1192345/1 R3A 1 26 CMXB ROJ

13、208504/1 R1C 1 27 GPB64 ROJ1192106/64 R1D 1 0 SCB-DF ROJ1192334/2 R1D/A On site photo-Control subrack48Extra FANMSE1 Subrack (BC40 x0)MSE1 2512345678910111213141516171819202122232425262728SCB-DF2GPB64CMXBMSB4MSB4MSB4MSB4MSB4MSB3MSB4ET-C41ET-C41ET-C41ET-C41ET-MF4ET-MF4DummyMSB3SXB3CMXBGPB64SCB-DF249M

14、TP2 TPGreen is Optional50=SMNAPN BOARDPRODUCT NRREV =25 1 SCB-DF ROJ1192334/2 R1D/A 25 2 GPB64 ROJ1192106/64R1D 25 3 CMXBROJ208504/1 R1C 25 4 MSB AMC Cr ROJ1192331/1 R2B 25 5 MSB AMC Cr ROJ1192331/1 R2B 25 6 ET-MC1 ROJ1192163/1 R5F 25 7 ET-MC1 ROJ1192163/1 R5F 25 8 ET-C41 ROJ1192257/2 R1C 25 9 ET-C4

15、1 ROJ1192257/2 R1C 25 10 ET-C41 ROJ1192257/2 R1C 25 11 ET-C41 ROJ1192257/2 R1C 25 12 MSB AMC Cr ROJ1192331/1 R2B 25 13 MSB AMC Cr ROJ1192331/1 R2B 25 14 MSB3ROJ1192201/2 R1C 25 15 MSB AMC Cr ROJ1192331/1 R2B 25 16 MSB AMC Cr ROJ1192331/1 R2B 25 24 MSB3ROJ1192201/2 R1C 25 25 SXB3ROJ1192109/3 R1D 25 2

16、6 CMXBROJ208504/1 R1C 25 27 GPB64 ROJ1192106/64R1D 25 0 SCB-DF ROJ1192334/2 R1D/A On site photo-MSE subrack52Carrier boardAMC boards硬件新增板卡介绍（R6 GMPv4）GPB6 ATM back plane (but studies for GE expected) Variants with 1GB RAM 2 GB RAM (GPB64) 4 GB RAM (GPB65) the versions are chosen in the product packa

17、ge dimensioning based on the memory needed for applications. GPB6 capacity is estimated to be 50% better than GPB5 5455Media Stream board MSB4MSB4: New Media Stream board for user plane processingDual slot board with Advanced Mezzanine Card (AMC)Latest DSP TechnologyHigh capacity: 4000 - 6000 Erlang

18、 per board depending on traffic modelHas both 10G Ethernet and AMAX backplane connectivityEthernet used for payload and signaling inside the boardMSB4 internal transport is Ethernet basedMSB4 provides all speech processing services:Speech codingFramingJitter compensationEcho cancelingTone sendingDTM

19、F tone receiving and sendingConference call (Multiparty call)Announcement (Interactive messaging)Voice Quality EnhancementCan be used in the old nodes with one AMC config.Also handles 3G video callsHas power save mode (in R6.1)MSB4 introduced in M-MGw impacts application, resource layer and O&ME

20、thernetAMAXGMPv4硬件升级56MSB4SP2612SP2603SP2603SP2603SP2603ARM11DSSSC3400DSSSC3400DSSSC3400SP2612SP2612SP2612SP2612SP2612AMC57Media Stream board MSB4AMC is housed inside MSB4, and has multi core DSP structure. Each AMC contains 6 SP2612 chips.Each SP2612 is connected to the carrier board via 2 Gigabit

21、Ethernet ports (12 GE ports per AMC required). One SP2612 chip has 4 SP2603 chips.Each SP2603 (multi core module) has 1 x ARM11 and 3 x DSS cores: Each ARM11 is considered as a root device that handles device control. The DSS (DSP Subsystem, also called StarCore 3400) performs payload processing tas

22、ks. Each GE interface is shared between 2 SP2603s.SP2612 SP2612SP2612 SP2612SP2612 SP2612AMCSP2612SP2603 SP2603SP2603 SP2603SP2603ARM11DSSSC3400DSSSC3400DSSSC3400Common Main Switching Board-CMXBProcessorRAM, Flash2 1Gbit/s Ethernet for Internal Control Path (1 in use)2 HW reset, (1 in use)12 Backpla

23、ne ports, 10Gbit/s Ethernet for User Data8 Front ports, 10Gbit/s Ethernet for User DataCS LEDsPort LEDs58GMPv4硬件升级59CMXBCTRL3348CTRL26348MSE13348MSE126348MAC: 00:13:5E:D2:B6:80Bridge Priority: 0Role: Root BridgeMAC: 00:13:5E:D2:BF:4ABridge Priority: 4096Role: Non-root BridgeMAC: 00:13:5E:D2:D4:8FBri

24、dge Priority: 32768Role: Non-root BridgeMAC: 00:13:5E:D2:D4:8FBridge Priority: 32768Role: Non-root BridgeDDDR-DDDRR-A10 Gigabit10 Gigabit10 Gigabit10 Gigabit10 Gigabit10 GigabitInternalEthernetSwitchingVLANRSTPQoSPhysical LayerGMP V4 Ethernet User PlaneProvides 10G ethernet external connectivityProv

25、ides 10G internal connections between MSB4 and ET-IPG (2 backplane ports for GE backplane connection)Internal connections are separated from external connections with different VLANsPrivate IP addresses are used within internal VLAN. ET-IPGs behave as NAPTResolution of IP address to MAC address mapp

26、ing is done using standard ARPEthernet Subrack Link (ESL) ports are visible for O&M. Backplane ports are visible with COLI commands onlyNote:Connections to boards not supporting Ethernet are established as AMAX connections.Control traffic, ATM XC and AAL2 switching are running on AMAX connections.AMAX user plane is still used in GMP V2/V3.60VLAN ConfigurationNo inter