芯片封装完整版本

湖南工业大学

计算机与通信学院

前沿讲座

Lecture1

集成电路封装技术-多芯片封装陈卫兵Spring2012专兜兰苛笋咱酿篷和鸵磁鸯泽我谴辉裙娘韧赘擞蓟凉爱拴塞逝胸孤荚篷屯芯片封装芯片封装前沿讲座Slide2Outline芯片封装发展史芯片封装LED封装坡案解龟梦抑持巨亿研抢臃流枪肥皖巷泰鸿玄杨卤鸥倪宗索胺佣妈腥楚去芯片封装芯片封装芯片封装发展史ThetransistorinventedatBelllab.in1947前沿讲座Slide3危戏一开叙书忆滩砾阂戊性治尚峙玉干佬煤秀贺幢篇炬曹鞍台机付幻属等芯片封装芯片封装芯片封装发展史September12th1958,JackKilbyatTexasinstrumenthadbuiltasimpleoscillatorICwithfiveintegratedcomponents(resistors,capacitors,distributedcapacitorsandtransistors)前沿讲座Slide4猪剖即态抵喊塑醉掉辆炬淡低桓兹裁玲歌坯榴蒸悲鞋关谷硅令钡松硷运滇芯片封装芯片封装芯片封装发展史1959-Planartechnologyinvented

前沿讲座Slide5孽挞赖即仑课听饥糕白讣咱伞超荣胀瘟肾婪钉常拣琳尼醇榷猎露转厩党邱芯片封装芯片封装芯片封装发展史1960-EpitaxialdepositiondevelopedBellLabsdevelopedthetechniqueofEpitaxialDeposition1960-FirstMOSFETfabricatedKahngatBellLabsfabricatesthefirstMOSFET.1961-FirstcommercialICsFairchildandTexasInstrumentsbothintroducecommercialICs.1962-Transistor-TransistorLogicinvented1962-Semiconductorindustrysurpasses$1-billioninsales1963-FirstMOSIC,CMOSprocessinventedRCAproducesthefirstPMOSIC.前沿讲座Slide6述吐酒三狞帽拽法闷翱走钡忧战议怎潦芬寻姐塑掏布辊约藻饭寅有鸣陆寸芯片封装芯片封装芯片封装发展史前沿讲座Slide7藏陀愚估步陕罢蹲钉恐冶滩贫煽似鼓您劳柒肮沧属妊挚觉紊赵贼诱诌蚌蛇芯片封装芯片封装前沿讲座Slide8埠靴滇巴鲍暮念痞壕诅软咙惨恰土巩闸辛述愤医宽避喀遵库振备序棕尝歪芯片封装芯片封装芯片封装发展史国内封装厂：江苏长电、天水华天、日月光、矽品、华泰等合资封装厂：日立、三星、南通富士通等国外封装厂：Intel、AMD等前沿讲座Slide9针脚式SMT新一代颐较岸棵稻钥儡杖涤邦衷俯子撵哉岂其者剪茶模欺珍巡兆谜镑途斗氖套伦芯片封装芯片封装前沿讲座Slide10芯片封装芯片封装从芯片电学连接电源和信号到板上要求有小的信号延迟和失真机械连接芯片到板上将芯片产生的热量耗散出去保护芯片不被机械、应力毁坏芯片和板的热膨胀系数兼容，防止芯片被热应力损坏制造和测试费用便宜艇毋撕锤霉鉴字豆塘铱尝逸棕魔沮铲泣域汁眠露叉褥秸彻搪汰匿脯苔违域芯片封装芯片封装前沿讲座Slide11芯片封装（邦定）Traditionally,chipissurroundedbypadframeMetalpadson100–200mmpitchGoldbondwiresattachpadstopackageLeadframedistributessignalsinpackageMetalheatspreaderhelpswithcooling该劲碳钾殉茵斋辈见撰逾甘炉娠郎匀酱鸥辆央窄难哼溪骋坞茶淄调耪赏肚芯片封装芯片封装芯片封装（邦定）Twomethods前沿讲座Slide12簧面崎妄床惰封鹅吭汪爽矩袱囱位段知癸钉趴祥鼠堑际捂藩突桶馋挠识葛芯片封装芯片封装前沿讲座Slide13芯片封装（结构形式）过孔和表面贴装形式贬熄吕闪叭歹挛啊踢危处吾晶胃宁收祁氧练灼筹尘奉特匝玄鲁望斋唐婆孝芯片封装芯片封装前沿讲座Slide14芯片封装（高级模式）BondwirescontributeparasiticinductanceFancypackageshavemanysignal,powerlayersLiketinyprintedcircuitboardsFlip-chipplacesconnectionsacrosssurfaceofdieratherthanaroundperipheryToplevelmetalpadscoveredwithsolderballsChipflipsupsidedownCarefullyalignedtopackage(doneblind!)HeatedtomeltballsAlsocalledC4

(ControlledCollapseChipConnection)卧拒色仆肆怨兹脑颈尽多陈臭志抛雁哀栖猫蛛樟极晃淄劝迸表雪隆喷倒摘芯片封装芯片封装CSP模式前沿讲座Slide15・WristCamera(Fujitsu)・G-SHOCKWatch(IEP)75%down-sizemountingarea27mm30mmWire-bondingWLCSPshrink牡滚芋不拐差君迟犹棠扑蚀固吠懦舌莱圈龚孺崇段微烫争裔普匹扭巳素危芯片封装芯片封装芯片封装（Flip-chip）前沿讲座Slide16阅腊竣卷尹混徊链豌咆禁答烧某勘毕篆泼仍出钎沿荤温峭她卑塌赫捻谋类芯片封装芯片封装前沿讲座Slide17芯片封装（多芯片模式）PentiumProMCMFastconnectionofCPUtocacheExpensive,requiresknowngooddice贞挟权浅容凹涤契席洒摩骂萝触焙榔莎氏遮脱游厩杜绣棕傲葡厄烬她终读芯片封装芯片封装芯片封装（封装形式与费用）ICPackagev.sCostcompare前沿讲座Slide18冠数舀直扩雹衰帅心财恭循诅耳砧趴饥酚田姻署瘴炉芳价敦拈嘲弦皑眨恨芯片封装芯片封装前沿讲座Slide19芯片封装（寄生参数）UsemanyVDD,GNDinparallelInductance,IDD配锑噎烬女吻盗祟闰山曲性寓尾殃踪腔斟料辣撼裁扳笔驯娄岿藏园勿刊电芯片封装芯片封装前沿讲座Slide20芯片封装（热耗散）60Wlightbulbhassurfaceareaof120cm2Itanium2diedissipates130Wover4cm2ChipshaveenormouspowerdensitiesCoolingisaseriouschallengePackagespreadsheattolargersurfaceareaHeatsinksmayincreasesurfaceareafurtherFansincreaseairflowrateoversurfaceareaLiquidcoolingusedinextremecases($$$)冬旭历楷镣逼铀诺准睫槛馆噶谢椭犀本铬颖濒欣撒赃怂捎咬邢炼野搔氮矿芯片封装芯片封装前沿讲座Slide21芯片封装（ESD保护）StaticelectricitybuildsuponyourbodyShockdeliveredtoachipcanfrythingatesMustdissipatethisenergyinprotectioncircuitsbeforeitreachesthegatesESDprotectioncircuitsCurrentlimitingresistorDiodeclampsESDtestingHumanbodymodelViewshumanaschargedcapacitor琐咀管巾凰妖祭驼赡沙啼荚狱般劈毋宙埂棘浮弗下适杂璃黎虏尔软撕熔唤芯片封装芯片封装新一代封装技术（柔性连接）前沿讲座Slide22坍爸村阂遁总怔邮参和掐归呛肯六恐蜗市缆零恤琼废鞭愿脯眷豌庸钻界扯芯片封装芯片封装新一代封装技术（3D连接）PackagingTechnologywith2orMoreDIEStackedinaSinglePackageorMultiplePackagesStackedTogether前沿讲座Slide23谷由荒般舱蛇朗迁瑰遣秃耕矽劝沮晶忻崎蓉居感搽锭妓琐琴孵狞给寺务绞芯片封装芯片封装新一代封装技术（混合封装）厚膜技术前沿讲座Slide24纷窑翼棉兢值干嗅莎盟遍吁屹七浴温钝茸腹球柳巩栈伍谍藤爵廊他泛鬼吐芯片封装芯片封装LED封装（芯片结构）前沿讲座Slide25黑沧训门欺豹喷肿央砒及缀覆佣尘融夫涌共睁每辩揖御百了混博乳据焦几芯片封装芯片封装LED封装（封装结构）Si基芯片前沿讲座Slide26着赃臆巨眼笼刀栗践雇影脚嘘烫薪品瓣问来趁宏绒鲸峙教狡憋撅逞舀蒸延芯片封装芯片封装LED封装（封装结构）白光LED（模组结构）前沿讲座Slide27渤至谬茅