英文会议通知范文

1、 英文会议通知范文篇一：英文会议通知 The Notice on Management of Science and Technology Working Conference Dear Sir or Madam: In order to speed up the transformation of achievements in science and technology, and enhance the level of service capabilities and management of science and technology achievements, after ca

2、refully research we will hold a conference considering provincial science and technology management. Supported and approved by China Association on Science and Technology, Heilongjiang Province Science and Technology Achievement Management Hall and Promotion Agency. As this department are in charge

3、of this aspect work. The Conference would be High-end grand gathering of managers who are focus on science and technology in Heilongjiang province. We sincerely welcome all managers, and relevant experts and scholars to exchange information, so that fulfill a bright future at the meeting! Date: Janu

4、ary 5, 2012 Hold place: Conference Room, Fifth Floor, Science and Technology Information Institute, Harbin, Heilongjiang Province, China Subject: “The Management of Provincial Science and technology Achievement” The conference intends to summarize the management of scientific andtechnological achiev

5、ements in 2011, and allocate the management of Provincial Science and technology achievement in 2012. In addition, we will discuss the shortcomings and problems which exist on our province science and technology management, the award on science and technology achievement, and the transformation of a

6、chievements in science and technology, accordingly, put forward methods, strategies, recommendations, measures, and so on. Organization: Organizer: China Association on Science and Technology Contractors: Science and Technology Achievement Management Hall and Promotion Agency, Heilongjiang province.

7、 Secretariat: Secretary-general: Professor Wang Hai, Director of China Association on Science and Technology Assistant secretary general: Professor Li Jing, Science and Technology Achievement Management Hall and Promotion Agency. Contact: Address: NO. 74th, Nan gang district, Harbin Bank, Harbin, He

8、ilongjiang, China Postcode: 150000 Mobile phone number:Tel (Fax): 045182621220Email: hui Contact Person: Hu Weiye Conference expense (each): Attending fee: ￥500 per person Transportation and accommodation are self-care. Registration closing date: Please fill in the receipt before Octobe

9、r 28, 2011 to our place. Exceeds the time limit no longer accepts the registration matters concerned.篇二：会议通知,英文模板 这是一个模板，打开下面网页还有具体要求，可以参考网页中具体内容 SAMPLE MEETING NOTICE The _ Name of Governing Body of the _ Name of Public Entity (hereafter referred to as “governing body”) will be holding a(n) _ regul

10、ar, special, or emergency meeting on _ Date at _ Time. The meeting will be held in the _ room at _ Location of the Meeting. In the event that any or all of the members of the governing body participate in the meeting by telephone or video, a speakerphone or monitor will be available at the location

11、noted above. At the time this notice is being prepared, the governing body expects the agenda of its meeting to include the following topics: Include all topics the governing body expects to discuss. Also include the topics to be discussed during, and the legal authority for holding, any anticipated

12、 executive sessions. 1. 2. 3. 4. 5. Where noted, the discussion of some of the above topics may be held in executive session rather than during the portion of the meeting which is open to the public. If this is a regular meeting, additional topics may be discussed. If this is a special or emergency

13、meeting, the governing bodys discussion will be limited to the topics andexecutive sessions listed above. Date of Notice:_ Name of Person Preparing Notice: _篇三：怎样用英语写一篇会议通知可以参考的模板 The First International Conference on Chemistry & Computer Science (Chemistry & CS 2014) 31 March, Xian, China Download

14、Chemistry & CS 2014-Call For Paper(word) Chemistry & CS 2014-Call For Paper(pdf) Important Dates ： Paper submission deadline: March 1, 2014 Notification of acceptance: March 15, 2014 Proceedings version deadline: March 25, 2014 Topics include all aspects of conference but are not limited to the foll

15、owing areas: Map Reduce across distributed data centers for data-intensive computing DNA-Mediated Homogeneous Binding Assays for Nucleic Acids and Proteins The Chemistry and Applications of Metal-Organic Frameworks Chemical plating and electroplating copper on the PCB( printed circuit board) Instruc

16、tions for Chemistry & Computer Science： In recent years, plenty of information are springing up via Blog, QQ and other Medias which makes us lose in the sea of data. If you want to know more about it and find out the internal relations among them, you must use some techniques or methods to analysis

17、and process data. Data-intensive computing and cloud computing emerge rapidly. Nowadays there are lots of technology which is not so far perfect. Thus this conference thus provides a platform for researchers, scholars and practitioners to exchange new ideas for solving these problems. The conference

18、 would be able to introduce the chemistry as follows: Firstly, this review focuses on homogeneous binding assays, which are carried out in solution, without the need for separation, immobilization, or washing steps. Such homogeneous binding assays can be performed in a single tube/vial or in live ce

19、lls. Secondly, Metal-organic frameworks (MOFs) are made by linking inorganic and organic units by strong bonds (reticular synthesis). The flexibility with which the constituents geometry, size, and functionality can be varied. These capabilities enable substantial enhancement of gas storage in MOFs

20、and have led to their extensive study in the catalysis of organic reactions, activation of small molecules (hydrogen, methane, and water), gas separation, biomedical imaging, and proton, electron, andion conduction. At present, methods are being developed for making nanocrystals and supercrystals of

21、 MOFs for their incorporation into devices. At last, chemical copper plating including electro less plating and electrochemical copper plating is manly that the especial additive is added to the copper plating bath for enhancing the abilities of micro via filling of the plastic plate or the copper p

22、late. And in order to meet the needs of the industry, the copper plating formula is described in detail. Introduction for the authors ： Submissions must not be substantially duplicate work that any of the authors has published elsewhere or submitted in any other journal. The content of the thesis is innovative. And the submission should begin with a title followed by a short abstract and keywords. Authors of accepted papers or the applications of the unit or school must guarantee that at least one of the authors will attend the conference and present thei