Flip Chip Process Briefing Introduce

1、Flip Chip Process Briefing IntroduceFCOS PackagePackage Drawing NumberActual TapeSuppliersMFC3.1MFC5.6MFC5.8Contact SideChip SideModule MFC3.1: Module ConstructionPackage Items:Pitch:9.5 mmTyp. Chip Size:2.3 x 3.3 mmDimension: 11 x 8.3 mmThickness: max. 0.50 mmContact-Surface: Ni/Au improvedActivech

2、ip sideICViaISO contacts(Cu/Ni/Au)PETsubstrateHotmeltElectrical chip connection via bumpsChipNCP (Non Conductive Paste)Contact SideChip SideModule MFC5.6: Module ConstructionNCP (Non Conductive Paste)Activechip sideICViaISO contacts(Cu/Ni/Au)PETsubstrateHotmeltElectrical chip connection via bumpsChi

3、pCard bodyPackage Items:Pitch:9.5 mmMax. Chip Size: 3.2 x 4.5 mmDimension: 11 x 8.3 mmThickness: max. 0.50 mmContact-Surface: Ni/Au improvedContact SideChip SideModule MFC5.8: Module ConstructionNCP (Non Conductive Paste)Activechip sideICViaISO contacts(Cu/Ni/Au)PETsubstrateHotmeltElectrical chip co

4、nnection via bumpsChipCard bodyPackage Items:Pitch:14.25 mmMax. Chip Size: 4.20 x 4.60 mm Dimension: 13 x 11.8 mmThickness: max. 0.50 mmContact-Surface: Ni/Au improvedStudbump for FCOS products(at preassembly)chippadchippadbumpMachine Type:l AT Premier Capability: l6 & 8 WaferAttention lower Spe

5、c limitmin. average valuetarget valuemax. average valueUpper Spec limitNail head diameter m707584100105Nail head height m1215192326Bump height m2527313537Shear force gr35 45 ParameterSample sizeFrequency (valid for all parameters)Nail head high10 bumps per wafer 2 wafer per machine und shift.Nail he

6、ad diameter10 bumps per wafer additionally after product change-overBump high10 bumps per wafer additionally by machines downtimes 8 hours.Nail head shear force10 bumps per wafer additionally after every maintenance service.Check the area around the reference die to make sure the wafer map correct.F

7、COS ProcedureReturnWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDeliveryReturnFCOS ProcedureWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDelivery3*Quantum OEE: 68%Model: 8800FCManufacturer：Dataconn (Germany)U

8、PH: 8800 pcsCapacity:10 pcsReturnFCOS ProcedureWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDelivery3*Curing OEE: 68%Model: Smart-card Line 7007Manufacturer：eurotec (Germany)UPH: 8800 pcsWeekly Capacity:10 pcsReturnWafer receivingQuantumCuring& Inlin

9、e TestOptical InspectionElectrical TestingOQAPackingDeliveryFCOS ProcedureReturn3*Electrical Testing OEE: 70%Model: CMT 6550/O + C320MXManufacturer：Muhlbauer (Germany)+SPEA (Italy)UPH: 17270 pcsWeekly Capacity:41pcsWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAP

10、ackingDeliveryFCOS ProcedureReturnWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDeliveryFCOS ProcedureReturnWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDeliveryFCOS ProcedureWB Training Material WB简介简介 wire b

11、ond的目的 用导线将半导体芯片上的电极（第一焊点）与外部引脚（第二焊点） 相连接，完成芯片与封装外引脚间的电流通路。 1st bond 2nd bond wire bond的原理 利用USG，压力，时间，温度四个参数的共同作用，将相互接触的两种 金属发生软化变形,同时两种金属间发生原子扩散形成金属化合物或 合金,保证焊线键合是可靠的电路连接.WB 过程过程leadleadleadFree air ball formationBall BondLoop formationWedge Bond 基本术语基本术语Ball bondFree air ballWedge bond材料材料 劈刀 1.

12、型号选择 目前Assembly只有一种劈刀，型号为：UTS 90-15A-C-1/16 XL 2. 寿命管控 (设备计数)：500K 3. 安装：扭力扳手 金线 1.直径:24um 2.型号选择 目前有两种型号: HD5 & HD3 根据loop parameter上的要求进行选择和确认 贴有芯片的载带 设备设备 设备型号 ESEC3006/ESEC3088 参数设定 1. 参数包括Loop 参数和bonding 参数 2. 设备型号不同，bonding参数设定也不同 3. bonding 参数和Loop 参数的选用根据chip sheet 上的指示 来选择 参数的检查 1.作业员在每

13、次开班时需要检查参数，并将其记录在相应记录表内 2. 检查参数并不仅仅是将数据抄录在记录表上，同时也需要核对参 数规范，如果超过spec范围，需要立刻停机，通知技术员调整。 失效模式失效模式Golf ballRound ball Wire scratch Stitch lifting Sagging wireNeck bond 失效模式失效模式TailingcrateringDie crackPad offset过程控制过程控制 换型时 1. 技术员根据Set-up card和Set-up流程完成Set-up 并在Set-up card上对已完成的项目打勾，并签字。 2. 在一些墨点芯片上打上

14、金线送至SPC，SPC需要测量和检查的项目有: 球高；球径；弧高； 金球推力; 金线拉力；弧形检查. 以上项目通过后SPC记录并签字 3. SPC通过并正常生产100粒后，作业员需要检查以下项目: ISO面失效；塌丝； 金线焊接位置； 金线受破坏； 金球位置超过PAD 30%, 墨点芯片; 金线漏焊；双金线；弧形。 以上项目通过后签字 4. 第二技术员的双重检查 检查项目:球形； Wedge non-stick; Ball non-stick; 弧形， 参数检查，有否断线 以上项目通过后签字 5. 开始正常生产 过程控制过程控制 开班时 1. 参数的检查与记录 2. 球形，弧形，金球位置；断线

15、；pad/lead open；金线刮伤 等项目检查 3. 金线型号确认 Visual inspection 1. 频率 1X/30min 2. 样本数 =12pcs 3. 工具：显微镜 4. 记录检查状况 Wire Bond Process键合工艺详解Wire bond detail informationWire bond detail informationWire bond detail informationWire bond detail informationWire bond detail informationWire bond detail informationWire b

16、ond detail informationWire bond detail informationPerfect Ball ShapeWire bond detail informationAcceptance Ball ShapeWire bond detail informationBad Ball!Wire bond detail informationAction:Increase the air pressure of wire tensionIncrease the EFO parameter to get a bigger free air ballIncrease the w

17、edge force and ultrasonic power to straighten the wire tailChange the capillaryFCOS 工艺流程及常见产品Wafer receivingQuantumCuring& Inline TestVisual InspectionElectrical TestingOQAPackingDeliveryMFC3.1MFC5.6MFC5.8Work Station LayoutFCOSFCOS Datacon Line Zone Area Area Owner: FCOS Working Station Input B

18、uffer Output Buffer TesterFCOS Datacon Line Inspection Area Area Owner: FCOS Working Station Input Buffer Output Buffer TesterFuguai HolderLead tape HangerCurrent ProcessLot Traveler Scissor Pen Marker Pen Module GaugeTFMAir Gun HolderFCOS Datacon Line Working Area Area Owner: FCOS Working Station I

19、nput Buffer Output Buffer TesterTechnician Tool.Equipment Parts. During RepairNew ColletTechnician Tool.Equipment Parts. During RepairTechnician Tool.Equipment Parts. During RepairQuantumEurotecCommunication SheetCommunication SheetFCOS Line Working Station Area Owner: FCOS Working Station Input Buf

20、fer Output Buffer TesterCollet recording FileChip Sheet Pen Marker Pen TweezersEpoxy Holder Ethanol Acetone Cotton StickMasking TapeRed/ WhiteHigh TemperatureTapeTapeProduction recording FilecolletFinger cordOperator / Technician stationaryCleaning RagsSkeleton WaferCassetteNew lot TravelerFCOS Muhl

21、bauer Line Zone Area Area Owner: FCOS Working Station Input Buffer Output Buffer TesterFCOS Muhlbauer Line Inspection Area Area Owner: FCOS Working Station Input Buffer Output Buffer TesterFuguai HolderLead tape Hanger Scissor Pen Marker Pen Module GaugeCurrent ProcessLot TravelerTFMFCOS Muhlbauer L

22、ine Working Area Area Owner: FCOS Working Station Input Buffer Output Buffer TesterTechnician Tool.Equipment Parts. During RepairTechnician Tool.Equipment Parts. During RepairCommunication SheetTraining Material for FCOS FCOS 简介简介 FCOS技术是与传统的用金线健合技术不同的一种新工艺。它先是在芯片正面的焊盘上植金球，然后在把芯片从晶圆上拾起后倒转180度，让植好的金球直接与引线框或叫载带焊接，从而省去了金线健合的步骤。工艺流程如下所示:植球倒装焊接chippadFCOS 简介简介固化在线电性能测试Flip Chip Theory 倒装焊原理Place 贴片贴片Pick 拾取拾取Wafer 晶圆Ejector 顶针Flip 倒置倒置Pick 拾取拾取Collect 吸嘴Gyre Collect 回转吸嘴Tape 载带材料材料 胶水（Glue) 规格型号及在常温下的寿命：1.Nagase T693/UFR302 FC2，