SMT缺陷及防范措施概述

SMTdefectsandcountermeasureSMT缺陷及防范措施2023/7/71IdentifySMTdefectsIdentifytheSMTdefectsaccordingtoIPC-A-610(Rev:D)根据IPC-A-610(Rev:D)确定缺陷．

Thisstandardisacollectionofvisualqualityacceptabilityrequirementsforelectronicassemblies.IPC-A-610是关于电子组装外观质量验收条件要求的文件．2023/7/72Majorcontributortodefects

缺陷的主要分布Source:MPM’sAuser’sguidetomorePreciseSMTprinting2023/7/73Knowthecommondefect

了解常见缺陷类型Analysizethepossiblecause

分析可能的原因Countermeasureforthedefects

基于以上原因采取的对策

LearningObjectives

学习目的2023/7/74•

Chip

components

standing

on

a

terminal

end

(tombstoning).片式元件末端翘起（墓碑）Tombstoning/立碑2023/7/75Countermeasure/对策Mechanism:Surfacetensionincomponentterminalisuneveninreflow.原理:在回流过程中零件两末端的表面张力不均衡.1.Componentterminalheatdistributedunevenly零件两末端受热分布不均衡.Insufficientsoaktime:Reflowprofileoptimization.

保温区时间太短:优化回流曲线参数.2.PCBPaddesignissue(thepadsdistanceistoobig):improvePCBpaddesign.PCB焊盘设计问题(焊盘间距太大):改善PCB焊盘设计.Tombstoning/立碑2023/7/76Countermeasure/对策

3.Componentterminaloxidizationorcontamination:SolderabilitytestifnecessaryandRTVthedefectmaterial.

元件末端氧化或者受污染:根据情况做可焊性实验并且退还缺陷物料.4.Printingmisalignment:adjustprintingmachineparameters.丝印偏位:校正丝印机的参数.5.Placementmisalignment:OptimizetheP&Pmachineparameters.

贴片偏位:优化贴片机的参数.6.Stencilaperturedesignissue:studyandimprovetheaperturedesign.

钢网开孔的设计问题:研究并且改善开孔设计.

Tombstoning/立碑2023/7/77•Asolderconnectionacrossconductorsthatwasjoined.焊锡在导体间非正常连接.•

Solder

has

bridged

to

adjacent

non-common

conductor

orcomponent.焊锡桥连到相邻的非导体或元件.Solderbridge/桥联2023/7/78Countermeasure/对策

1.Screenprintingissue/丝印问题:a)PasteheightoutofUCL:Adjusttheprintertocontrolthepasteheight.锡膏高度超出控制上线:校正丝印机,控制锡膏高度.b)Pasteprintingmisalignmentorbridging:Finetuneprintingmachine./锡膏印刷偏位或者桥联:优化丝印机.c)Icicleprinting:Finetuneprintingmachineorchangetolowerviscositypaste.丝印拉尖:优化丝印机或者使用低粘性的锡膏.d)Solderpastecollapse:changetohigherviscositypaste./锡膏塌陷:使用高粘性的锡膏.e)Nonstandardstencilapertureopening:Studyandimprovetheaperture./不标准的钢网开孔:研究并改善开孔.Solderbridge/桥联Icicleprinting丝印拉尖Pastecollapse锡膏塌陷Bridging桥联Misalignment印刷偏位2023/7/79Countermeasure/对策2.Pick&Placement/贴片a)Componentplacingmisalignment:FinetunetheP&Pmachine.元件贴片偏位:优化贴片机的参数.b)Highpressureforplacement:reducepressuretopropervalue.

贴片压力过大:减少压力到适当的参数.3.Wavesoldering/波峰焊a)Lowconveyorramp:Raisetheconveyorrampperactualstatus.传送带角度过小:根据实际情况加大传送带角度b)Lessfluxonboard:Increasethefluxsprayvolumeonboardbeforegoingthroughwavesoldering.板上的助焊剂较少:波峰焊接之前加大助焊剂的喷射量Solderbridge/

桥联2023/7/710Componentdamaged(Nicks,cracks,orstressfractures)/元件损坏Nicks,cracks,orstressfractures.缺口，裂纹，压痕2023/7/711Countermeasure/对策1.Rawmaterialdamaged:purgethebatchmaterial./来料损坏:清除这批来料.2.DamagedduringSMTprocess(Fixtureormachinetouchit):Investigateandtakecorrectiveactionsfornonstandardoperation.

在SMT流程中损坏(夹具和设备接触):调查分析并且对不规范的操作作出矫正行动.3.Fastcoolingrateonreflowprocess:Controlthecoolingratetobelow4degreepersecond.

在回流过程中冷却速率过快:控制冷却速度使斜率保持在每秒4度以下.Typicalreflowprofile/回流曲线典例:PreheatstageSoakstageReflowstagePeaktemp.Cooldown<4oC/sComponentdamaged(Nicks,cracks,orstressfractures)/元件损坏2023/7/712Misalignment偏位2023/7/713Countermeasure/对策1.P&Pmachinefunctionunstable:FinetunetheP&Pmachine.

贴片机性能不稳定:优化贴片机性能参数.a)FinetuneX,Ydata/调整X,Y坐标b)Optimizepickandplacementparameters./校正吸料和贴片的参数.

2.Componentterminationoxidization:Solderabilitytestifnecessary.Purgethefailedmaterial/元件末端氧化:可焊性实验,清除不合格的来料.

3.Operatortouchthecomponentpriortoreflow:Standardizetheoperatorhandling(documentcontrol)/在回流炉前目检操作员碰到贴片元件:标准化操作员操作(文件控制)4.Airflowrateinthereflowovenissohighthatthecomponentsaremoved.回流炉内空气流量太高以致吹偏了元件.Misalignment偏位2023/7/714Componentleadlifted元件引脚翘高One

leadorseriesofleadsoncomponentisoutofalign-ment

and

fails

to

make

contact

with

the

land.元件一个或多个引脚变形不能与焊盘正常接触．2023/7/715Componentleadlifted元件引脚翘高Countermeasure/对策1.Componentleadbentbeforeplacement:Sortthedefectivepartandreturnittovendor.贴片前元件引脚变形:挑选出缺陷元件,退回供应商．2.Manualplacementtheloosepart:Inspectthepartbeforepassittoreflow.手放散料:回流前目检．2023/7/716Solderball锡珠Solderballsarespheresofsolderthatremainafterthesolderingprocess.Solderballsviolateminimumelectricalclearance.焊锡球是焊接后形成的呈球状焊锡.

Solderfinesaretypicallysmallballsoftheoriginalsolderpastemetalscreensizethathavesplatteredaroundtheconnectionduringthereflowprocess.焊锡残渣是在回流中形成的小的球状或不规则状焊锡球.2023/7/717Solderball锡珠

Countermeasure/对策1.StencilAperturedonotfocustopad:improvestencilapertureopening.

钢网开孔没有对准焊盘中心:改善钢网开孔.2.Printingmisalignment:Finetuneprintmachine.

丝印偏位:调整丝印机状态.3.Excesspaste:Cpkcontrol.多锡:Cpk控制.4.DampPCB:BakethePCBbeforeloadingittoSMT.PCB焊盘受潮:SMT组装流程之前烘烤PCB.6.Stencilpolluted:cleanthestencil.钢网脏污:清洗钢网.7.Profilerampupistoofast:Optimizereflowprofile.

回流曲线升温速度过快:优化回流曲线.8.Pasteoxidized:exchangewithfreshsolderpaste.锡膏氧化:更换新锡膏.9.Chipwaveorsolderwaveheightistoohighcausedexcesssoldertotopside:adjustthewavesolderingheighttoproperlevel(wavesolder).

波峰高度设置的太高致使多余的焊锡到顶面:校正波峰焊设置到适当的高度

(波峰焊接).2023/7/718Non-Wetting,Dewetting/虚焊，半润湿

•

Solder

has

not

wetted

to

the

land

or

termination

where

solderisrequired.

虚焊:需要焊接的引脚焊盘不润湿．•Solder

coverage

does

no

meet

requirements

for

the

termination

type.

•

Dewettingasaconditionresultswhenmoltensoldercoatsasurfaceandthenrecedestoleaveirregularly-shapedmoundsofsolderthatareseparatedbyareasthatarecoveredwithathinfilmofsolderandwiththebasismetalorsurfacefinishnotexposed.

半润湿:熔化的焊锡浸润表面后收缩,留下一焊锡薄层覆盖部分区域,焊锡形状不规则.2023/7/719Non-Wetting,Dewetting/虚焊，半润湿1.Poorsolderabilityofcomponentorpad./元件或焊盘可焊性太低Rootcause:a)OlddatecomponentorPCB./陈旧元件或PCB板b)ContaminationoroxidationoncomponentorPCB.元件或焊盘污染或氧化Action:Purgethematerialforfurtherdisposition.

/清除来料2.Thepasteoutofitslifetime:/锡膏超出有效期Scrapthelotpasteandreplaceitwithfreshone报废有问题的锡膏更换新锡膏2023/7/720Coldsolder/冷焊

•Incompletereflowofsolderpaste.焊锡回流不完全2023/7/721Coldsolder/冷焊

Countermeasure/对策1.Peaktemperatureistooloworreflowtime(dwelltime)

isnotenough:Re-setuptheprofiletofulfillthepastespecorcustomerprovidedspec.requirement.回流峰值温度太低或者回流时间不够:重设温度曲线图.Typicalreflowprofile:/典型的回流曲线PreheatstageSoakstageReflowstagePeaktemp.Cooldown<4oC/s2023/7/722Time时间Temp.温度230°C250°Ctc1–smallSMDtc1–mediumSMDtc3–largeSMD20°C20°CTooHot!TooCold!Peak:230–250°CColdsolder/冷焊2023/7/723Coldsolder/冷焊

Countermeasure/对策2.Thecomponentinsomelocationcoveredwithreflowpallet(Peaktemperatureistooloworreflowtime(dwelltime)

isnotenough):EnlargethepalletopenwindowforthedefectlocationstoreducetheΔT.某些元件位置被回流托盘遮挡造成该点峰值温度太低或回流时间不足:

对缺陷位置放大托盘的开口从而减少温差（ΔT）.

2023/7/724Solderhole/锡洞

•Blowholes,pinholes,voids吹孔,针孔,空洞2023/7/725Solderhole/锡洞

Countermeasure/对策1.Insufficientpreheat:Reflowprofileoptimize.预热时间不足:优化回流曲线设置.2.Rampupistoofast:Re-setupthereflowprofiletomakeitoptimize.

升温速率太快:重设回流曲线图使之最优化.3.Excessfluxinsolderpaste:properlytoincreasepreheattimeandtemperature.

锡膏助焊剂含量过多:适当增加预热时间和温度值.4.DampPCB:BakethePCBbeforeloading

ittoSMT.

PCB受潮:SMT组装前烘烤PCB板.5.Componentfeetoxidation:BakeitbeforeSMTorrequirevacuumpackingonincomingmaterial.元件脚氧化:烘烤或者来料真空包装.6.Attachedfluxresidueoncomponentfoot:Sortoutthedefectpart.

元件脚有助焊剂残渣:挑选出缺陷来料.

2023/7/726DisturbedSolder/焊锡紊乱•Disturbed

solderjointcharacterizedbystresslinesfrommovementintheconnection.在冷却时受外力影响,呈现紊乱痕迹的焊锡2023/7/727DisturbedSolder/焊锡紊乱Countermeasure1.Optimizereflowsoldering

profileespeciallyforcoolingzone.优化冷却区回流曲线2.ConveyorshakinginPCAcoolingdownphase:Repairthe

conveyorperactualstatus.冷却阶段传送带震动:根据实际情况调校传送带．2023/7/728SolderProjections/锡尖Solderprojectionviolatesassemblymaximumheightrequirementsorleadprotrusionrequirements.焊锡毛刺违反组装的最大高度要求或引脚凸出要求.Solderprojectionviolatesminimumelectricalclearance.焊锡毛刺违反最小电气间隙.2023/7/729SolderProjections/锡尖Countermeasure1.Lessfluxonboard:Increasethefluxsprayrateonboardbeforegothroughwavesoldering(wavesolder).助焊剂不足:增加助焊剂的喷射量

2.Lowconveyorramp:Raisetheconveyorrampperactualstatus(wavesolder).传送带角度过小:根据实际情况校正传送带角度3.Excesspreheattemperatureandtime(fluxdryoff):Optimizewavesolderingprofile.(Wavesolder)预热过度（助焊剂过度挥发）:优化波峰曲线(波峰焊)4.Causedbyrework:Standardizeoperatorhandlingandenhancevisualinspection.返修中产生:规范员工操作加强目检.2023/7/730NoSolder/无锡

Nosolder

to

the

land

or

termination

where

solderisrequired.焊点无锡2023/7/731NoSolder/无锡

Countermeasure/对策1.Missingprinting/漏印Rootcause:a)Stencilaperturewasjammed./钢网堵孔b)Highviscosityofsolderpaste./锡膏粘性过高Action:a)Cleanstencil;/清洗钢网b)Replacetherecycledpastewithfreshone./更换新锡膏c)Printingmachineparameteradjustment./校正丝印机参数2.Poorsolderabilityofcomponentorpad./元件或焊盘可焊性太低Rootcause:a)OlddatecomponentorPCB./陈旧元件或PCB板b)ContaminationoncomponentorPCB./元件或焊盘受污染Action:Purgethematerialforfurtherdisposition.

/清除来料3.Insufficientfluxvolume:increasefluxsprayrate(wavesolder).

助焊剂量不足:增加助焊剂喷射量(波峰焊接)4.Preheatexcess:lowerpreheattemperatureproperly(wavesolder).预热过度:适当降低预热温度(波峰焊)5.Chipwaveorsolderwaveheightislow:properheight(wavesolder).波峰高度过低:调整到适当高度(波峰焊)2023/7/732InsufficientSolder/少锡Insufficientsolder焊锡不足2023/7/733InsufficientSolder/少锡

Countermeasure/对策1.Stencilaperturecloggingcauseincompletesolderprinting):Automaticormanualcleanthestencil.钢网孔堵塞导致锡膏不完全印刷:自动或者手工清洗钢网2.Noenoughsolderpastevolume(PasteheightunderLCL):VisualinspectionandCpkcontrol.锡膏量不足(锡膏高度在LCL以下):目检和Cpk控制3.Solderpasteprintmisalignment:Finetuneprintingmachine锡膏印刷偏位:校正丝印机使之最优

4.PoorsolderabilityofcomponentorPCBpad:元件或PCB焊盘可焊性差a)Optimizereflowprofile.优化回流曲线b)Exchangethepoorsolderabilitycomponent.更换掉低可焊性元件5.Excessglueorgluemisalignment:Finetunescreenprint(wavesolder).点胶过多或点胶偏位:优化丝印参数6.Lessflux:Increasethefluxsprayonboardbeforeitpasswavesoldering(wavesolder).助焊剂不足:增加助焊剂的喷射量

2023/7/734•Solderfilletextendsontothetopofthecomponentbody.焊锡接触元件体．ExcessSolder/多锡2023/7/735ExcessSolder/多锡

Countermeasure/对策1.Excesssolderpaste:锡膏量过多a).SolderpasteheightoutofUCL:Adjustprintingmachinetocontrolthepasteheight.锡膏高度超出UCL:校正丝印机控制锡膏高度b).Nonstandardofstencilapertureopening:standardizethestencilapertureopeningfordifferenttypecomponents.钢网开孔不标准:为不同类型的元件设置相应钢网的开孔标准2.Wavesoldering/波峰焊接a)Lowconveyerramp,longwavesolderingtime:Adjustconveyorrampangleto5~7degreeandsolderingtimeto3~5second.

传送带角度过小,波峰焊接时间变长:校正传送带角度到5~7度,焊接时间3~5秒b)Highpreheattemperaturetodryofftheflux:Accordingtofluxspectocontrolthepreheattemperature,normallythePCBsurfacepreheattemperatureshouldbeunder100oC.高预热温度造成助焊剂过度挥发:按照助焊剂的规格控制预热温度,通常,PCB表面温度一般低于100oC2023/7/736WrongOrientation/Polarity反向,极性反

Correctpolarity/正确的极性Wrongpolarity/极性反Thismarkisanodeof

tantalumcapacitoronPCB.Thismarkisanodeof

tantalumcapacitor.

Correctpolarity/正确的极性Wrongpolarity/极性反Thismarkiscathodedirection.Thismarkiscathodedirection.WrongPolarity:/极性反2023/7/737WrongOrientation/Polarity反向,极性反Correctdirection/正确的方向WrongOrientation/反向ThismarkisIC'sdirection.ThismarkisIC'sdirectiononPCB.WrongOrientation/反向:TheICispopulatedininversedirectiononthePCB./IC被反方向组装在线路板上2023/7/738

Countermeasure/对策1.Wrongplacementmachineprogram:Checkandcorrectthemachineprogram.

贴片机程序错误:检查和更正机器程序2.Manualplacementinreversedirection:手工放置元件错误a)Avoidmanualplacementcomponents避免手工放置元件b)Needspecialinspectionforthemanualplacementpriortoreflow(documentcontrol).炉前需要特别检查那些手工放置的元件(文件控制)3.Disorderedorientationinthetray/reeloftheincomingmaterial:卷装或盘装来料元件的不规则放置．a)InspectbeforeloadingittoSMT.上料前检查来料b)Feedbacktovendortotakecorrectiveactions.

反馈给供应商采取改善行动WrongOrientation/Polarity反向,极性反2023/7/739a.Longlead/shortlead脚长/脚短b.Missingcomponent元件丢失c.Exposecopper露铜d.Surfacescratched外观划伤Countermeasure/对策Takecorrectiveactionandpreventiveactionafterinvestigated.调查后采取相应的改善措施和预防措施．Others其它2023/7/740ThankyouTheEnd2023/7/741谢谢观看/欢迎下载BYFAITHIMEANAVISIONOFGOODONECHERISHESANDTHEENTHUSIASMTHATPUSHESONETOSEEKITSFULFILLMENTREGARDLESSOFOBSTACLES.BYFAITHIBYFAITH一本万利工程1、背景驱动2、盈利策略3、选菜试菜4、价值创造5、完美呈现6、成功面试7、持续改造（一）、一本万利工程的背景驱动

1、什么是一本万利

2、餐饮时代的变迁菜单经验的指导方针运营市场定位的体现经营水平的体现体现餐厅的特色与水准沟通的工具餐厅对顾客的承诺菜单承诺的六大表现1、名字的承诺2、质量的承诺3、价格的承诺4、规格标准的承诺5、外文翻译的准确6、保证供应的承诺

1、顾客满意度餐厅价值、价格、合理感、愉快感、安心感、美味感、便利感、满足感、有价值感、喜悦感、特别感2-2、初期投资餐厅面积、保证金、设备投资、店铺装潢、器具用品投资、制服选定、菜单制作2-1、开业准备厨具、供应商选定、设计、用品选定、餐厅配置、员工训练、餐厅气氛、促销方式3、经营数据营业额、客流量、成本率、人均消费、顾客回头率、出品速度、人事费用菜单内容决定决定相关相关决定决定决定决定以菜单为导向的硬件投资

1、餐厅的装修风格2、硬件设施服务操作3、餐厅动线4、餐具与家俬5、厨房布局6、厨房设备菜单设计正果1、能诱导顾客购买你想让他买的餐点2、能迅速传达餐厅要表达的东西3、双赢：顾客喜欢、餐厅好卖餐厅时代的变迁食物时代硬体时代软体时代心体时代食物食品饥食饱食品质挑食品味品食品德惧食体验人们正在追寻更多的感受，更多的意义更多的体验，更多的幸福（二）盈利策略1、组建工程团队2、确定核心价值3、确定盈利目标4、确定客单价5、设计盈利策略6、确定核心产品谁来设计菜单？产品=做得出来的物品商品=卖得出去的物品商家=产品具备商品附加值物（什么产品）+事（满足顾客何种需求）从物到事从食物到餐饮从吃什么到为什么吃产品本身决定一本，产品附加值决定万利从生理到心理从物质到精神从概念到五觉体验创造产品的五觉附加值体验何来

一家企业以服务为舞台以商品为道具，让消费者完全投入的时候，体验就出现了PART01物=你的企业卖什么产品+事=能满足顾客何种需求？确定核心价值理念核心价值理念1、卖什么样的菜2、卖什么样的氛围？3、如何接待顾客？卖给谁？卖什么事？卖什么价？企业目标的设定1、理论导向的目标设定2、预算3、制定利润目标费用营业额亏损区利润区临界点变动费用总费用营业额曲线费用线X型损益图利润导向的目标设定确定目标设定营业收入=固定成本+目标利润1-变动成本率-营业税率例：A餐厅每月固定成本40万，变动成本50%，营业税率5.5%，目标利率每月8万，问A餐厅的月营业收入：月营收入=（40+8）÷（1-50%-5.5%）=48÷0.445=108万测算损益平衡点保本线=固定成本1-变动成本率-营业税率例：A餐厅保本线=40÷（1-50%-5.5%）

=40÷0.445

=90万定价的三重意义2、向竞争对手发出的信息和信号1、是利润最大化和最重要的决定因素3、价格本事是价值的体现定价由此开始1、评估产品、服务的质量2、寻求顾客价值与平衡点3、以价值定义市场确定客单价盈利占比策略

占比策略内部策略销售占比占比策略内部策略10%40%10%20%20%（三）、选菜试菜1、ABC产品分析2、产品的确定（食材、口味、烹调、餐饮）3、成本的确定ABC分析策略毛利率营业额CBACABBACCCAA营业额C毛利A优化、提升增加销售双A双赢ABC顾客商品涨价保留亏本商品删营业额A毛利C顾客超额、成本过高有意义的保留无意义的删除双C双输菜单内容选择的标准因素成本设备厨师技术操作空间菜系风格吻合度品质可控度原料供应顾客喜好菜单协议度（销售目标、颜色、口味、造型、营养等）产品类别确定的四个方面1、按食材确定比例2、按口味确定比例3、按烹饪确定比例4、按餐饮确定比例

（无酒精饮品、含酒精饮品比例）框架依据操作依据目标依据成本依据试口味成本操作第一次试菜的内容精确的成本核算—五个关键词1、净料率（一料一控、一料多档）2、调味料成本（单件产品、批量产品）3、燃料成本4、统一计量单位5、标准食谱成本卡试口味餐具造型色彩第二次试菜的内容四料构成表1、符合思想审定2、符合目标审定3、符合定位审定4、符合框架审定四平构成表(四)、创造价值1、定价策略的确定2、提升双A核心产品的附加值3、增加更多的顾客选