铝基板生产作业指导书

...wd......wd......wd...景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第5页共18页5of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDate1.0目的Purpose标准铝基板批量生产的操作，提升铝基板的品质档次。ToregulatemassproductionoperationofaluminousPCBandtoimprovethequalityofaluminousPCB2.0铝基板简介IntroductionofAluminousPCB2.1性能和应用FunctionandApplication铝基板是一种散热性能良好的绝缘金属基敷铜板,其特点在于：AluminousPCBisakindofinsulatedmetal-basedcopperboardwithhighthermaldiffusivity.Itscharacteristicsareasbelow:2.1.1良好的导热性能有助于元器件的冷却;Goodheatconductivityhelpstocoolcomponents.2.1.2较高的绝缘强度能够经受高达6KVAC电压；HighinsulatedcapacitycanmakealuminousPCBbear6KVACpressure.由于上述种种优越性能，铝基板被广泛应用于电源控制等方面。Duetothecharacteristicsabove,aluminousPCBiswidelyusedintheaspectofpowercontrol.2.2构造Structure2.2.1一般的金属基板分为三层：线路层、绝缘层和金属基层。Generallyspeaking,aluminousPCBisdividedintothreelayers:circuitlayer,insulatedlayer&metallayer.线路层一般采用电解铜箔，常用厚度有1OZ、2OZ、3OZ、4OZ等4种；绝缘层一般为填充了陶瓷的聚合物，其常用厚度为75m、150m；金属基层一般有铝基、铜基、铁基、CIC、CMC等，常用厚度为1.0mm、1.6mm、2.0mm、Circuitlayeriscommonlyusedelectrolyzedcopperfoilwiththicknessof1OZ,2OZ,3OZand4OZ.Insulatedlayerisoftenakindofpolymerfullofceramicswiththicknessof75mand150m.MetallayerusuallyincludesAl-basedboard,Cu-basedboard,Te-basedboard,CICandCMCetc.withthicknessof1.0mm,1.6mm,2.0mmand2.2.2为了保护铝面不被擦花、氧化，也有助于生产过程前面工序的控制，一般的铝基板铝面贴有保护膜；景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第6页共18页6of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDateInordertoavoidscratchesandoxidationofAlsurfaceandtocontrolpre-processduringproduction,theAlsurfaceofAluminousboardisusuallypastedwithalayerofprotectivefilm.2.2.3金属基板有单面、双面之分。以Bergquist公司提供的单面铝基板为例，其构造如下列图，具体参数为：Metal-basedaluminousboardisdividedintosingle-sidedoneanddouble-sidedone.Takingthesingle-sidedaluminousboardsuppliedbyBergquistasanexample,itsstructureandconcreteparametersareasbelow:铜箔厚度：4OZ绝缘层厚度：75um铝基厚度：1.0mm、1.2mm、1.6mmCopperfoilthickness:4OZInsulatedlayerthickness:75umAlbasethickness:1.0mm,1.2mm&1.6mm2.3标准尺寸StandardDimensionBergquist公司铝基板的标准尺寸有18″X24″和16″X19″两种，其有效利用尺寸分别为17″X23″和15″X18″；我司常用工作板尺寸为18″X24″。ThestandarddimensionsofBergquistaluminousboardsaredividedinto18″X24″and16″X19″withvaliddimensionsof17″X23″and15″X18″respectively.ThedimensionofKinwongworkingboardis18″X24″.注：其它供应商或客户指定之铝基板，根据实际情况而定。Remark:Thealuminousboardofferedbyothersuppliersorappointedbycustomersisdependentonrealsituation.2.4设计要点MainPointsofDesign为了有效地防止或减少铝基板使用过程中的漏电问题，在图形设计过程中要保证以下安全距离：Inordertoeffectivelyavoidordecreasethecreepageproblemduringaluminousboarduse,itisnecessarytokeepasafedistanceduringpatterndesignasbelow:孔边到线路边缘的距离最小值为T(T为板材厚度)TheminimumdistancebetweenholeandcircuitedgeisT(t=basematerialthickness).板边到线路边缘的距离最小值为TTheminimumdistancebetweenboardedgeandcircuitedgeisT.孔边到板边的最小距离为TTheminimumdistancebetweenholeandboardedgeisT.景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第7页共18页7of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDate冲孔最小孔径为TTheminimumhole-diameterforpunchingisT.倒角圆弧半径最小值为TTheminimumsemi-diameterofroundingcirculararcisT.3.0铝基板制程喷锡流程：来料检查→一次冲/钻孔→图形转移→图形检查→蚀刻→退膜→蚀检→阻焊制作→打定位孔→字符制作→喷锡→喷锡检查→单面磨板〔视客户要求而定〕→V-CUT/成型→通断测试→高压测试→FQC、FQA→包装入库HALSProcess：IQC→One-timehole-punching/drilling→ImageTransfer→ImageCheck→Etching→Film-stripping→EtchingCheck→SolderMaskMaking→Orientation-holePunching→ComponentMarkMaking→HALS→HALSCheck→Single-sideScrubbing〔accordingtocustomer’srequirements〕→V-CUT/Moulding→Open/ShortTest→High-pressureTest→FQC、FQA→PackingOSP流程：来料检查→一次冲/钻孔→图形转移→图形检查→蚀刻→退膜→蚀检→→阻焊制作→打定位孔→字符制作→V-CUT/成型→测试→FQC、FQA→OSP→FQC→包装入库OSPProcess：IQC→One-timehole-punching/drilling→ImageTransfer→ImageCheck→Etching→Film-stripping→EtchingCheck→SolderMaskMaking→Orientation-holepunching→ComponentMarkMaking→V-CUT/Moulding→Test→FQC、FQA→OSP→FQC→Packing3.1来料检查IQCA铜面检查：不允许有凹坑、擦花和严重氧化痕迹；Cusurfacecheck:Notches,scratchesandseriousoxidationarenotallowed.B保护膜检查：保护膜不应有破损至铝面露出；Protectivefilmcheck:Protectivefilmmustn’tbebrokenwithCuexposure.C厚度检查：按流程卡要求检测板厚、铜厚。Thicknesscheck:CheckboardthicknessandCuthicknessaccordingtolotcard.3.2一次冲/钻孔One-timeHole-punching/drillingA一次冲/钻孔主要冲管位孔和工艺孔，孔位和孔径均要符合图纸要求；景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第8页共18页8of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDateOne-timehole-punching/drillingismainlytopunchorientation-holeandtechnicalhole.Thehole-positionandhole-diametermustbeconsistentwithdrawingrequirement.B冲/钻板方向为从铜面到铝面，可有效防止铝面擦花；Punching/drillingdirectionisfromCusurfacetoAlsurface,whichcaneffectivelyavoidscratchesofAlsurface.3.3图形转移ImageTransferA磨板Scrubbinga为提高干膜和保护膜面的结合力，防止保护膜面干膜脱落，可轻磨保护膜面；Inordertoimprovethecombinationofdryfilm&protectivefilmandtoavoidfallingoffdryfilmontheprotectivefilm,itisnecessarytolightlyscrubthesurfaceofprotectivefilm.b不允许有板面氧化和胶渍现象。Oxidationandleftgluestainsontheboardsurfacecannotbeallowed.B贴膜FilmPastinga干膜种类：AQ-5038；Dryfilmtype:AQ-5038b预烘和贴膜时间间隔要尽量短。Theintervalbetweenpre-cureandfilm-pastingtimeshouldbeasshortaspossible.C静置冷却PlacingandCooling为了对位的准确，须将已贴膜的铝基板静置冷却至室温。Inordertoassureaccurateregistration,itisnecessarytoplacealuminousboardwithpastedfilmforawhileuntilitreachesroomtemperature.D曝光Exposinga负片黄菲林；NegativeYellowFilmb注意丝印孔对位的准确性。Payattentiontotheregistrationaccuracyofsilk-screeninghole.E静置Placing线路局部发生光聚反响,经15min左右充分聚合。Thelight-gatheringreactionhappensatthecircuitpartandreachesfullaggregationafter15minutes.景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第9页共18页9of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDateF显影Developing3.4图形检查ImageCheckA检查重点在于开路、短路、缺口、显影不净等；Mainlycheckopencircuit,shortcircuit,gapanduncleandevelopingetc.B修板时不能用黑油笔，只能用黑油补；Blackoil-pencannotbeusedwhenmendingboardbutblackoil.3.5蚀刻EtchingA必须在首板试验合格方可批量生产；Itisobligatorytoconductmassproductionafterthefirstbatchofboardsisconfirmedtobequalified.B蚀刻放板时，线路面向下，同时关掉机器的上喷嘴；Putthecircuitsideadownwhenplacingboardsforetchingandturnoffthesprayingheadonthemachineatthesametime.C不允许有保护膜破损现象，如发现保护膜破损，则应先用皱纹胶贴好再过机蚀刻；Thedilapidationofprotectivefilmisnotallowedandiftheprotectivefilmisbroken,itshoulduseadhesivetapetomenditbeforeplacingboardsontheetchingmachine.D尽量控制一次蚀刻干净；Assureone-timecleanetchingaspossibleasitcan.E图形内任何地方的残铜或绝缘层上的垃圾都不允许用刀片来刮；UsingknifetoscrapeoffleftCuonanypartofthepatternorthedirtontheinsulatedlayerisnotallowed.3.6退膜/清洗Film-stripping/CleaningA退膜不能浸泡在退膜缸中，必须直接过机退膜，一次性退膜干净；B退膜过程中残留在板面的药水会影响铝基板成品的耐用程度，故需对剥膜后的铝基板进展有效的清洗；C退膜干净后的铝基板必须进展烘干处理前方可往下流程；D所有铝基板均不能进展手动蚀刻；E如有蚀刻不净的板子，可进展快速过机返蚀，蚀刻压力：0.1-0.5kg/cm2，蚀刻速度：景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第10页共18页10of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDate5000mm/min，但返蚀次数最多不可超过2次。3.7蚀刻检查EtchingCheckA绝缘层上的任何地方都不允许用刀片来刮；Usingknifetoscratchanypartoftheinsulatedlayerisnotallowed.B主要检查短路、缺口、开路，报废单元不能钻孔，只能用黑油笔打“╳〞；Mainlycheckshortcircuit,gap,opencircuit.Abandonedunitmustn’tbedrilledandcanonlybemarkedwith“X〞byblackoil-pen.3.8阻焊制作SolderMaskMakingA单面磨板〔线路面〕，不允许板面有氧化和胶渍现象；Single-sidescrubbing(circuitside).Oxidationandgluestainsontheboardsurfacearenotallowed.B待板子冷却至室温后印阻焊Printsoldermaskaftertheboardiscooledintoroomtemperature.C待铝基板冷却至室温后，方可对位曝光；RegisterandexposealuminousPCBafteritiscooledintoroomtemperature.a对位前应认真检查板面是否有感光油堆积及不均匀，如有且多则应及时返工；Beforeregistration,itisnecessarytoseriouslycheckifthesensitizationoilaccumulatesontheboardsurfaceorisuneven.Ifthereisalotofsensitizationoilontheboardsurface,itmustre-processsuchboardsintime.b对位时应注意菲林与板面MARK点的同心度；Duringregistration,itisnecessarytopayattentiontotheconcentricityofthefilmandmarkpoint.D曝光；ExposingE显影；DevelopingF检查：重点检查显影不净和绿油上焊盘；Check:MainlycheckuncleandevelopingandsoldermaskonthePAD.G无特殊要求的板在显影后须撕掉铝面保护膜，铝面不能有胶渍和保护膜残留；ItmustripofftheprotectivefilmontheAlsurfaceafterdevelopingforunspecializedboards.GluestainsandprotectivefilmleftoverontheAlsurfacearenotallowed.注：假设有特殊要求，则在显影后及全制程都不可撕掉铝面保护膜；景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第11页共18页11of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDateRemark:Ifthecustomerhasspecialrequirements,theprotectivefilmmustn’tberippedoffafterdevelopingevenduringthewholeproduction.H返洗绿油板返洗绿油前不能撕掉铝面保护膜，并检查有无破损，如有必须用皱纹胶纸贴好。Theprotectivefilmcannotberippedoffbeforewashingoffsoldermaskforre-processandshouldbecheckedifisbroken.Iftheprotectivefilmisbroken,itmustbemendedwithadhesivetape.I如下工序为打定位孔工序必须先固化阻焊后在送板下工序。3.9打定位孔Orientation-holePunchingA用层压打靶在做好的线路相应靶位图上打靶。Punchorientation-holeatcorrespondingpositionoftheboardwithfinishedcircuitsbylayer-pressingpunchingB孔位偏差≤0.075mm，孔径3.175mm。Thehole-positiontoleranceis≤0.075mmandthehole-diametertoleranceis3.175mm.3.10字符制作(根据MI要求而定)ComponentMarkMaking(basedontherequirementofMI)A每印一块工作板后都需认真自检，合格后再继续印刷，不合格板需分开及时返工；Conductself-checkforeveryprintedworkingboardandcontinueprintingwhenthepreviousoneisconfirmedtobequalified.Unqualifiedboardsmustbeseparatedfromqualifiedonesandbere-processedintime.B字符不允许有模糊、重影、残缺、渗油等现象；Componentmarkmustn’tbeambiguous,broken,oil-seepedorwithghostimage.3.11喷锡HALSA锡炉温度控制在240~26TheTin-oventemperatureiscontrolledwithin240~26B喷锡后要充分冷却前方可进展后处理；Conductpost-treatingwhentheboardisfullycooledafterHALS.C后处理的热水洗段要将板面充分清洗干净，防止板面哑色；Completelycleantheboardsurfaceatthehot-waterwashingsectionofthepost-treatingtoavoiddimcoloroftheboardsurface.3.12喷锡检查HALSCheck景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第12页共18页12of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDateA锡面平整，无锡堆、锡高等现象；TheTinsurfacemustbesmoothwithoutTin-pilingandhighTin.B所有焊点不允许有不上锡现象；AssureallsolderpointsarecoveredwithTin.CMARK点一定要平整，不允许锡面凸出或锡面不均匀；AllMARKpointsmustbesmooth.ItisnotallowedthattheTinsurfaceisprotrudedoruneven.D锡面颜色一致，光亮度要好，不允许有哑色；ThecolorofTinsurfacemustbeunifiedwithgoodbrightnessandnodimcolor.3.13单面磨板〔视客户要求而定〕Single-sideScrubbing(accordingtocustomer’srequirements)A磨板前要彻底洗机、换水，水洗缸不能含有任何酸液；Completelycleanthemachineandchangedirtywaterbeforescrubbingandtheremustbenoacidliquidinwashingtank.B磨刷使用毡辘，前磨刷为500#，后磨刷为800#，磨痕试验宽度为8~15mmUsingfelttackleforscrubbing.Thetypeofformerscrubbingbrushis500#andthelatteris800#.Thetestedwidthofscrubbingtraceiswithin8~15mmC磨板前要注意清洗烘干段行辘；Payattentiontocleaningtransportingtackleatthebakingsectionbeforescrubbing.D磨板时只使用一对上磨刷，线路面向下，注意下磨刷要关闭；Useapairofupperscrubbingbrushforscrubbing.Putthecircuitsideadownandturnoffthenetherscrubbingbrush.E铝面如有擦花，须用1000~1200#砂纸打磨平整后再磨板；IftherearescratchesontheAlsurface,itisnecessarytouse1000~1200#sandpapertosmooththeboardandthenconductscrubbing.F不能污染锡面，不能有哑色现象；TheTinsurfacemustn’tbepollutedandshouldn’thasdimcolor.G铝面磨板要均匀，不能有没磨到的地方；AllpartsoftheAlsurfacemustbescrubbedevenly.H在铝面、锡面检查合格后，铝面须贴透明专用保护薄膜；PastespecialcolorlessprotectivefilmontheAlsurfaceaftertheAlandTinsurfacesareconfirmedtobequalified.景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第13页共18页13of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDate3.14V-CUTA使用电脑V-CUT；Applycomputer-assistantV-CUT.B在V-CUT过程中不能撕掉或揭开胶纸，更不能用手去摸铝面；DuringthecourseofV-CUT,itmustn’tripofforuncoverthegummedpaperandtouchtheAlsurfacebyhand3.15成型MouldingA在冲压过程中全程都不能撕掉或揭开胶纸，更不能用手去摸铝面；Duringthewholeproduction,itmustn’tripofforuncoverthegummedpaperandtouchtheAlsurfacebyhand.B冲压过程要从铝面冲到线路面；Thepunching&pressingdirectionisfromAlsurfacetocircuitside.C铝面不能有明显的披锋；Theremustn’tbeobviousbursontheAlsurface.D不能被压伤，线路面不能有任何污染；Theboardmustn’tbebrokenwhenpressingandthecircuitsidemustn’tbepolluted.E不能有绝缘层脱落现象；Theinsulatedlayermustn’tbefallenoff.F外形及管位要符合设计的公差要求；Thetoleranceofoutlineandcontrollingpositionshouldbeconsistentwithdesignrequirement.G在冲压过程中要注意模具上、下模的清洁，任何的金属屑存在都会导致绝缘层的破坏，从而影响其电气性能；Payattentiontocleaningtheupperandnethermoldsduringpunching&pressingforanymetalcrumbmayresultinthedamageofinsulatedlayerandinfluencetheelectricalcapacityofPCB.3.16高压测试High-pressureTestA为了保证铝基板有足够的绝缘强度，需按客户要求100%作耐高压测试；InordertoassuresufficientinsulatedintensityforthealuminousPCB,thehigh-pressuretestmustbeoperatedaccordingtocustomer’srequirements.B耐压测试电压为1.65KV〔DC〕，漏电电流为2mA/PCS；Thepressureofhigh-pressuretestis1.65KV〔DC〕andthecreepagecurrentis2mA/PCS.景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第14页共18页14of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDateC耐压测试时如有漏电现象则需逐片测试，找出漏电单元；Ifthereiscreepageofhigh-pressuretest,itmusttestboardonebyonetofindoutthecreepageunit.D测试者要穿绝缘胶鞋，戴绝缘手套，以免中电；Testersmustwearinsulatedrubberovershoesandinsulatedglovestoavoidelectricalhurt.3.17OSPAOSP膜厚在要求范围内；TheOSPfilmthicknessmustbeintherequiredscope.BOSP膜均匀；TheOSPfilmshouldbeeven.C铝面不能变色及划伤。ThecolorofAlsurfacecannotbechangedandtheAlsurfacemustn’tbescratched.3.18FQC、FQA检查FQCandFQACheckA按以下铝基板品质标准结合客供标准进展检查ChecktheboardaccordingtothecombinationofaluminousPCBstandardbelowandcustomerstandard.B在检查过程中将铝面胶纸揭去，用白纸隔开存放；UncoverthegummedpaperontheAlsurfaceduringcheckingandseparatetheboardswithwhitepaper.C在检查过程中不能污染铝面和线路面；TheAlsurfaceandcircuitsidecannotbepollutedduringchecking.3.19包装入库Packing4.0品质标准〔客户有要求按客户要求〕QualityStandard(inaccordancewithcustomer’srequirementifthereisnecessity)线宽、线间距、焊盘变化±20%Toleranceoflinewidth,linegapandPAD±20%蚀刻系数≥1EtchingCoefficient≥1感光油厚度线路上25~50um，拐角处最小7.6umSensitivityoilthicknessOnthecircuit:25~50umAtthecorner:7.6um(minimum)感光油颜色均匀一致,但允许一定的轻微变化景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第15页共18页15of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDateSensitivityoilcolorUnifiedbutslightdifferenceisallowed铅锡焊剂厚度0.8~5umPb-Snsolderthickness0.8~5umOSP膜厚度0.3~0.6umOSPfilmthickness0.3~0.6um耐高压测试1.65KV〔DC〕High-pressuretest1.65KV〔DC〕翘曲度1.5%Twistingdegree1.5%图形面毛刺高度±0.13mmHeightofburonthepatternside±0.13mm孔径公差±0.08mmHole-diametertolerance±0.08mm外形公差±0.10mmCosmetictolerance±0.10mm锡面平整、无哑色、无锡高、锡堆现象，MARK点要平整、光亮;TheTinsurfaceshouldbesmoothwithnodimcolor,highTinorTinpiling.Markpointshouldbeevenandbright.铝面应平整、无残胶、氧化、水迹；TheAlsurfaceshouldbesmoothwithongluestains,oxidationorwaterstains.允许直径小于0.5mm，深0.1mm的凹坑2个；2notchesatmostwithdiameter<0.5mmanddepth<0.1mmcanbeaccepted.允许有短的划伤存在(未伤及基体)，长度小于40mm者数量少于5条；Shortnickscanbeaccepted(thenickhasn’thurtbasematerial).Thenumberofnickthatisshorterthan40mmisnomorethan5.划伤(伤及基体)数量不超过1条，长度不超过20mm，深度不超过0.001mm。Thenumberofnickthathurtsbasematerialisnomorethan1anditslengthisnomorethan20mm景旺电子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:铝基板生产作业指导书WorkingInstructionofAluminousPCBProduction文件类别：DocumentType文件编号：DocumentNo.TD-ALU-01页数：Page第16页共18页16of18pages作业指导书WorkingInstruction版本号：VersionNo.A生效日期：EffectiveDateanditsdepthisnomorethan0.001mm.5.0本卷须知Notice5.1各工序必须生产严格按要求操作；Allprocessesmustbestrictlyoperatedinaccordancewithrequirements.5.2生产全程中的运输，必须插猪笼架，或者垫纸或胶片隔开，防止擦花；Putboardsinthecage-shelforseparatethemwithpaperorplasticsheettoavoidscratchesduringtransportationofthewholeproduction.5.3喷锡后的铝基板不能接触任何酸液和水；ThealuminousboardcannottouchacidliquidorwaterafterHALS.5.4生产全程中，任何工序都不能用刀片刮绝缘层；Usingknifetoscratchinsulatedlayerinanyprocessisnotallowedduringthewholeproduction.5.5对于报废板，不能在基材上钻孔，只能用黑油笔打“╳〞；Forabandonedboards,thebasematerialcannotbedrilledbutisonlymarkedwith“╳〞byoil-pen.5.6图形检查要做到全检，任何图形问题在蚀刻后都无法返工；5.7外发工序要严格按照我公司标准进展来料全检；Conduct100%IQCcheckforallout-sourcingboardsaccordingtoourcompany’sstandard.5.8成品锡面哑色、铝面擦花等缺陷板集中起来，统一返工；Gatheralldefectiveboardstogether(suchasdimcolor&scratchesoftheAlsurface)tobere-processed.5.9生产中如有问题，要及时反响给相关工艺人员来解决。Foranyproblemduringproduction,itmustbeinformedtorelatedtechnicalstaffintimetobe