1硬件电路设计模拟驱动板模电电路器件lp

1、Product FolderTools & SoftwareSample & BuyTechnical DocumentsSupport & CommuLP5907ZHCSD40H APRIL 2012 REVISED NOVEMBER 2014LP5907 用于 RF 和模拟电路的超低噪声、250mA 线性稳压器 - 无需旁路电容1特性输入电压范围：2.2V 至 5.5V 输出电压范围：1.2V 至 4.5V 输出电流：250mA与 1µF 陶瓷输入和输出电容搭配使用，性能稳定无需噪声旁路电容支持远距离安置输出电容热过载保护和短路保护运行结温范围：40

2、76;C 到 125 C低输出电压噪声：< 10µVRMS电源抑制比 (PSRR)：1kHz 频率时为 82dB输出电压容差：±2%几乎零 IQ（禁用时）：< 1µA极低 IQ（使能时）：12µA启动时间：80µs低压降：120mV（典型值）3说明LP5907 是一款能够提供 250mA 输出电流的线性稳压器。 此器件专门RF 和模拟电路而设计，可满足其低噪声、高 PSRR、低静态电流以及低线路或负载瞬态响应系数等诸多要求。 LP5907 采用创新的设计 技术，无需噪声旁路电容便可提供出色的噪声性能，并且支持远距离安置输出电容。此器

3、件设计为与 1µF 输入和 1µF 输出陶瓷电容搭配使用（无需的噪声旁路电容）。其固定输出电压介于 1.20V 和 4.50V 之间（以 25mV为增量）。 如需特定的电压选项，请德州仪器 (TI) 销售代表。器件信息(1)2应用PDA 手持终端无线局域网 (LAN) 设备(1) 要了解所有可用封装，请见数据表末尾的可订购附录。简化电路原理图INPUTOUTPUT1 PFENABLEGNDPRODUCTION DATA information is current as of publication date. Products conform to specificati

4、ons per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.English Data Sheet: SNVS7981 PFINOUTLP5907ENGND器件型号封装封装LP5907DSBGA (4)0.675mm x 0.675mm（最大值）SOT-23 (5)2.90mm x 1.60mm（标称值）X2SON (4)1.00mm x 1.00mm（标称值）LP5907ZHCS

5、D40H APRIL 2012 REVISED NOVEMBER 2014目录123456特性1应用1说明1修订历史2Pin Configuration and Functions3Specifications47.4 Device Functional Modes12Applications and Implementation138.1 Application Information138.2 Typical Application13Power Supply Recommendations16Layout17891010.410.5Layout Guideline

6、s17Layout Examples17X2SON Mounting18DSBGA Mounting18DSBGA Light Sensitivity6.7Absoluteum Ratings4Handling Ratings4Recommended Operating Conditions4Thermal Information5Electrical Characteristics5Output and Input Capacitors6Typical Characteristics711器件和文档支持1911.4文档支持19商

7、标197Detailed Description11静电放告Overview11Functional Block Diagram11Feature Description11术语表1912机械封装和可订购信息194修订历史NOTE: Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision G (October 2013) to Revision HPage已添加 器件信息和处理额定值表，特性描述，器件功能模式，

8、应用和实施，电源相关建议，布局，器件和文档支持，以及机械、封装和可订购信息部分；已将一些曲线移至应用曲线部分。12© 20122014, Texas Instruments IncorporatedLP5907ZHCSD40H APRIL 2012 REVISED NOVEMBER 20145Pin Configuration and FunctionsUltra-Thin DSBGA (YKE) 4 PinsIN A1OUT A2OUT A2IN A1B1 ENB2 GNDB2 GNDB1 ENTOP VIEWBOTTOM VIEWX2SON (DQN)4 Pins Bottom

9、ViewOUT GND1254IN3ENSOT-23 (DBV)5 Pins Top ViewIN15OUT2GNDEN34N/CPin Functions3Copyright © 20122014, Texas Instruments IncorporatedPINI/ODESCRIPTIONSBGAX2SON NUMBERSOT-23 NUMBERNAMBERINA141IInput voltage supply. A 1-F capacitor should be connected at this input.OUTA215ORegulated output voltage.

10、 A minimum 1-F low-ESR capacitor should be connected to this pin. Connect this output to the load circuit. An internal 230- (typical) pull-down resistor prevents a charge remaining on VOUT when the regulator is in the shutdown mode (VEN low).ENB133IEnable input. A low voltage (< VIL) on this pin

11、turns the regulator off and discharges the output pin to GND through an internal 230- pull-down resistor. A high voltage (> VIH) on this pin enables the regulator output. This pin has an internal 1M- pull-down resistor to hold the regulator off by default.GNDB222Common groundN/CN/AN/A4No internal

12、 electrical connection.Thermal PadN/A5N/AThermal pad for X2SON package, connect to GND or leave floating. Do not connect to any potential other than GND.LP5907ZHCSD40H APRIL 2012 REVISED NOVEMBER 20146 Specifications6.1 Absoluteum Ratingsover operating free-air temperature range (unless otherwise no

13、ted) (1)(2)(3)(1)Stresses beyond those listed under Absoluteum Ratinay cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to

14、absolute-um-rated conditions for extended periods may affect device reliability.(2)If Military or Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.All voltages are with respect to the GND pin.Internal therma

15、l shutdown circuitry protects the device from permanent damage.(3)(4)6.2 Handling Ratings(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control

16、 process.6.3 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted) (1)(2)(1)Stresses beyond those listed under Absoluteum Ratinay cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any ot

17、her conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute- All voltages are with respect to the GND pin.um-rated conditions for extended periods may affect device reliability.(2)(3)In applications where high power dissipation and/or poor package

18、 thermalis present, theum ambient temperature mayhave to be derated.= 125°C), theum ambient temperature (TA-MAX) is dependent on theum operating junction temperature (TJ-MAX-OPum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermalof thepart/package i

19、n the application (RJA), as given by the following equation: TA-MAX = TJ-MAX-OP (RJA × PD-MAX). See Application Information.4Copyright © 20122014, Texas Instruments IncorporatedMINMAXUNITVINInput supply voltage2.25.5VVENEnable input voltage0 to (V N + 0.3)5.5IOUTOutput current0250mATJJunct

20、ion temperature40125°CTAAmbient temperature (3)4085MINMAXUNITTstgStorage temperature range65150°CV(ESD)Electrostatic dischargeHuman body m(HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)20002000VCharged device m(CDM), per JEDEC specification JESD22-C101, all pins(2)10001000MINMAXUNITVINInput

21、 voltage0.36VVOUTOutput voltage0.3 to (VIN + 0.3 V)6VENEnable input voltage0.3to (VIN + 0.3 V)6Continuous power dissipation(4)Internally LimitedWTJMAXJunction temperature150°CLP5907ZHCSD40H APRIL 2012 REVISED NOVEMBER 20146.4 Thermal Information(1) For more information about traditional and new

22、 thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.6.5 Electrical CharacteristicsVIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA, C N = 1 µF, COUT = 1 µF, unless otherwise stated.(1)(2)(3)PARAMETERTEST CONDITIONSMINTYPMAXUNITVINInput voltageTA = 25°C2.25.

23、5VVIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA to 250 mA, VOUT 1.8 V22Output voltage tolerance%VOUTVIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA to 250 mA, VOUT < 1.8 V33VOUTVIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mALine regulation0.02%/VLoad regulationIOUT = 1 mA to 250 mA0.001%/mASee(4)Load

24、 current0250mAILOADum output current250VEN = 1.2 V, IOUT = 0 mA1225uiescent current(5)IVEN = 1.2 V, IOUT = 250 mA250425µAVEN = 0.3 V (Disabled)0.21Ground current (6)IGVEN = 1.2 V, IOUT = 0 mA14µAIOUT = 100 mA50mVDropout voltage(7)VDOIOUT = 250 mA (DSBGA)120200IOUT = 250 mA (SOT-23, X2SON p

25、ackages)250TA = 25°C(8)ISCShort circuit current limit250500mAf = 100 Hz, IOUT = 20 mA90f = 1 kHz, IOUT = 20 mA82Power supply rejection ratio (9)PSRRdBf = 10 kHz, IOUT = 20 mA65f = 100 kHz, IOUT = 20 mA60(1)(2)All voltages are with respect to the device GND terminal, unless otherwise stated.Mini

26、mum andum limits are ensured through test, design, or statistical correlation over the junction temperature (TJ) range of40°C to 125°C, unless otherwise stated. Typical values represent the most l kely parametric norm at TA = 25°C, and are provided forreference purposes only.In applic

27、ations where high power dissipation and/or poor package thermal have to be derated.(3)is present, theum ambient temperature mayum ambient temperature (TA-MAX) is dependent on theum operating junction temperature (TJ-MAX-OP =125°C), theum power dissipation of the device in the application (PD-MA

28、X), and the junction-to ambient thermalof thepart/package in the application RJA), as given by the following equation: TA-MAX = TJ-MAX-OP (RJA × PD-MAX). See Applications andImplementation.The device maintains a stable, regulated output voltage without a load current.Quiescent current is define

29、d here as the difference in current between the input voltage source and the load at VOUT. Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.Dropout voltage is the voltage difference between the input and the output at which

30、 the output voltage drops to 100 mV below its nominal value.Short-circuit current (ISC) for the LP5907 is equivalent to current limit. To minimize thermal effects during testing, ISC is measured with VOUT pulled to 100 mV below its nominal voltage.This specification is verified by design.(4)(5)(6)(7

31、)(8)(9)5Copyright © 20122014, Texas Instruments IncorporatedTHERMAL METRIC(1)LP5907UNITSOT-23 (DBV)X2SON (DQN)DSBGA (YKE)5 PINS4 PINS4 PINSRJAJunction-to-ambient thermal193.4216.1206.1°C/WRJC(top)Junction-to-case (top) thermal102.1161.71.5RJBJunction-to-board thermal45.8162.137.0JTJunction

32、-to-top characterization parameterJBJunction-to-board characterization parameter45.3161.736.8RJC(bot)Junction-to-case (bottom) thermaln/a123.0n/aLP5907ZHCSD40H APRIL 2012 REVISED NOVEMBER 2014Electrical Characteristics (continued)VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA, C N = 1

33、81;F, COUT = 1 µF, unless otherwise stated.(1)(2)(3)(10) There is a 1-M resistor between EN and ground on the device.6.6 Output and Input Capacitorsover operating free-air temperature range (unless otherwise noted)(1)The minimum capacitance should be greater than 0.5 F over the full range of op

34、erating conditions. The capacitor tolerance should be 30% or better over the full temperature range. The full range of operating conditions for the capacitor in the application should be considered during device selection to ensure this minimum capacitance specification is met. X7R capacitors are re

35、commended however capacitor types X5R, Y5V and Z5U may be used with consideration of the application and conditions.This specification is verified by design.(2)6Copyright © 20122014, Texas Instruments IncorporatedPARAMETERTEST CONDITIONSMIN(1)TYPMAXUNITC NInput capacitance (2)Capacitance for st

36、ability0.71µFCOUTOutput capacitance (2)0.7110ESROutput/Input capacitance (2)5500mPARAMETERTEST CONDITIONSMINTYPMAXUNITeNOutput noise voltage (9)BW = 10 Hz to 100 kHzIOUT = 1 mA10µVRMSIOUT = 250 mA6.5RADOutput Automatic Discharge pull-downVEN < VIL (output disabled)230TSDThermal shutdown

37、TJ rising160°CThermal hysteresisTJ falling from shutdown15LOGIC INPUT THRESHOLDSVILLow input thresholdVIN = 2.2 V to 5.5 VVEN falling until the output is disabled0.4VVIHHigh input thresholdVIN = 2.2 V to 5.5 VVEN rising until the output is enabled1.2VIENInput current at EN pin (10)VEN = 5.5 V a

38、nd VIN = 5.5 V5.5µAVEN = 0 V and V N = 5.5 V0.001TRANSIENT CHARACTERISTICSVOUTLine transient (9)VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 µs1mVVIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1.6 V) in 30 µs1Load transient(9)IOUT = 1 mA to 250 mA in 10 µs40mVIOUT = 250 mA to

39、1mA in 10 µs40Overshoot on start-up (9)Stated as a percentage of VOUT(NOM)5%tONTurnon timeFrom VEN > VIH to VOUT = 95% of VOUT(NOM) TA = 25°C80150µsLP5907ZHCSD40H APRIL 2012 REVISED NOVEMBER 20146.7 Typical CharacteristicsUnless otherwise stated: VIN = 3.7 V, VOUT = 2.8 V, IOUT = 1

40、 mA, CIN = 1 µF, COUT = 1 µF, TA = 25°C161140.912100.8860.740.6 3.3 3.8 4.3 4.8 5.3 5.822 533.544.5VIN (V)55.56D001VIN(V)SVA-30180569Figure 2. VEN Thresholds vs VINFigure 1. Quiescent Current vs Input Voltage1.454.543.532.521.510.500.40.2000.511.522.5D0020123VIN (

41、V)456D003VIN (V)VOUT = 1.2VVEN = VINVOUT = 4.5VVEN = VINFigure 3. VOUT vs VINFigure 4. VOUT vs VIN3502.900VIN= 3.6V2.8753002.8502502.8252002.8001502.7751002.750VIN = 3.0V VIN = 3.8V-40°C 90°C25°C 502.725VIN = 4.2V VIN = 5.5V02.700050100 150 200 250 300IOUT(mA)SVA-301805710501001502002

42、50LOAD (mA)SVA-30180567Figure 6. Load RegulationFigure 5. Ground Current vs Output Current7Copyright © 20122014, Texas Instruments IncorporatedVOUT (V)IQ( A)GROUND CURRENT ( A)VOUT (V)VEN (V)VOUT(V)RLOAD = 4.5 k: RLOAD = 18 :RLOAD = 1.2 k: RLOAD = 4.8 :VIH Rising VIL FallingLP5907ZHCSD40H APRIL

43、 2012 REVISED NOVEMBER 2014Typical Characteristics (continued)Unless otherwise stated: VIN = 3.7 V, VOUT = 2.8 V, IOUT = 1 mA, CIN = 1 µF, COUT = 1 µF, TA = 25°C8Copyright © 20122014, Texas Instruments IncorporatedVOUT(V)2.9002.8752.8502.8252.8002.7752.7502.725 2.7003.03 54.04.55

44、.05.5VIN(V)SVA-30180568Figure 7. Line Regulation2V/DIVVOUT2V/DIVVIN = VENIIN1A/DIV2 ms/DIVSVA-30180509Figure 8. Inrush CurrentVOUT(AC Coupled)VIN10 mV/ DIV1V/DIVVOUT10 mV/(AC Coupled)DIVVIN1V/DIV10 s/DIVSVA-30180511VIN = 3.2 V 4.2 VLoad = 250 mAFigure 10. Line Transient10 s/DIVSVA-30180510VIN = 3.2

45、V 4.2 VLoad = 1 mAFigure 9. Line TransientVOUT100 mV/DIVLOAD200 mA/DIV100 s/DIVSVA-30180512Load = 0 mA 250 mA-40°CFigure 11. Load TransientVOUT100 mV/DIVLOAD200 mA/DIV100 s/DIVSVA-30180513Load = 0 mA 250 mA90°CFigure 12. Load TransientLoad = 10 mA-40°C 90°C25°CLP5907ZHCSD40H

46、 APRIL 2012 REVISED NOVEMBER 2014Typical Characteristics (continued)Unless otherwise stated: VIN = 3.7 V, VOUT = 2.8 V, IOUT = 1 mA, CIN = 1 µF, COUT = 1 µF, TA = 25°C1V/DIVVOUT100 mV/DIVVOUT1V/DIVLOAD200 mA/DIVEN100 s/DIV20 s/DIVSVA-30180515SVA-301805140 mALoad = 0 mA 250 mA25°C

47、Figure 14. Start-UpFigure 13. Load Transient1V/DIVVOUT1V/DIVEN20 s/DIVSVA-30180516250 mAFigure 15. Start-UpFigure 16. Noise Density Test1400120-20100-4080-606040-8020-1000-1200501001502002500.1110100D004LOAD CURRENT (mA)FREQUENCY (kHz)SVA-30180573Figure 18. PSRR Loads Averaged 100 Hz To 100 KHzFigur

48、e 17. Dropout Voltage vs Load Current9Copyright © 20122014, Texas Instruments IncorporatedDROPOUT VOLTAGE (mV)PSRR (dB)250 mA200 mA150 mA100 mA50 mA20 mADropout VoltageLP5907ZHCSD40H APRIL 2012 REVISED NOVEMBER 2014Typical Characteristics (continued)Unless otherwise stated: VIN = 3.7 V, VOUT =

49、2.8 V, IOUT = 1 mA, CIN = 1 µF, COUT = 1 µF, TA = 25°C10Copyright © 20122014, Texas Instruments IncorporatedPSRR (dB)0-20-40-60-80-100-1200.010.1110100100010000FREQUENCY (kHz)D005Figure 19. PSRR Loads Averaged 10 Hz To 10 MHz250 mA200 mA150 mA100 mA50 mA20 mALP5907ZHCSD40H APRIL 2012 REVISED NOVEMBER 20147Detailed Description7.1 OverviewDesigned to meet the needs of sensitive RF and analog circuits, the LP5907 provides low noise, high PSRR, low quiescent current, as well as low line and load tr