面板制程CF-process-简介课件

CFProcess簡介JerryTFT/LCD材料工程部CFProcess簡介JerryLCD&CF結構簡介

CF光阻材料簡介

CF製程及檢驗手法簡介

MacroInspection判定方法

MicroInspection判定方法

CFProductIDnamingrule課程大綱LCD&CF結構簡介課程大綱LCD面板結構圖下玻璃基板上玻璃基板上偏光板PS液晶分子下偏光板框膠配向膜TFT元件彩色濾光板液晶層光線(背光源)LCD:LiquidCrystalDisplay(液晶顯示器)LCD面板結構圖下玻璃基板上玻璃基板上偏光板PS液晶分子下CF結構圖ITO剖面示意圖俯視示意圖實際圖例素玻璃BMRLayerGBMVAPSCF:ColorFilter(彩色濾光片)CF結構圖ITO剖俯實際圖例素玻璃BMRL光阻材料分類與成分正型光阻:BM(Cr),MVA負型光阻:ColorResist(R,G,B),PS,RBM彩色光阻溶劑固成分PastePolymerMonomerPhoto-initiatorAdditivePigmentDispersantSolventMonomerInitiator光阻材料分類與成分正型光阻:BM(Cr),MVA彩色光光阻材料成分v.s光阻特性光阻材料成分v.s光阻特性CF製造流程1.廣視角產品(MVA產品):2.非廣視角產品(TN產品):BMRGBITOPSBMRGBITOMVAPS*BM依材質類型有Resin及CrBM二種CF製造流程1.廣視角產品(MVA產品):2.非廣視角產品CF製作方法CF製作方法CF製程機制:PhotolithographyPhotosensitiveMaterialsSubstrateNegativeTypePositiveTypeMMBinderUVPigmentPhoto-initiatorSolubleInsolubleCoatingExposureDevelopmentImagesUV

Photolithography:顯影液:KOHCF製程機制:PhotolithographyPhotoCFProcess優點:

1.Process減少(設備簡化)2.光阻用量減少(1)Spin---轉速(rpm)決定膜厚(2)Spinless---

吐出量(PR值)決定膜厚CoaterSpinVCDEBRHP/CPExposureDevelopmentAOIOvenCassetteCoaterVCDHP/CPExposureDevelopmentAOIOvenCassetteCoater:優點:

塗佈均勻性較好

缺點：1.多一道製程

2.光阻用量多(浪費光阻,增加成本)CFProcess優點:1.Process減少(設BMProcess(1300)

BM:遮蔽漏光區,增加對比

RGB:提供色度

ITO:提供電場所需之電極

MVA/DJITO:提供廣視角

PS:支撐TFT/CF所需之CellGapBMProcess(1300)BM:遮蔽漏光區,BMProcess鉻玻璃清洗正光阻塗佈(1)正光阻塗佈(2)Pre-cleanerSlitcoaterSpincoater2.BMphotolineUnpacker&Initialcleaner鉻膜濺鍍素玻璃投入1.Crsputtering鉻玻璃CrsputterCrglassCrOx,CrNy,Cr一.CrBMprocess:XX:

Spinless無BMProcess鉻玻璃清洗正光阻塗佈(1)正光阻塗佈(BMProcess蝕刻去光阻紫外線曝光顯影烘烤(Oven)去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloperHotplate3.EtchinglineEtchingStrippingBMpatternglass真空乾燥VacuumDryerPre-bake&CoolplateXX:

Spinless無預烘烤(HP)與冷卻(CP)BMProcess蝕刻去光阻紫外線曝光顯影烘烤(OvenBMProcess二.RBMprocess:素玻璃清洗負光阻塗佈(1)負光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterXX:

Spinless無紫外線曝光顯影烘烤(Oven)去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloperHotplate真空乾燥VacuumDryerPre-bake&CoolplateX預烘烤(HP)與冷卻(CP)BMProcess二.RBMprocess:素玻璃環保意識降低設備及建廠成本(省掉sputtering及Etching的設備)簡化製程流程製程一致性(BM,RGB,PS均使用負光阻)RBM的優點環保意識RBM的優點Blackmatrix的功用

遮蔽TFT

避免pixel以外區域漏光增進色彩對比性

降低面板的反射光Blackmatrix的需求☆低反射率:減低外來光線的干擾☆高OD值:阻隔pixel間的背光(增高對比)☆膜厚薄(避免角斷差發生)☆低pinhole數:避免漏光,產生亮點☆低particle數:增加良率Blackmatrix的功用遮蔽TFTBlackmaBMInspection1231.TotalPitch(長寸法)

2.CD(CriticalDimension)

3.MarktoEdge(端寸法)SubstrateR1.OD=-log(I/Io)>42.反射率(CrBM)3.Thickness(ResinBM)顯影後缺陷檢查ADI(AfterDeveloperInspection)巨觀檢查(Macroreview)IoIBMInspection1231.TotalPitchILSP01:ODStart區&平坦區各1點,片片檢避免Start區&平坦區的OD值差異太大.MUIN01:Macro確認In-lineMacro品質狀況(有無mura)PRIN01:AOI,CD確認In-lineMicro品質狀況避免CD太低,造成LCD漏光RBMLayerIn-lineSamplingILSP01:ODRBMLayerIn-lineSaRBMLayeroff-lineSamplingSPME01:OD避免OD太低,造成LCD漏光MACR51:Macro確認BMoff-lineMacro品質狀況CDME01:CD,端寸,Totalpitch避免CD太低,造成LCD漏光避免T/P太大or太小,造成LCD對組後漏光SUFT01:BMThickness控制角段差及ODRBMLayeroff-lineSamplingSPMRGBProcess(2300,3300,4300)BM:遮蔽漏光區,增加對比

RGB:提供色度

ITO:提供電場所需之電極

MVA/DJITO:提供廣視角

PS:支撐TFT/CF所需之CellGapRGBProcess(2300,3300,4300RGBProcess---R-Layer紅色光阻塗佈(1)紅色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterBMpatternglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryer預烘烤(HP)與冷卻(CP)Pre-bake&CoolplateXXX:

Spinless無RGBProcess---R-Layer紅色光阻塗佈(RGBProcess---G-Layer綠色光阻塗佈(1)綠色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterRglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預烘烤(HP)與冷卻(CP)X:

Spinless無RGBProcess---G-Layer綠色光阻塗佈(RGBProcess---B-Layer藍色光阻塗佈(1)藍色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterR,Gglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預烘烤(HP)與冷卻(CP)X:

Spinless無RGBProcess---B-Layer藍色光阻塗佈(121.PixelCD

2.Overlay

3.厚度(RGB段差)4.RGB色度量測3RGBInspection121.PixelCD

2.Overlay

3.厚度ITOProcess(5200)BM:遮蔽漏光區,增加對比

RGB:提供色度

ITO:提供電場所需之電極

MVA/DJITO:提供廣視角

PS:支撐TFT/CF所需之CellGapITOProcess(5200)BM:遮蔽漏光區,WhatisITO?ITO=IndiumTinOxide(銦錫氧化物)90wt.%In2O3+10wt.%SnO2

WhatisITO?ITO=IndiumTinSputtering(濺鍍)的原理於真空環境下,通入高電壓及Ar/O2混合氣體,產生Ar+離子撞擊ITO靶材,形成銦錫離子與O離子反應成銦錫氧化物(ITO),濺鍍於產品上.VacuumChamberSubstrateTargetPlasmaAr+e-GasInletVacuumPumps-2kVSputtering(濺鍍)的原理於真空環境下,通入高電ITOsputteringprocess氧化銦錫膜濺鍍ITOsputterITOpre-cleaner(水洗,清洗無機物)R,G,B玻璃投入ITO玻璃ITOglassDefectInspection(缺陷檢查機)(Micro1,4560)UVasher(清洗有機物)紫外線灰化Repair(修補)(repair1,4578)ITOsputteringprocess氧化銦錫膜濺鍍IITOInspection1.RGB色度量測

2.Rs(電阻值)量測3.光穿透率量測4.ITO膜厚量測5.T/P量測ITOITOInspection1.RGB色度量測

2.MVAProcess(6300)BM:遮蔽漏光區,增加對比

RGB:提供色度

ITO:提供電場所需之電極

MVA/DJITO:提供廣視角

PS:支撐TFT/CF所需之CellGapMVAProcess(6300)BM:遮蔽漏光區,何謂廣視角?TNtypeSuperMVA何謂廣視角?TNtypeSuperMVAMVAProcess

(Multi-domainVerticalAlignment)X:

Spinless無正光阻塗佈(1)正光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterITOglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預烘烤(HP)與冷卻(CP)MVAProcess(Multi-domainVerMVAInspection1.厚度量測

2.PixelCD量測3.Overlay4.Macro膜厚MVAInspection1.厚度量測

2.PixelPSProcess(7300)BM:遮蔽漏光區,增加對比

RGB:提供色度

ITO:提供電場所需之電極

MVA/DJITO:提供廣視角

PS:支撐TFT/CF所需之CellGap(間距)PSCFTFTPSProcess(7300)BM:遮蔽漏光區,增PSProcessPS光阻塗佈(1)PS光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&Coolplate預烘烤與冷卻XXX:

Spinless無PSProcessPS光阻塗佈(1)PS光阻塗佈(2)PPSInspection1.厚度量測

2.PixelCD量測3.Overlay4.Macro膜厚PSInspection1.厚度量測

2.Pixel最終檢查(FinalInspection)Macroinspection巨觀檢查AOIPre-cleaner光學檢查前清洗AOI(Auto-OptoInspection)光學檢查(Micro2,7560)Microreview拍照判CodeJudgement&Sorting判定與品質分類出貨Shipping非MVA產品MVA產品Repair修補(repair2,7578)最終檢查(FinalInspection)MacroinMacroInspection判定方法日光燈箱

鈉燈

檯燈

綠燈

鹵素燈

反射

透過

反射

透過

反射

透過

反射

透過

反射

透過

AlignmentMarkDefect

○

Mura

△

○

△

EBRResidue

△

○

髒污

○

透過暗點

△

○

○

透過亮點

○

○

玻璃缺陷

○

殘膜

○

刮傷

○

RGBCoinMura

○

DDCoinMura

○

PSCoinMura

○

Discolor

○

△

ColudyMura

○

註：○表示主要檢驗與判定方式；△表示輔助檢驗方式。MacroInspection判定方法日光燈箱鈉MicroInspection判定方法Defectcode設定為三碼,分述如下

:

第一碼:群組區分2InlineMacro3InlineAOI4MeasurementNG5MicroreviewNG6MacroNG7InkRepair8MicroreviewrepairMicroInspection判定方法DefectcMicroInspection判定方法第三碼:Defect類別第二碼:層別1BM-Layer2R-Layer3G-Layer4B-Layer5ITO-Layer6MVA-Layer7PS-Layer8預留碼9OTHER0機台異常MicroInspection判定