外来-GP-004欧盟RoHS的排除条款

1、嗽盟更新RoHS的排除僚款欧盟於2005年10月公布了 2有RoHS指令中，有害物II使用的限制及排除修款，褊虢分悬2005/717/EC& 2005/747/EC在适2：s新的明中，封4&在使用上有一些燮更及要求，例如原本排除修款第7中，封4&之可目做了建勤；更外新增第ii到i5：s,可排除&的管制目等等。根at目前所有公佛之规定，排 除修款整理如下：1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.2. Mercury in straight fluorescent lam

2、ps for general purposes not exceeding:halophosphate 10 mgtriphosphate with normal lifetime 5 mgtriphosphate with long lifetime 8 mg.3. Mercury in straight fluorescent lamps for special purposes.4. Mercury in other lamps not specifically mentioned in this Annex.5. Lead in glass of cathode ray tubes,

3、electronic components and fluorescent tubes.6. Lead as an alloying element in steel containing up to 0.35 % lead by weight, aluminum containing upto 0.4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.7. Lead in high melting temperature type solders (i.e. lead-based alloys

4、 containing 85 % by weight or more lead),lead in solders for servers, storage and storage array systems, network infrastructureequipment for switching, signalling, transmission as well as network management fortelecommunications,lead in electronic ceramic parts (e.g. piezoelectronic devices);8. Cadm

5、ium and its compounds in electrical contacts and cadmium plating except for applicationsbanned under Directive 91/338/EEC (*) amending Directive 76/769/EEC (*) relating to restrictions onthe marketing and use of certain dangerous substances and preparations.9. Hexavalent chromium as an anti-corrosio

6、n of the carbon steel cooling system in absorption refrigerators.9a. Deca BDE in polymeric applications;9b. Lead in lead-bronze bearing shells and bushes10. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for:Deca BDE,mercury in straight fluorescent l

7、amps for special purposes,lead in solders for servers, storage and storage array systems, network infrastructureequipment for switching, signalling, transmission as well as network management fortelecommunications (with a view to setting a specific time limit for this exemption), and light bulbs,as

8、a matter of priority in order to establish as soon as possible whether these items are to be amended accordingly.11. Lead used in compliant pin connector systems.12. Lead as a coating material for the thermal conduction module c-ring.13. Lead and cadmium in optical and filter glass.14. Lead in solde

9、rs consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.有信H WEEE及