设备校正培训

1、SMT設備製造廠設備製造廠G200與F130差異SMT設備製造廠設備製造廠目錄 G200新特點介紹 G200與F130設備規格差異 G200與F130機械結構差異 G200與F130電氣控制差異 G200與F130應用軟體差異 G200與F130可以互換之部品SMT設備製造廠設備製造廠G200新特點介紹 SI-G200的貼裝速度高達0.08秒不僅傳承了貼裝精度高省空間設計電力消耗低之細胞式貼片機的新特點。維護間隔時間比以往機器延長約兩倍。單位面積生產率居同行業首位,雙頭交替運動貼裝可前后操作機器。SMT設備製造廠設備製造廠SI-F 系列系列F130 6F209 29.6mG 系列系列4.8mG

2、200(A+A)x3 +G200(B+B)其他公司产品其他公司产品CM402 x2+ CM402(Multi)生产线的生产能力生产线的生产能力 170,000CPH成本成本 100%生产线的生产能力生产线的生产能力 155,000CPH (91% of SI-F)成本为成本为 SI-F 110%生产线的生产能力生产线的生产能力 163,000CPH (96% of SI-F)成本为成本为SI-F 85%7.5m贴片机贴片机 F系列系列 其他公司产品其他公司产品 G系列系列CPH/成本成本 170,000 140,000 191,000CPH/m2 11,805 8,17521,447与现行机种

3、的比较与现行机种的比较SMT設備製造廠設備製造廠2250重量: 2200公斤 SI-G200 的尺寸的尺寸宽度和高度与F系列相同深度比F系列增加了160mmSMT設備製造廠設備製造廠 贴装速度贴装速度 45,000CPH与SI-F130相比，速度增快了1.7倍 灵活性 可以将高速贴片头和多功能贴片头进行自由组合 (AxA, AxB, BxB) 精度 高速贴片头: +/-45mm (3 sigma) 多功能贴片头: +/-40mm (3 sigma)SI-G200 的特征的特征SMT設備製造廠設備製造廠SI-G200 规格规格料架配备数料架配备数对象电路板尺对象电路板尺寸寸电源电源/消费电力消费

4、电力空气压空气压/空气消费量空气消费量主体尺寸主体尺寸重量重量高速贴片头高速贴片头多功能贴片头多功能贴片头前侧40个 + 后侧40个 (共80 个) *前侧40 个 + 后侧40个或 17 料架 + 15 x 2托盘 (*)贴片头配置贴片头配置24 吸嘴/2 贴片头(12 吸嘴/1贴片头)16 吸嘴/2 贴片头 (8 吸嘴/1 贴片头)吸嘴交换吸嘴交换-24种的吸嘴顺次交换对象零件尺寸对象零件尺寸0402 12 mm2 (移动摄像机)A 6 25 mm2 (固定摄像机)零件高度: 6 mm1005 100 x 50 mm零件高度: 13 mm贴装速度贴装速度（最佳条件）（最佳条件）0.08秒/

5、2 贴片头/移动摄像机 ( 45,000 CPH )0.16秒/2 贴片头 (22,500 CPH)装着精度装着精度0.045 (3) mm0.040 (3) mmSI-G20050 x 50 460 x 410 mm (但长度超过330 mm的电路板无段式机能)电路板厚度: 0.5 3.0 mm0.49 to 0.5Mpa, 约 10 L/min. (约 50N L/min.)1,220(W) x 1,850(D) x 1,575(H) mm(无托盘转换器)2,200 kgAC 3相 200V10%, 50/60Hz, 4.0 KVASMT設備製造廠設備製造廠高速贴片头高速贴片头 （A 型贴

6、片头型贴片头）多功能贴片头多功能贴片头（B型贴片头型贴片头)贴片头贴片头功能功能12个吸嘴个吸嘴单位贴装时间：单位贴装时间：0.16秒秒040225x25, 零件高度零件高度=6与与 F130AI贴片头相同贴片头相同8个吸嘴个吸嘴单位贴装时间单位贴装时间：0.32秒秒1005100 x50, 零件高度零件高度 ATX MOTHER BOARD 1CPU（ （1HEAD/1CPU） ）SYMC - SYMC2（SI-F130AI & SI-G200）Old type cannot be used.SERIAL DIO MASTER ISA 512pointPCI 1024point(2

7、point) Old type cannot be used. Control function addition between PC with RAS board(RAS BOARD 2)shut down control port(COM2)-USB Serial conversion port(COM7)MEMORINK BOARD deletion , RAID Function deletionHDD & FILTER / No need remove PC UNIT for exchange. However,if need exchange only HDD, it i

8、s necessary to change the UPS setting with control panel.Communicates between PC / use LANCPU Pentium4 2.4GHz-2.8GHzMEMORY 512MB(W-CPU)-1GBISA BUS,PICMG is abolition,PCI BUSx5Use AGP GRAPHIC CARD (before use CPU board internal organs VRAM)OS / Windows2000 + Vx Works + KUKA Vx WinSMT設備製造廠設備製造廠PC UNIT

9、 layoutTemperature sensorSMT設備製造廠設備製造廠PC UNIT layoutSMT設備製造廠設備製造廠Change point from SI-F130(2)POWER UNIT The magnet is changed to 30A correspondence. POWER ON/OFF CONTROL BOARD 3 Relay was changed. PC BATTERY separates to another unit (to BATTERY UNIT). DC24V POWERJWS series-HWS series DC12V POWER (f

10、or monitor)30W(for 1 monitor-100W(for 2 monitor) ZWS series -HWS seriesDRIVER UNIT DC24V POWERJWS series - HWS series DC5V,12V POWERLWT50 - SWT65Capacity change DC3.3V POWER Addition(for SY-EX2) DC48V POWERZWS150PF - ZWS240PAF(capacity change & for environment measures) PUSHER/BULK BOARD 2Improv

11、ement (from SI-F130AI Bulk function deletion) Contactpoint output addition (contact point for welding detection )(DV-19)(有效防止24V短路燒壞PUSHER/BULK BOARD 2)SMT設備製造廠設備製造廠POWER UNIT layoutSMT設備製造廠設備製造廠DRIVER UNIT layoutSMT設備製造廠設備製造廠Change point from SI-F130(3)SERVOI/F UINT SY-EX+SY-IF2 SY-EX2 (SI-F130AI a

12、lso) AMP bus MP bus(GPIB I/F IC)Improvement of communication reliabilitySERVO UNIT Sheet metal change depends on change number of axis. FRONT 6 axis,REAR 6 axis(SERVO PACK TYPE same as SI-F130) Array of SERVO PACK / Y-X-H-F-RT-RN(Axis Num.2-1-3-4-6-7) SERVO PACK exchange / Possible to detach by two

13、axis. Resurrection resistance is set up in the unit. EX2 ENCODER UNIT(New) Two EX2 ENCODER BOARD Installed.BATTERY UNIT(New) Backup for FRONT & REAR PC. Two BATTERY Installed. Easy to exchange.SMT設備製造廠設備製造廠SERVO I/F UNIT layoutSMT設備製造廠設備製造廠SERVO UNIT layoutSMT設備製造廠設備製造廠EX2 ENCODER UNIT & BAT

14、TERY UNIT layoutSMT設備製造廠設備製造廠Change point from SI-F130(4)IO UNIT1 CONVEYOR CONTROL BOARD 4-A / Relay changed(SI-F130AI also) SAFETY RELAY BOARD / New(CE Agreement measures)IO UNIT2 (for front) EMG BOARD 3-B A part is changed to the relay socket. Relay breakdown measures version(SI-F130AI also)LED CO

15、NTROL BOARD 4 memory data increase, Hangup measures by heat(SI-F130AI also)IO UNIT3 (for rear) Same as IO UNIT2The I/O unit was divided into 3part. SMT設備製造廠設備製造廠I/O UNIT13 layoutI/O UNIT 1(UPPER)I/O UNIT 2(MIDDLE)I/O UNIT 3(LOWER)SMT設備製造廠設備製造廠Change point from SI-F130(5)Other special notes main brea

16、ker 15A -30A transformer also changes. (NOISE FILTER is no change) A HEAD-B HEAD Exchange is possible only by the wiring change of the head. One-touch exchange is technically impossible now. TRAY CHANGER is designing now. Possible to change to four head specification.However, the data download is separate. (No correspondence schedule) MONITOR Change toTouch panel built-in type. (Product different from SI-F130) Addition two SIGNAL LIGHT For Parts-out warningSMT設備製造廠設備製造廠G200與F130電氣控制差異 雙主機分別控制前后貼裝SMT設備製造廠設備製造廠SMT設備製造廠設備