SMTManufactureprocess（英文版）

1、Write by MOEBG / SMTManufacture Engineer Yx lan TEL:3417SD card socketSOPBGAQFNConnecterCrystalDSC-Main boardMain component-BGA chipsetDSC- FPC board Optical component-CCDSMT IntroductionAutomatic SMT line : 71 linesLocation : C build - Floor 2 4 2D build - Floor 3 , 4 2E build - Floor 2 , 3 , 4Line

2、 change：30 minsProduction Efficiency：99.5%Through rate : 88 %Defect PPM : 50PPMLost rate : 0.4 %PCBA average output : 400K / monthPCBA Flow ChartPCBPartsPrinterMountReflowSMT : Surface Mount Technology What is SMT : Good Print , and Mount Good !SONY SIP-950SONY SIP-300SONY SVP-2000TypeStencil size (

3、mm)Print directionWipePCB size (mm)PCB Thickness (mm)Print precision (m)SVP-2000650 * 550 * 30Y-dir.Automatic(Wet, Dry &Vacuum)(W)50 * (D)50 (W)250 * (D)3300.31.625SIP-950650 * 550 * 30X-dir.Automatic(Wet, Dry &Vacuum)(W) 50 *(D) 70 (W)460 *(D) 3600.32.512SIP-300650 * 550 * 30Y-dir.Automatic

4、(Wet, Dry &Vacuum)(W) 50 *(D) 50 (W)460 *(D) 5100.43.020SMT EquipmentEquipmentPrinter (SONY)Solder paste vendor (Lead-free type)Photo SuppliersSenjuSenjuTypeM705-GRN360-K2-VL23-BLT5-T7FPowder alloySn 96.5/ Ag 3.0/ Cu 0.5Sn 42/ Ag 1.0/ Bi 57Melt point217138204Powder size25-36m25-36mFlux content10

5、.5-12.5%10.0%Viscosity (pa.s)200200Stencil design ruleTypePrecision (mm)Speed(sec)Component sizeComponent height(mm)Min Pitch(mm)AnglePCB size (mm)PCB height (mm)E-1000/11000.060.17 Chip 0402 - 12m1 6 0.3 0-36050*50 - 460*3600.5 -2.6F-1300.06 0.139 Chip 0201 - 12m1 6 0.3 0-36050*50 - 460*3600.5 -2.6

6、SMT - - Mounter (SONY)SMT實裝設備中高速機(SONY)SMT實裝設備汎用機(SONY)TypePrecision (mm)Speed(sec)Component sizeComponent height(mm)Min Pitch(mm)AnglePCB size (mm)PCB height (mm)E-2000/21000.04 Moved : 0.6Fixed : 1.4Chip 2012 - 32m 250.3 0-36050*50 - 460*3600.5 -2.6F-2090.04 Moved : 0.49 Fixed : 1.4Chip 2012 - 32m

7、 25 0.3 0-36050*50 - 460*3600.5 -2.6SMT - - Mounter (SONY)Mounter functionX-Y DATA CAM350 edit Gerber fileCombination X-Y Data and Gerber file by CPSNozzleType numberAF06021(E&F)AF06042 (E&F)AF10071 (E&F)AF12082 (E&F)AF25200 (E&F)Outside size0.6mm0.6mm1.0mm1.4mm2.5mmInside size0.

8、2mm0.4mm0.7mm1.0mm2.0mmComponent01005,0201 RLC chip0402RLC chip0603 RLC chip0805 RLC chip1208 RLC chipType numberArArticleticle：Lead-Free N2 Reflow Lead-Free N2 Reflow TypeType：NIS-311TR / NIS-2082C / N30-122-RLF NIS-311TR / NIS-2082C / N30-122-RLF CharacteristicCharacteristic： 1.The consistency of

9、N2 is low-reduce1.The consistency of N2 is low-reduce，Using N2 by PSA to control output and Using N2 by PSA to control output and cost cost 2.PPM control system to control the consistency of 2.PPM control system to control the consistency of O2 in 500PPMO2 in 500PPM3.3.Uniform heat convection make B

10、GA and CSP heat completely.Uniform heat convection make BGA and CSP heat completely. 4.More heating zone could offer better temperature profile (8 zones and 12 zones)4.More heating zone could offer better temperature profile (8 zones and 12 zones)SMT - - Reflow (ETC)Method -Reflow profile (example :

11、 Lead free)25150 150217 Over 217 Over 230 below 217 Ramp up : 6/sec (max)Ramp down : 6/sec (max)25150217230Pre-heatSoakingReflowCoolingPeak temp = 235255TempTimeSMT profile Pre-heat zoneThis heating zone cause the uniform-temperature in all part of PCBA, that can reduce PCB warped ,and avoid solder-

12、paste heating disproportion ally to cause splash down to get another failurePre-heat zone temperature setting : ( generally setting, actually constant follow vendors data specification ) Lead-free 25(room temp) 150 : SMT profile Soaking zoneSolder-paste include solder alloy and Flux.Commonly, Flux c

13、ontent include Rosin, Activation, Solvent, and Rchological addition.Flux-heating can cause the content of Flux deoxidize solder to raise the soldering of the joint.Soaking zone temperature setting : (generally setting, actually constant follow vendors data specification Lead-free 150 220 :SMT profil

14、e Reflow zone In the Reflow zone, solder-joint comes into being Interface-alloy, that because most of metal becomes being melting. Peak temperature is in this zone, that is the highest temperature in the profile. Generally, in this zone (230 to peak temp) means solder alloy is in the melting states

15、and different metals are becoming interface-alloy. Sometimes, we can raise the of this zone to reduce void occur ratio. Reflow zone temperature setting : (generally setting, actually constant follow vendors data specification )Lead-free Over 220 Peak temp : 235255 In IPC 610-D, solder-joint must to

16、be bright , shine and smooth . When interface-alloy coagulated, the ramp down ratio (cooling rate) is more fast, that cause alloy atomic bond becomes more tightly, that cause solder surface is more shine and smooth . Cooling zone temperature setting : (generally setting, actually constant follow ven

17、dors data specification ) Lead-free Ramp down ratio : 6 /secSMT profile Cooling zoneProfile limitSolder-Paste Mpt : 217 220Reflow peak temp : 235255 Reflow zone (over 220 ): 6090secTemperature profile boardSix measure point (for actual PCB states)Temp point : critical parts Exp: BGA, IC, SD Connecto

18、rConnect the thermal couple to measure profileProfile measurement (for Data PAQ)Reflow profileAutomatic Optic Inspection (AOI)Separation ratio：12m (frame size 10 X 12mm) Separation ratio ：19m (frame size 15 X 19mm)Separation ratio ：15.5m(frame size 19.3 X 15.5mm)Separation ratio ：15m (frame size 19.

19、3 X 15mm)Scanning speed ：0.22sec/a frame Scanning speed ：0.30sec/a frameScanning speed ：0.23sec/a frameScanning speed ：0.22sec/a frameInspection type：After printing，After ReflowInspection type：After printingInspection type：After ReflowInspection type：After printing，After ReflowCPC-1000CPC-500XCPC-1500Cyclone系列Sampleimageinspectimage1. Adopt 2D AOI inspect technique ；2.Inspection Item：Missing parts/Polarity/Reverse/missing solder/Bridge/Shift /etc;3.Inspect the minimum part ：Angular chips 0201；Automatic InspectionC