敏感元件之温湿度控制

1、索卡科技电子有限公司PROCESS WORK INSTRUCTIONS程序工作指导书DOCUMENT NO.：文 件 编 号SKL-SOP-100EFFECTIVE DATE：生 效 日 期2006/3/10VERSION：版 次A0PAGE：页 次1 OF 8SUBJECT：主 题敏感组件之温湿度控制Moisture Sensitive Device ControlORIGINATOR：起 草 人 <DATE>APPROVED BY：核 准 人 <DATE>DCN版次新版生效日期内容(变更叙述)A0 2006/3/10初版PAGE NO.123456789101112

2、1314151617181920VERSIONA1A1A1A1A1A1A1A1DATE01/0501/0501/0501/0501/0501/0501/0501/05 金舜数码科技有限公司SUBJECT：主题DOC. NO.SKL-SOP-100敏感组件之温湿度控制Moisture Sensitive Device ControlPAGE NO.2 OF 8VERSIONA0DATE2006/3/101.0 目的 Purpose : 为避免敏感组件受潮,影响焊锡品质,而作此规范储存之环境温度,湿度控制. To prevent and reduce the negative impact of

3、moisture related failures in the manufacturing process.2.0 适用范围 Scope : 适用于公司所有温湿度敏感的电子组件. Apply to all Moisture Sensitive Devices used in Liteon.3.0 定义 Definition :IQC,电子仓库,生产线必须依规定储存于适当容器及环境内.All MSD components in IQC, Warehouse, and production lines must be stored in the appropriate storage envir

4、onment.4.0 设备 Equipment : 4.1 大型防潮箱(<20%RH) Large size Dry Storage Cabinet. (<20%RH) 4.2 烤箱(120 ±5, 24hrs). Baking Oven. (120 ±5 for 24hrs) 5.0 储存条件之规定 Condition of Storage : 5.1 未开封材料 Dry Sealed Materials : 各种温湿度敏感组件必须放置于1830以内,相对湿度45±15%RH以内,以确保零件品质. All MSD materials must be

5、kept at 1830 & 45±15%RH environment. 5.2 已开封材料 Unsealed Materials : 5.2.1 IQC检查材料时,开封材料经取出SAMPLE后,应10分钟之内将封 口封住,并安置于温度1830以内,湿度45±15% RH环境以内. After IQC sampling inspection of the materials, the package must be sealed within 10 minutes and be kept at 1830 &45±15% RH environment

6、. 5.2.2 开封后材料若立即放回(且不加封) 1830, 45±15% RH以下之防潮箱, 则立即停止计算暴露时间,而以暴露在45±15% RH以下之时间为暴露时间. If the unsealed materials are kept at 1830 & 45±15% RH environment, should stop the cumulative exposure timing. Cumulative exposure time is recorded only at environment45±15% RH.金舜数码科技有限公司SU

7、BJECT：主题DOC. NO.SKL-SOP-100敏感组件之温湿度控制Moisture Sensitive Device ControlPAGE NO.3 OF8VERSIONA0DATE2006/3/105.2.3 拆封后72小时之内,材料必须在1830以内, 45±15% RH以内使用 Unsealed within 72 hours materials must be mounted between 1830 and 45±15% RH environment. 6.0 以下状况在使用前必须烘烤Baking Requirements : 当组件的FLOOR LIF

8、E(存储寿命)已过，或者是在环境湿度大于60%的情况下暴露必须按照已下表规格烘烤。 Component must be baked when the ambient humidity exposures of >=60%RH or Components floor life has expired, and the baking will complied follow form. 注意：Package Body Thickness:指组件封装厚度 Level：即MSL(湿度敏感等级 一般组件标签上有注明) RH:指相对湿度，例如30摄氏度/85%RH表示在30摄氏度时所含的水分为饱和时

9、所含水分的85% 温湿度敏感组件：指的是组件在规定的温湿度范围之外存储将会其功能曲线和焊接的正常，甚至会损坏组件。6.1 烘烤事件必需记录于烘烤记录表中,如项目10.0 Baking event should be record in “Baking Oven Record” as item 10.0 7.0 烘烤后必须依5.0之储存条件,否则必须依6.0作烘烤作业. After baking, the materials must be stored according to condition 5.0, or else should follow the baking condition

10、stated in 6.0. 8.0 敏感组件之使用管制 MSD Usage Control : 8.1 未开封之材料储存必须填写“组件储存卡(bin card)”如12.0 进行管制. Sealed materials storage must be controlled by Material Storage Control Card金舜数码科技有限公司SUBJECT：主题DOC. NO.SKL-SOP-100敏感组件之温湿度控制Moisture Sensitive Device ControlPAGE NO.4 OF 8VERSIONA0DATE2006/3/10. 8.2 有开封之材料

11、储存必须填写“组件储存使用记录标签”进行管制. Unsealed materials must be controlled by Material Usage Control Record. 8.3 材料拆封后,应立即在“组件储存使用记录标签”上填写“拆封日期”, “拆封时间”及 签名等并将标签贴于敏感组件之外包装上. After the package is unsealed, operator must record the seal-off date, time, quantity, etc on the Material Usage Control Record, and paste

12、it on the package. 8.4 拆封后未上线使用之组件必须入库保存,并在“组件储存使用记录标签”上填写“入库日期”,“入库时间”, “累计暴露时间”及“入库数量”等相关项目. Unsealed materials that have not been used, must be resealed for storage, and record the storage date, time, cumulative exposure time, and quantity etc, on the Material Usage Control Record. 8.5 拆封后上线使用之组件

13、需填写“组件使用暴露时间记录标贴”(9.2),且记录使用 暴露时间并签名, 直至组件使用完,累计暴露时间超过72小时未使用完之组件 依6.0烘烤作业. “组件使用暴露时间记录标贴”贴于IC TRAY盘侧面. Unsealed materials for manufacturing process should fill in the Material Baking & Exposure Control Record (9.2), and record the seal-off time and floor life of the materials until the producti

14、on completes. If the cumulative exposure time of the material exceed 72 hours, should follow the baking procedure stated in 6.0. Material Baking & Exposure Control Record must be pasted on the side of the IC Tray. 8.6 每一真空包装袋拆封后必须贴一张“组件储存使用记录标签”,组件未使用完前不可丢弃或撕毁标签. Material Usage Control Record mu

15、st be recorded and pasted after the package has been unsealed, and it must not be removed before the production completes.金舜数码科技有限公司SUBJECT：主题DOC. NO.SKL-SOP-100敏感组件之温湿度控制Moisture Sensitive Device ControlPAGE NO.5 OF 8VERSIONA0DATE2006/3/109.0 标签 Control Labels 9.1组件储存使用记录标签 Material Usage Control R

16、ecord组件存储使用记录标签 Material Usage Control Record料号:品名规格:管控等级:撤封 日期撤封 时间入库 时间暴露 时间累计暴 露时间入库数量出库数量签名备注 SKL-SOP-100-FORM05-A9.2组件使用暴露时间记录标贴 Material Baking & Exposure Control Record组件使用暴露时间记录标签Material Baking & Eeposure Control Record零件编号烘烤取出/撤封时间Date:Parts No：Baking/Seal-offTime:制造工令有效使用期限Order N

17、o：Use By：(Floor-Life)数量执行人员工程师Quantity：OperatorEngineer管控等级Leve: SKL-SOP-100-FORM03-A 金舜数码科技有限公司SUBJECT：主题DOC. NO.SKL-SOP-100敏感组件之温湿度控制Moisture Sensitive Device ControlPAGE NO.6 OF 8VERSIONA0DATE2006/3/1010.0 烘烤记录表Baking Oven Record. (WI-GME-014) 烘烤记录表 Baking Oven RecordOven no. : Year : Order No.Pa

18、rts No.Temp. InputOperatorOutputRemainQ'tyOperatorDateTimeQ'tyDateTimeQ'ty/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/:/: SKL-SOP-100-FORM01-A部门主管 : 单位主管 : 金舜数码科技有限公司SUBJECT：主题DOC. NO.SKL-SOP-100敏感组件之温湿度控制Moisture Sensitive Device ControlPAGE NO.7 OF8VERSIONA0DATE2006/3/10 11.0 SMT干燥箱温湿度记录表SMT Dry-Box Temperature R Record. 索卡科技有限公司干燥箱温度记录SMT Dry-Box Temperature Record月份：线别：日班(D/S)备注夜班(N/S)备注日期温度（23+-5)T