FPC专业词汇中英文对照

1、FPC名词中英对照1 .目的通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化2 .适用范围规范FPCffi关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名词3 .定义无类别一：FP5良项目名词工程类别不良名称中义英 文导线Visual Inspection of Conductors导线Conductors开路Open短路Short缺口Nicks针孔Pinholes额外铜刺Extraneous Copper Between Conductors毛刺Spurs结瘤Nodules蚀刻凹痕Etched Concave导线分

2、层Conductor Delamination裂纹Cracks导线划痕Scratches on Conductor凹坑Dents变色Discoloration基底薄膜VisualInspection of Base Film凹坑Dents划痕Scratches on Base Film覆盖层和覆盖涂层VisualInspection ofCoverlay andCovercoat凹坑Dents on Coverlay and Covercoat划痕Scratches on Coverlay and Covercoat空洞Void偏位Coverlay Misalign毛刺Coverlay Bur

3、rs外来物Foreign Matters导电性异物Conductive Foreign Matters非电性异物Non-conductive Foreign Matters起泡和分层Blistering and Delamination覆盖层粘结剂挤出Squeeze-out of Adhesive of Coverlay覆盖涂层渗出Ooze-out of Covercoat覆盖涂层跳漏Skipping of Convercoat电镀金属或焊锡的 表面条件Surface Condition of Plated Mental and Solder镀金Gold Plating镀金层缺陷Gold Pl

4、ating Defects镀锡Tin Plating电镀金属或焊料的 渗透Penetration of Plated Metal or Solder变暗（变黑）Darkened Appearance (Blackening Discoloration)镀铜孔内镀层空洞Plating Voids in Plated-though Hole镀金粗糙Rough Gold镀金白雾Gold Discoloration镀金变色Gold Discoloration镀金层龟裂Gold Crack镀金针孔Gold Pinhole电镀露铜Plated Expose Wetting剥离Plated Peeled O

5、ff电镀渗入Plated Wicking漏镀No Plating表面伤痕Plating Scratch电镀粗糙Rough Plated药水渗入Wicking外形和孔边缘Visual Inspection of Edges of Outline and Holes撕裂和缺口Tears and Nicks毛刺Burrs丝状毛刺Thready Burrs弯曲、变形Warpage微连筋不良Poor Micro-joint夕、形偏移Outline Misalign外形漏冲No Outline反折偏位Bending Line Misalign增强板Visual Imperfections Related

6、toStiffenerBondingFPC与增强板之间 的外来物Foreign Matter Between Flexible Printed Board and StiffenerFPC与增强板之间 的空洞Voids Between Flexible Printed Board and Stiffener裂纹Cracks缺角Chip-off划痕Scratches义形Deformation表面附着物Affixed Substances on the Surface增强板贴偏移Stiffener Misalign热固胶Thermosetting Adhesive焊剂残渣Flux Residues

7、金属粉末残渣Residue of Metal Powders粘结剂残渣Residue of Adhesive突起Protrusions凹坑Dents弓曲Bow扭曲Twist标记 Marking尺寸检验Dimensional Inspections尺寸测量Measurement of Dimensions外部尺寸External Dimensions厚度Thickness孔Holes元件孔Component Holes导通孔Via Holes导通孔偏移Via Hole Misalign安装孔Mounting Holes导线宽度Conductor Widths导线之间的间距Clearances B

8、etween Conductors孔中心间距Distance Between Hole Centers板边和导线之间的 最小距离Minimum Distance Between Board Edges and Conductors标记错误Wrong Marking字符/、清晰Unclear Letter定位精度Positional Accuracy孔的定位精度Positional Accuracy of Holes孔与焊盘的重合性Registration of Hole to Land覆盖层与焊盘的重 合性Registration of Coverlay (or Covercoat) to L

9、and增强板与FPC的重 合性Registration of Stiffener to FPC孔的重合性Registration of Holes外形的重合性Registration of Outlines冲外形与导线图形 的重合性Registration of Punched Outline to ConductorPatterns压敏胶或热固胶与 FPC和增强板的重 合性Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener镀通孔的镀铜层厚 度Plating Thickness

10、of Copper Panted-through Holes其它Other短装Shortage混装Mixed Stowage/Packing离型纸脱落Released Paper Peeled off材料错误Wrong Material类别二：PFC工程用语工程类别中 文英文板Board Type单面板Single Sided Flex Circuits单面双接触Double Access or Back-bared Flex Circuits双面板Double Sided Flex Circuitsr软硬结合板Rigid-flex Circuits模具Die模具图纸Die Drawingr量

11、产模具Mass Production Die1样品模具Prototype Die钢模Steel Die刀模Die上模Top Die下模Bottom DieP线切割Wire Cut外形模具Outline Cut保护膜模具Coverlay Die胶纸模具Pressure Sensitive Adhesive Die补强模具Stiffener Die银浆模具Silver Die:导柱Post冲头Punch分割刀模Cutting Steel Rule DieP销钉Pin治具Jig( Fixture)贴合治具Lamination Jig电测治具Electrical Check Jig假贴治具Tackin

12、g Jig曝光治具Exposure Jig丝印网框Screen Printing Frame孔Hole:曝光定位孔Guide Hole for Exposure卜真具定位孔Guide Hole for Die假贴定位孔Guide Hole for Tacking贴合定位孔Guide Hole for Adhesiver电测定位孔Guide Hole for Electrical Test丝印定位孔Guide Hole for Screen Printing孔环Lifted Land渗锡孔Stannize Hole装配孔Fitting Hole制程Manufacture Procedure;下料

13、Material Preparation钻孔Drilling镀铜Copper Plating；化学铜leEletcroless Plating Copperf贴干膜Sensitive Dry Film丝印阻焊油墨Liquid Photosensitive SoldermaskExposure显影Developing蚀刻Etching脱膜Stripping贴保护膜Tacking Coverlay粗化Abrade层压Lamination固化（烘烤）Curing黑孔Black Hole表面处理Surface Treatment循环水洗Cascade Rinse微蚀Micro-etch酸洗Acid C

14、leaning水洗Water Cleaning防锈处理Anti-corrosion Treatment前处理Pre-treatment刷板Brushing干燥Dry up电镀（金、锡、 锲）(Gold、Solder、Nickel) Plating闪镀(Gold ) Flash Plating/Strike Plating局部电镀Pattern Plate化学锲金Immersion Gold:有机保焊膜Organic Solderability Preservatives (OSP)丝印字符Printing of Legend:贴补强板Back Board Lamination:电性能测试Ele

15、ctrical Inspection贴胶纸Double Faced Adhesive Tape打孔Punching:雷射切割Laser Cut自动光学检验Automatic Optical Inspection(AOI)表面贴装Surface Mounting Technology(SMTr外形冲切Punching冲孔Punching外观检查Final Inspection;目视检查Visual Inspection (Final Inspection)线路显微镜检 验（镜检）Conductor Microscope Inspection性能测试Reliability Test包装Packin

16、g原材料Material铜箔Copper Foil (CU)H解铜Electro-deposited Copper Foil (ED)压延铜Rolled Annealed Copper Foil (RA)保护膜Coverlay (CVL)基材Base Material尧性覆铜板Flexible Copper Clad Laminate (FCCL)无胶基材Adhesiveless FCCL粘接剂（胶）Adhesives (Ad)；压克力Acrylic顶层补强Top Stiffenerr底层补强Bottom Stiffener顶层银浆膜Top Silver Paste底层银浆膜Bottom Si

17、lver Paste银浆油墨Sliver Inkr顶层线路Top Circuits/Conductors底层线路Bottom Circuits/Conductors"固化片Bonding Film (BOD)r聚酰亚胺Polyimide(PI)聚酯Polyester Film (PET)钢片Sheet Steel玻璃纤维布Woven Glass ClothFR4补强板Fiberboard液态感光油墨Liquid Photoimageable Resist Ink压敏胶Pressure Sensitive Adhesive(PSA:离型膜Release Paper导电胶Conducti

18、ng Resin导电布Electric Fabric包棉Foam导向导电胶Anisotropic Conductive Film(ACF导电泡棉Conductive/Electric Foam:屏蔽膜Shield Film（金属）薄膜开 关Metal Dome (DOME连Connector电容Capacitance ( C )电阻Resistance ( R )集成电路Integrated Circuit(IC)二极管Diode (D)静电Electro-Static Discharge(ESD其它Others：机械方向Machine Direction(MD垂直力向Transverse D

19、irection(TD)进刀Feed进刀量Chip Load转速Speed焊接Soldering手工焊接Hand Soldering:波焊Wave Soldering品质允收标准Acceptable Quality Level( AQL)菲林Film字符Legend烘箱Oven温度Temperature卜显度Humidity速度Speed压力Pressure:喷淋压力Spouting Pressure浓度Concentration原理图纸Schematic Diagram线宽Line Space线距Line Width线路间距Pitch类别三：FPC可靠性测试项目中文-Mr 央文电气性能Testing of Electrical Performance导线电阻Conductor Resistance表面层绝缘电阻Surface Insulation Resistance (SIR)表面介质层耐电压强度Dielectric Withstanding Voltage of Surface Layers机械性能测试Testing of Mechanical Property剥离强度Peel Strength孔和焊垫的拉脱强度Pull-out Stre