SMT 元件贴装-福英达

深圳市福英达工业技术有限公司/一站式锡膏解决方案供应商SMTComponentPlacement_Fitech'sSMDSolderPasteAfterdecadesofdevelopment,surfacemounttechnology(SMT)hasbecomeincreasinglymature.Itiswellknownthatthenumberanddensityofcomponentsonanelectronicdevicehaveincreaseddramaticallycomparedwiththepast.Ifmanualmountingisstillmassivelyused,theefficiencyofassemblingcomponentsonPCBsisslow,andtheaccuracyiscompromised.Therefore,personnelintheindustrydevelopedSMTplacementmachines.Theworkingefficiencyoftheplacementmachineismuchfasterthanmanualwork.Oneplacementmachinecancompletetheassemblyoftensofthousandsofcomponentsperhour.ItcanbesaidthatSMTplacementmachineshavebecomeessentialequipmentforSMTmanufacturers.

IntroductionoftheSMTplacementmachinesSMTplacementmachineshavealwaysbeenahottopicintheindustry.Fromtheobservation,mainstreammanufacturersusethepick-and-placemachineandcollect-and-placemachine.Thesetwotypesofplacementmachinesareverysimilar,buttheplacementheadsareslightlydifferent.Thecomponentsareplacedinthefeeder.Theplacementheadofthepickandplacemachinepicksupacomponentandplacesitonaspecificpresetsolderpastepoint.Thecollectandplaceplacementheadisequippedwithmultiplenozzles,whichgrabandplacemultiplecomponentsatspecificsolderpastepoints.ThecollectandplaceplacementheadcollectsthecomponentsthroughrotarymotionandplacesthemonthePCBsinsequence.Theplacementspeedismorerapid,butthereisalsoagreaterpossibilityofpositiondeviation.

Figure1.Asimplepickandplacemountingheadstructure.

Figure2.Collectandplacemountingstructure.

Theplacementheadsrealizethefunctionofthecomponentcollectionbyvacuumeffect.Thenozzleoftheplacementheadisusuallyequippedwithalaserbeamoranopticalcamera,whichcanmeasureandalignthepositionofthesolderpastepoint.Finally,accordingtothesetplacementparameters(generalcategoryandsizeofcomponents,PCBparameters,etc.),themountingheadrotatestoplacecomponents.

NotesforSMTplacementTheplacementmachinecanpickupthecomponentsfromstorageplaces(suchaspapertapesandplastictrays).Itshouldbenotedthatthecomponentsshouldbekeptawayfromstaticelectricity.Thecomponentpickupisrealizedbyvacuumnozzles,whichhavetheadvantagetoavoidstaticelectricityandensurethecurrentstabilityaftersoldering.

Thenozzleperformanceneedstobemonitored.Whenthenozzlecannotfulfillanewlycompletedplacementcycle,itneedstobereplaced.Ittakesalongtimetochangeandadjustthenozzleafterreplacement.Therefore,frequentreplacementisnotrecommended.Inaddition,componentsclosetoeachotheronthePCBsshouldbegroupedtogethertominimizethemovementdistanceoftheplacementheads.

BeforeSMDplacement,itisnecessarytoensurethatsufficientsolderpasteisevenlyprintedonthepads.Sincetheassemblycomponentsareplacedontothedepositedsolderpastebytheautomaticplacementmachines,theheightandwidthofthesolderpastehaveimpactsonthealignmentofthenozzlesoftheplacementmachines.Theimpropersolderpastevolumeandpoorsolderdistributionuniformitycanleadtomisalignmentoftheplacementhead,whichiseasytocausethetombstoneproblem.Besides,itisalsoimportanttoselectanappropriateprintingsolderpasteformulationbecausethetackinesseffectandthewettabilityofthesolderpasteaftertheplacementarerelatedtothesolderpasteformulations.

IfyouhaveanyquestionsaboutthesolderpasteforSMTcomponentsoldering,pleasecontactFitechatanytime.Fitechhasrichexperienceintheproductionandapplicationofsolderpaste,anditsultra-finesolderpast