数字集成电路透视原英文课件chapter

1、EE141 Digital Integrated Circuits2ndIntroduction1Jan M. RabaeyAnantha ChandrakasanBorivoje NikolicJuly 30, 2002EE141 Digital Integrated Circuits2ndIntroduction2qIntroduction to digital integrated circuits.qCMOS devices and manufacturing technology. CMOS inverters and gates. Propagation delay, noise

2、margins, and power dissipation. Sequential circuits. Arithmetic, interconnect, and memories. Programmable logic arrays. Design methodologies.qWhat will you learn?qUnderstanding, designing, and optimizing digital circuits with respect to different quality metrics: cost, speed, power dissipation, and

3、reliabilityEE141 Digital Integrated Circuits2ndIntroduction3qIntroduction: Issues in digital designqThe CMOS inverterqCombinational logic structuresqSequential logic gatesqDesign methodologiesqInterconnect: R, L and CqTimingqArithmetic building blocksqMemories and array structuresEE141 Digital Integ

4、rated Circuits2ndIntroduction4qWhy is designing digital ICs different today than it was before?qWill it change in future?EE141 Digital Integrated Circuits2ndIntroduction5The BabbageDifference Engine(1832)25,000 partscost: 17,470EE141 Digital Integrated Circuits2ndIntroduction6EE141 Digital Integrate

5、d Circuits2ndIntroduction7First transistorBell Labs, 1948EE141 Digital Integrated Circuits2ndIntroduction8Bipolar logic1960sECL 3-input GateMotorola 1966EE141 Digital Integrated Circuits2ndIntroduction919711000 transistors1 MHz operationEE141 Digital Integrated Circuits2ndIntroduction10EE141 Digital

6、 Integrated Circuits2ndIntroduction11lIn 1965, Gordon Moore noted that the number of transistors on a chip doubled every 18 to 24 months. lHe made a prediction that semiconductor technology will double its effectiveness every 18 monthsEE141 Digital Integrated Circuits2ndIntroduction12161514131211109

7、87654321019591960196119621963196419651966196719681969197019711972197319741975LOG2 OF THE NUMBER OFCOMPONENTS PER INTEGRATED FUNCTIONElectronics, April 19, 1965.EE141 Digital Integrated Circuits2ndIntroduction13EE141 Digital Integrated Circuits2ndIntroduction141,000,000100,00010,0001,0001010011975198

8、01985 19901995 20002005 2010808680286i386i486PentiumPentium ProKPentium IIPentium IIICourtesy, IntelEE141 Digital Integrated Circuits2ndIntroduction1540048008808080858086286386486Pentium procP60.0010.010.1110100100019701980199020002010YearTransistors (MT)2X growth in 1.96 years!Transistors on Lead M

9、icroprocessors double every 2 yearsCourtesy, IntelEE141 Digital Integrated Circuits2ndIntroduction1640048008808080858086286386486Pentium procP611010019701980199020002010YearDie size (mm)7% growth per year2X growth in 10 yearsDie size grows by 14% to satisfy Moores LawCourtesy, IntelEE141 Digital Int

10、egrated Circuits2ndIntroduction17P6Pentium proc486386286808680858080800840040.111010010001000019701980199020002010YearFrequency (Mhz)Lead Microprocessors frequency doubles every 2 yearsDoubles every2 yearsCourtesy, IntelEE141 Digital Integrated Circuits2ndIntroduction18P6Pentium proc4863862868086808

11、58080800840040.1110100197119741978198519922000YearPower (Watts)Lead Microprocessors power continues to increaseCourtesy, IntelEE141 Digital Integrated Circuits2ndIntroduction195KW 18KW 1.5KW 500W 40048008808080858086286386486Pentium proc0.1110100100010000100000197119741978 198519922000 20042008YearP

12、ower (Watts)Power delivery and dissipation will be prohibitiveCourtesy, IntelEE141 Digital Integrated Circuits2ndIntroduction2040048008808080858086286386486Pentium procP611010010001000019701980199020002010YearPower Density (W/cm2)Hot PlateNuclearReactorRocketNozzlePower density too high to keep junc

13、tions at low tempCourtesy, IntelEE141 Digital Integrated Circuits2ndIntroduction21Digital Cellular Market(Phones Shipped)1996 1997 1998 1999 2000Units 48M 86M 162M 260M 435MAnalog BasebandDigital Baseband(DSP + MCU)PowerManagementSmall Signal RFPowerRFCellPhoneEE141 Digital Integrated Circuits2ndInt

14、roduction22 “Microscopic Problems” Ultra-high speed design Interconnect Noise, Crosstalk Reliability, Manufacturability Power Dissipation Clock distribution.Everything Looks a Little Different “Macroscopic Issues” Time-to-Market Millions of Gates High-Level Abstractions Reuse & IP: Portability Predi

15、ctability etc.and Theres a Lot of Them! DSM DSM 1/DSM 1/DSM?EE141 Digital Integrated Circuits2ndIntroduction231101001,00010,000100,0001,000,00010,000,000200319811983198519871989199119931995199719992001200520072009101001,00010,000100,0001,000,00010,000,000100,000,000Logic Tr./ChipTr./Staff Month.xxxx

16、xxx21%/Yr. compoundProductivity growth ratex58%/Yr. compoundedComplexity growth rate10,0001,0001001010.10.010.001Logic Transistor per Chip(M)0.010.11101001,00010,000100,000Productivity(K) Trans./Staff - Mo.Source: SematechComplexity outpaces design productivityComplexityCourtesy, ITRS RoadmapEE141 D

17、igital Integrated Circuits2ndIntroduction24qTechnology shrinks by 0.7/generationqWith every generation can integrate 2x more functions per chip; chip cost does not increase significantlyqCost of a function decreases by 2xqBut qHow to design chips with more and more functions?qDesign engineering popu

18、lation does not double every two yearsqHence, a need for more efficient design methodsqExploit different levels of abstractionEE141 Digital Integrated Circuits2ndIntroduction25n+n+SGD+DEVICECIRCUITGATEMODULESYSTEMEE141 Digital Integrated Circuits2ndIntroduction26qHow to evaluate performance of a dig

19、ital circuit (gate, block, )?qCostqReliabilityqScalabilityqSpeed (delay, operating frequency) qPower dissipationqEnergy to perform a functionEE141 Digital Integrated Circuits2ndIntroduction27q NRE (non-recurrent engineering) costsqdesign time and effort, mask generationqone-time cost factorq Recurre

20、nt costsqsilicon processing, packaging, testqproportional to volumeqproportional to chip areaEE141 Digital Integrated Circuits2ndIntroduction28EE141 Digital Integrated Circuits2ndIntroduction29Single dieWaferFrom Going up to 12” (30cm)EE141 Digital Integrated Circuits2ndIntroduction30Fabrication cap

21、ital cost per transistor (Moores law)EE141 Digital Integrated Circuits2ndIntroduction31%100per wafer chips ofnumber Totalper wafer chips good of No.Yyield Dieper wafer DiescostWafer cost Diearea die2diameterwafer area diediameter/2wafer per wafer Dies2EE141 Digital Integrated Circuits2ndIntroduction

22、32area dieareaunit per defects1yield die is roximtely 3 4area) (die cost diefEE141 Digital Integrated Circuits2ndIntroduction33ChipMetal layersLine widthWafer costDef./ cm2Area mm2Dies/waferYieldDie cost386DX20.90$9001.04336071%$4486 DX230.80$12001.08118154%$12Power PC 60140.80$17001.312111528%$53HP

23、 PA 710030.80$13001.01966627%$73DEC Alpha30.70$15001.22345319%$149Super Sparc30.70$17001.62564813%$272Pentium30.80$15001.5296409%$417EE141 Digital Integrated Circuits2ndIntroduction34i(t) Inductive coupling Capacitive couplingPower and ground noisev(t)VDDEE141 Digital Integrated Circuits2ndIntroduct

24、ion35V(x)V(y)VOHVOLVM VOHVOLfV(y)=V(x)Switching ThresholdNominal Voltage LevelsVOH = f(VOL)VOL = f(VOH)VM = f(VM)EE141 Digital Integrated Circuits2ndIntroduction36VILVIHVinSlope = -1Slope = -1VOLVOHVout“ 0”VOLVILVIHVOHUndefinedRegion“ 1”EE141 Digital Integrated Circuits2ndIntroduction37Noise margin

25、highNoise margin lowVIH VILUndefinedRegion10VOH VOLNMHNMLGate OutputGate InputEE141 Digital Integrated Circuits2ndIntroduction38qAllocates gross noise margin to expected sources of noiseqSources: supply noise, cross talk, interference, offsetqDifferentiate between fixed and proportional noise source

26、sEE141 Digital Integrated Circuits2ndIntroduction39qAbsolute noise margin values are deceptiveqa floating node is more easily disturbed than a node driven by a low impedance (in terms of voltage)qNoise immunity is the more important metric the capability to suppress noise sourcesq Key metrics: Noise

27、 transfer functions, Output impedance of the driver and input impedance of the receiver; EE141 Digital Integrated Circuits2ndIntroduction40v0v1v3finv(v)f(v)v3outv2inRegenerativeNon-Regenerativev2v1f(v)finv(v)v3outv0inEE141 Digital Integrated Circuits2ndIntroduction41 A chain of invertersv0v1v2v3v4v5

28、v62V (Volt)4v0v1v2t (nsec)02 11356810 Simulated responseEE141 Digital Integrated Circuits2ndIntroduction42NFan-out NFan-in MMEE141 Digital Integrated Circuits2ndIntroduction43Ri = Ro = 0Fanout = NMH = NML = VDD/2 g = VinVoutEE141 Digital Integrated Circuits2ndIntroduction44NMHVin (V)Vout(V)NMLVM0.01

29、.02.03.04.05.01.02.03.04.05.0EE141 Digital Integrated Circuits2ndIntroduction45VouttftpHLtpLHtrtVint90%10%50%50%EE141 Digital Integrated Circuits2ndIntroduction46v0v1v5v1v2v0v3v4v5T = 2 tp NEE141 Digital Integrated Circuits2ndIntroduction47voutvinCRtp = ln (2) t = 0.69 RCImportant model matches delay of inverter EE141 Digital Integrat