PCB制作流程动画.ppt

1、,PCB,2020/7/3,P2/26,( 1 ) 前 製 程 治 工 具 製 作 流 程,2020/7/3,P3/26,MLB,DOUBLE SIDE,Blinded Via (HDI BOARD),內層埋孔 (Buried Via),多次埋孔 (Multiple Buried Via),( 2 ) 多 層 板 內 層 製 作 流 程,2020/7/3,P4/26,( 3 ) 外 層 製 作 流 程,2020/7/3,P5/26,For O. S. P.,For O. S. P.+ E-less Ni/Au,( 4 ) 表 面 處 理 及 成 型 製 作 流 程,2020/7/3,P6/26

2、,Mar. 02 , 2000,編 輯 人 : 徐 振 連,印刷電路板流程介紹(TENTING),印刷電路板流程介紹(TENTING),2020/7/3,P7/26,0.發料 (Material Issue),48“,36“,Raw Material : Sheet Size,Cutting Machine (Raw Material),40”,42“,FR-4: 玻璃纖維+環氧樹脂,2020/7/3,P8/26,1.下料裁板 (Material Issue),2020/7/3,P9/26,2.內層板壓乾膜 (Dry Film Lamination),2020/7/3,P10/26,3.曝光

3、(Exposure),2020/7/3,P11/26,4.曝光後(After Exposure),2020/7/3,P12/26,5.內層板顯影 (Develop),2020/7/3,P13/26,6.酸性蝕刻(Power/Ground/Signal)(Etch),2020/7/3,P14/26,7.去乾膜 (Dry Film Strip),2020/7/3,P15/26,8.黑化 (Black Oxide) Bondfilm,2020/7/3,P16/26,9.壓合 (Lamination),2020/7/3,P17/26,10.鑽孔(P.T.H.或盲孔Via) (Drill & Debur

4、r),2020/7/3,P18/26,11.電鍍(Copper Plating) PTH,2020/7/3,P19/26,12.外層壓膜(D/F Photo Resist Coat),2020/7/3,P20/26,13.外層曝光 (Exposure),2020/7/3,P21/26,14.外層顯影 (Develop),2020/7/3,P22/26,15.線路蝕刻(酸性蝕刻) (Etch),2020/7/3,P23/26,16.去乾膜 (Strip Resist),2020/7/3,P24/26,17.噴塗(液狀綠漆) (Spray Coating),2020/7/3,P25/26,2020

5、/7/3,P26/26,2020/7/3,P27/26,19.印文字 (Legend Printing),UMT 94V-0,R105,2020/7/3,P28/26,20.噴錫 (浸金 )(Immersion gold ,HAL,),2020/7/3,P29/26,21.成型 (Profile),2020/7/3,P30/26,22.測試 (Electrical Testing),Flying Probe Tester,2020/7/3,P31/26,23.終檢 (Final Inspection),2020/7/3,P32/26,24.O.S.P.(Entek Plus Cu-106A.)

6、 Optional,2020/7/3,P33/26,25.包裝(Packing & Shipping),2020/7/3,P34/26,Mar. 02 , 2000,編 輯 人 : 徐 振 連,印刷電路板流程介紹(PATTERN),印刷電路板流程介紹(PATTERN),2020/7/3,P35/26,0.發料 (Material Issue),48“,36“,Raw Material : Sheet Size,Cutting Machine (Raw Material),40”,42“,FR-4: 玻璃纖維+環氧樹脂,2020/7/3,P36/26,0.發料 (Material Issue),

7、2020/7/3,P37/26,1.下料裁板 (Material Issue),2020/7/3,P38/26,2.內層板壓乾膜 (Dry Film Lamination),2020/7/3,P39/26,3.曝光 (Exposure),2020/7/3,P40/26,4.曝光後(After Exposure),2020/7/3,P41/26,5.內層板顯影 (Develop),2020/7/3,P42/26,6.酸性蝕刻(Power/Ground/Signal)(Etch),2020/7/3,P43/26,7.去乾膜 (Dry Film Strip),2020/7/3,P44/26,8.黑化

8、 (Black Oxide) Bondfilm,2020/7/3,P45/26,9.壓合 (Lamination),2020/7/3,P46/26,10.鑽孔(P.T.H.或盲孔Via) (Drill & Deburr),2020/7/3,P47/26,11.電鍍(Copper Plating) PTH,2020/7/3,P48/26,12.外層壓膜(D/F Photo Resist Coat),2020/7/3,P49/26,13.外層曝光 (Exposure),2020/7/3,P50/26,14.外層曝光後 (After Exposure),2020/7/3,P51/26,15.外層顯影

9、 (Developing),2020/7/3,P52/26,16.二次銅電鍍及錫鉛 (II cu & sn/pb plating),2020/7/3,P53/26,17.乾膜去除 (D/F stripping),2020/7/3,P54/26,18.蝕銅 (Etching),2020/7/3,P55/26,19.去錫鉛 (sn/pb Stripping),2020/7/3,P56/26,20.噴塗(液狀綠漆) (Spray Coating),2020/7/3,P57/26,2020/7/3,P58/26,2020/7/3,P59/26,22.印文字 (Legend Printing),94V-0,R105,2020/7/3,P60/26,23.噴錫 (浸金 )(Immersion gold ,HAL,),2020/7/3,P61/26,24.成型 (Profile),2020/7/3,P62/26,25.測試 (Electrical Testing),Flying Probe Tester,2020/7/3,P63/26,26.終檢 (Final Inspection),2020/7/3,P64/26,27.O.S.P.(Entek